Abstract: A bi-directional fan device that is field replaceable within an electronic system is provided. The bi-directional fan device includes a fan unit that cools an electronic system when connected to a power source, and an electrical connector constructed at both ends of the fan unit to electrically connect to the power source.

Abstract: The present invention relates to a bi-directional fan device which is field replaceable within an electronic system, comprising: a fan unit configured to cool an electronic system when connected to a power source; and an electrical connector constructed at both ends of the fan unit to electrically connect to the power source.

Abstract: One embodiment includes a method for manufacturing an electronic apparatus, including bonding an integrated circuit (IC) die to a substrate to form an IC package using a first reflow process, which causes the substrate to warp, reversibly connecting a lid with the IC package over the IC die so that the lid applies a force to the IC die, providing a printed circuit board (PCB) including an array of first contact pads, respectively disposing an array of bonding elements on an array of second contact pads of the substrate, placing the IC package on to the PCB with respective ones of the bonding elements contacting respective ones of the first contact pads, performing a second reflow process to apply heat to the bonding elements to bond the first contact pads with the second contact pads, and removing the lid from the IC package after the second reflow process.