Patents by Inventor Yohei Oka

Yohei Oka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11927125
    Abstract: A prediction device that predicts time for a reducing agent accommodated in a container mounted on a work vehicle to freeze includes a remaining amount information acquisition unit configured to acquire remaining amount information indicating a remaining amount of the reducing agent in the container, a wall surface temperature acquisition unit configured to acquire a detection result of a wall surface temperature of the container, a reducing agent temperature acquisition unit configured to acquire a detection result of a temperature of the reducing agent, and a time calculation unit configured to calculate the time for the reducing agent to freeze based on the wall surface temperature, the reducing agent temperature, and the remaining amount information.
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: March 12, 2024
    Assignee: Komatsu Ltd.
    Inventors: Akira Oka, Tatsuya Yamakawa, Yohei Nishikawa
  • Publication number: 20220178832
    Abstract: The present invention shortens measurement time of a sample and improves measurement accuracy. The present invention is a biological sample analysis device that stores a sample containing a biological substance and a luminescent reagent in a container, detects luminescence generated by reacting the sample and the luminescent reagent, and analyzes the biological substance, the present invention including a photodetector that detects the luminescence and outputs a light intensity signal, and a calculator that subtracts the light intensity signal obtained before the sample and the luminescent reagent react from the light intensity signal obtained after the sample and the luminescent reagent react to remove light stored in the container, and calculates a value related to an amount of the biological substance.
    Type: Application
    Filed: May 15, 2020
    Publication date: June 9, 2022
    Inventors: Hideki NAKAYAMA, Yoshiki FUKAO, Masanori KIDO, Yoko NAKAI, Yohei OKA
  • Publication number: 20220026330
    Abstract: A complex particle measurement apparatus comprising a first light source that irradiates a first storage cell; a photodetector that detects intensity of light; a second light source that irradiates a second storage cell; an imaging unit that images a particle group; an image data output unit that outputs image data; a supporter that supports the first storage cell and the second storage cell; and a communication pipe that connects the first storage cell and the second storage cell to pass a sample solution, wherein the first storage cell and the second storage cell have bottom surfaces located at positions different from each other, and the communication pipe is laid such that a channel from the first storage cell to the second storage cell has an incline of not less than 0 or not more than 0.
    Type: Application
    Filed: October 15, 2019
    Publication date: January 27, 2022
    Inventors: Hisashi AKIYAMA, Yasuhiro TATEWAKI, Yohei OKA, Takeshi AKAMATSU, Makoto NAGURA, Takashi KIMBA
  • Patent number: 11185924
    Abstract: A metal powder for additive manufacturing includes: not less than 0.2 mass % and not more than 1.3 mass % of aluminum; and a balance including copper and an incidental impurity.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: November 30, 2021
    Assignees: DAIHEN CORPORATION, FUKUDA METAL FOIL & POWDER CO., LTD.
    Inventors: Ryusuke Tsubota, Junichi Tanaka, Yohei Oka, Akira Okamoto, Masato Kikukawa, Hiroaki Okubo, Yoshito Nishizawa, Takeshi Maruyama, Motonori Nishida
  • Patent number: 11077495
    Abstract: A metal powder contains not less than 0.10 mass % and not more than 1.00 mass % of at least one of chromium and silicon, and a balance of copper. The total content of the chromium and the silicon is not more than 1.00 mass %. In accordance with an additive manufacturing method for this metal powder, an additively-manufactured article made from a copper alloy is provided. The additively-manufactured article has both an adequate mechanical strength and an adequate electrical conductivity.
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: August 3, 2021
    Assignees: DAIHEN CORPORATION, Osaka Research Institute of Industrial Science and Technology
    Inventors: Ryusuke Tsubota, Junichi Tanaka, Yohei Oka, Takayuki Nakamoto, Takahiro Sugahara, Mamoru Takemura, Sohei Uchida
  • Publication number: 20210187614
    Abstract: A copper alloy powder is a copper alloy powder for additive manufacturing. The copper alloy powder contains more than 1.00 mass % and not more than 2.80 mass % of chromium, and a balance of copper. A method for producing an additively-manufactured article includes a first step of preparing a copper alloy powder containing more than 1.00 mass % and not more than 2.80 mass % of chromium and a balance of copper and a second step of producing the additively-manufactured article from the copper alloy powder, and the additively-manufactured article is produced such that forming a powder layer including the copper alloy powder, and solidifying the copper alloy powder at a predetermined position in the powder layer to form a shaped layer are sequentially repeated to stack such shaped layers to thus produce the additively-manufactured article.
