Abstract: In a method of generating a design of a cooling system for an electric motor according to a cooling system specification, a design for an evaporative cooling jacket for the electric motor is generated. The design is modelled by executing the following steps employing a computer program stored on a digital computer including a non-transitory computer readable storage medium. An electromagnetic model of the design for simulating electromagnetic parameters in the electric motor and the cooling system is generated. A motor heat transfer model of the design for determining heat transfer in the electric motor is generated. An evaporative heat transfer model for simulating heat transfer in the cooling system due to evaporative cooling is generated. A contact resistance model of the design to determine contact resistance between a rotor lamination-magnet, a winding-slot liner, a slot liner-stator lamination, and a stator lamination-housing is generated.

Abstract: A cooling system for an electric motor that includes a stator having a plurality of slot windings and a rotor, coaxial with the stator, having a plurality of magnets, includes a coolant inlet to the motor and a coolant outlet from the motor. A coolant pathway is in fluid communication with the inlet and the outlet. Heat is transferable from the slot windings to the coolant pathway. A coolant flows through the coolant pathway and is in a liquid phase as it enters the coolant inlet, changing into a gaseous phase as heat is transferred to the coolant from the slot windings. A cooling loop is in fluid communication with the coolant inlet and the coolant outlet. The cooling loop cools the coolant so that substantially all of the coolant is in the liquid phase when it enters the coolant inlet.

Abstract: A cooling system for a microchip or other component is described, including, in one embodiment: (1) a cold plate assembly positioned adjacent (e.g., in contact with) the component to be cooled; (2) at least one heat exchanger; (3) a fan for directing gas adjacent (e.g., through) a portion of the heat exchanger; and (4) a pump for circulating cooling fluid through a closed circuit including the cold plate and heat exchanger. The cold plate may include guide fins that define macrochannels and microchannels that serve as conduits for the cooling fluid. The fins and channels in one embodiment are shaped to substantially match the heat map profile of the chip or component to be cooled. The heat exchanger in one embodiment includes a reservoir in its base which may cooperate with a recess or channel in a support plate to form an additional cooling fluid flow passage.