    Type: Application
    Filed: March 4, 2021
    Publication date: June 24, 2021
    Applicants: DAIHEN CORPORATION, Osaka Research Institute of Industrial Science and Technology
    Inventors: Ryusuke TSUBOTA, Yohei OKA, Akira OKAMOTO, Takayuki NAKAMOTO, Takahiro SUGAHARA, Naruaki SHINOMIYA, Mamoru TAKEMURA, Sohei UCHIDA
  • Patent number: 10981226
    Abstract: A copper alloy powder is a copper alloy powder for additive manufacturing. The copper alloy powder contains more than 1.00 mass % and not more than 2.80 mass % of chromium, and a balance of copper. A method for producing an additively-manufactured article includes a first step of preparing a copper alloy powder containing more than 1.00 mass % and not more than 2.80 mass % of chromium and a balance of copper and a second step of producing the additively-manufactured article from the copper alloy powder, and the additively-manufactured article is produced such that forming a powder layer including the copper alloy powder, and solidifying the copper alloy powder at a predetermined position in the powder layer to form a shaped layer are sequentially repeated to stack such shaped layers to thus produce the additively-manufactured article.
    Type: Grant
    Filed: October 24, 2017
    Date of Patent: April 20, 2021
    Assignees: DAIHEN CORPORATION, Osaka Research Institute of Industrial Science and Technology
    Inventors: Ryusuke Tsubota, Yohei Oka, Akira Okamoto, Takayuki Nakamoto, Takahiro Sugahara, Naruaki Shinomiya, Mamoru Takemura, Sohei Uchida
  • Patent number: 10967431
    Abstract: A metal powder for additive manufacturing includes: not less than 0.2 mass % and not more than 1.3 mass % of aluminum; and a balance including copper and an incidental impurity.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: April 6, 2021
    Assignees: DAIHEN CORPORATION, FUKUDA METAL FOIL & POWDER CO., LTD.
    Inventors: Ryusuke Tsubota, Junichi Tanaka, Yohei Oka, Akira Okamoto, Masato Kikukawa, Hiroaki Okubo, Yoshito Nishizawa, Takeshi Maruyama, Motonori Nishida
  • Patent number: 10843260
    Abstract: A metal powder contains not less than 0.10 mass % and not more than 1.00 mass % of at least one of chromium and silicon, and a balance of copper. The total content of the chromium and the silicon is not more than 1.00 mass %. In accordance with an additive manufacturing method for this metal powder, an additively-manufactured article made from a copper alloy is provided. The additively-manufactured article has both an adequate mechanical strength and an adequate electrical conductivity.
    Type: Grant
    Filed: May 11, 2016
    Date of Patent: November 24, 2020
    Assignees: DAIHEN CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Ryusuke Tsubota, Jyunichi Tanaka, Yohei Oka, Takayuki Nakamoto, Takahiro Sugahara, Mamoru Takemura, Sohei Uchida
  • Patent number: 10421122
    Abstract: A metal powder contains not less than 0.10 mass % and not more than 1.00 mass % of at least one of chromium and silicon, and a balance of copper. The total content of the chromium and the silicon is not more than 1.00 mass %. In accordance with an additive manufacturing method for this metal powder, an additively-manufactured article made from a copper alloy is provided. The additively-manufactured article has both an adequate mechanical strength and an adequate electrical conductivity.
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: September 24, 2019
    Assignees: DAIHEN CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Ryusuke Tsubota, Junichi Tanaka, Yohei Oka, Takayuki Nakamoto, Takahiro Sugahara, Mamoru Takemura, Sohei Uchida
  • Publication number: 20190168303
    Abstract: A metal powder for additive manufacturing includes: not less than 0.2 mass % and not more than 1.3 mass % of aluminum; and a balance including copper and an incidental impurity.
    Type: Application
    Filed: February 6, 2019
    Publication date: June 6, 2019
    Applicants: DAIHEN CORPORATION, FUKUDA METAL FOIL & POWDER CO., LTD.
    Inventors: Ryusuke TSUBOTA, Junichi TANAKA, Yohei OKA, Akira OKAMOTO, Masato KIKUKAWA, Hiroaki OKUBO, Yoshito NISHIZAWA, Takeshi MARUYAMA, Motonori NISHIDA
  • Publication number: 20190168302
    Abstract: A metal powder for additive manufacturing includes: not less than 0.2 mass % and not more than 1.3 mass % of aluminum; and a balance including copper and an incidental impurity.
    Type: Application
    Filed: February 6, 2019
    Publication date: June 6, 2019
    Applicants: Daihen Corporation, Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Ryusuke Tsubota, Junichi Tanaka, Yohei Oka, Akira Okamoto, Masato Kikukawa, Hiroaki Okubo, Yoshito Nishizawa, Takeshi Maruyama, Motonori Nishida
  • Publication number: 20180111199
    Abstract: A copper alloy powder is a copper alloy powder for additive manufacturing. The copper alloy powder contains more than 1.00 mass % and not more than 2.80 mass % of chromium, and a balance of copper. A method for producing an additively-manufactured article includes a first step of preparing a copper alloy powder containing more than 1.00 mass % and not more than 2.80 mass % of chromium and a balance of copper and a second step of producing the additively-manufactured article from the copper alloy powder, and the additively-manufactured article is produced such that forming a powder layer including the copper alloy powder, and solidifying the copper alloy powder at a predetermined position in the powder layer to form a shaped layer are sequentially repeated to stack such shaped layers to thus produce the additively-manufactured article.
    Type: Application
    Filed: October 24, 2017
    Publication date: April 26, 2018
    Applicants: DAIHEN Corporation, Osaka Research Institute of Industrial Science and Technology
    Inventors: Ryusuke TSUBOTA, Yohei OKA, Akira OKAMOTO, Takayuki NAKAMOTO, Takahiro SUGAHARA, Naruaki SHINOMIYA, Mamoru TAKEMURA, Sohei UCHIDA
  • Publication number: 20170333987
    Abstract: A metal powder contains not less than 0.10 mass % and not more than 1.00 mass % of at least one of chromium and silicon, and a balance of copper. The total content of the chromium and the silicon is not more than 1.00 mass %. In accordance with an additive manufacturing method for this metal powder, an additively-manufactured article made from a copper alloy is provided. The additively-manufactured article has both an adequate mechanical strength and an adequate electrical conductivity.
    Type: Application
    Filed: July 24, 2017
    Publication date: November 23, 2017
    Applicants: DAIHEN CORPORATION, TECHNOLOGY RESEARCH INSTITUTE OF OSAKA PREFECTURE
    Inventors: Ryusuke TSUBOTA, Junichi TANAKA, Yohei OKA, Takayuki NAKAMOTO, Takahiro SUGAHARA, Mamoru TAKEMURA, Sohei UCHIDA
  • Publication number: 20170320134
    Abstract: A metal powder contains not less than 0.10 mass % and not more than 1.00 mass % of at least one of chromium and silicon, and a balance of copper. The total content of the chromium and the silicon is not more than 1.00 mass %. In accordance with an additive manufacturing method for this metal powder, an additively-manufactured article made from a copper alloy is provided. The additively-manufactured article has both an adequate mechanical strength and an adequate electrical conductivity.
    Type: Application
    Filed: July 24, 2017
    Publication date: November 9, 2017
    Applicants: DAIHEN CORPORATION, TECHNOLOGY RESEARCH INSTITUTE OF OSAKA PREFECTURE
    Inventors: Ryusuke TSUBOTA, Junichi TANAKA, Yohei OKA, Takayuki NAKAMOTO, Takahiro SUGAHARA, Mamoru TAKEMURA, Sohei UCHIDA
  • Publication number: 20170182557
    Abstract: A metal powder for additive manufacturing includes: not less than 0.2 mass % and not more than 1.3 mass % of aluminum; and a balance including copper and an incidental impurity.
    Type: Application
    Filed: December 15, 2016
    Publication date: June 29, 2017
    Applicants: DAIHEN CORPORATION, FUKUDA METAL FOIL & POWDER CO., LTD.
    Inventors: Ryusuke TSUBOTA, Junichi TANAKA, Yohei OKA, Akira OKAMOTO, Masato KIKUKAWA, Hiroaki OKUBO, Yoshito NISHIZAWA, Takeshi MARUYAMA, Motonori NISHIDA
  • Publication number: 20160332227
    Abstract: A metal powder contains not less than 0.10 mass % and not more than 1.00 mass % of at least one of chromium and silicon, and a balance of copper. The total content of the chromium and the silicon is not more than 1.00 mass %. In accordance with an additive manufacturing method for this metal powder, an additively-manufactured article made from a copper alloy is provided. The additively-manufactured article has both an adequate mechanical strength and an adequate electrical conductivity.
    Type: Application
    Filed: May 11, 2016
    Publication date: November 17, 2016
    Applicants: DAIHEN Corporation, TECHNOLOGY RESEARCH INSTITUTE OF OSAKA PREFECTURE
    Inventors: Ryusuke TSUBOTA, Jyunichi TANAKA, Yohei OKA, Takayuki NAKAMOTO, Takahiro SUGAHARA, Mamoru TAKEMURA, Sohei UCHIDA
  • Patent number: 7748760
    Abstract: A work holding mechanism for horizontally holding a flat work is incorporated in work transport equipment. The holding mechanism includes a base member for supporting the work and a plurality of guide members provided at the base member. Each guide member includes a shaft, a contact portion and a limit portion. The shaft is pivotally supported by the base member. The contact portion comes into contact with part of the lower surface of the perimeter of the work and is pushed down, with the shaft as a fulcrum, when the work is placed on the base member. The limit portion is raised, with the shaft as a fulcrum, to face part of the side surface of the perimeter of the work when the contact portion is lowered.
    Type: Grant
    Filed: October 24, 2007
    Date of Patent: July 6, 2010
    Assignee: DAIHEN Corporation
    Inventors: Toshikazu Kushida, Yohei Oka
  • Publication number: 20080099970
    Abstract: A work holding mechanism for horizontally holding a flat work is incorporated in work transport equipment. The holding mechanism includes a base member for supporting the work and a plurality of guide members provided at the base member. Each guide member includes a shaft, a contact portion and a limit portion. The shaft is pivotally supported by the base member. The contact portion comes into contact with part of the lower surface of the perimeter of the work and is pushed down, with the shaft as a fulcrum, when the work is placed on the base member. The limit portion is raised, with the shaft as a fulcrum, to face part of the side surface of the perimeter of the work when the contact portion is lowered.
    Type: Application
    Filed: October 24, 2007
    Publication date: May 1, 2008
    Applicant: DAIHEN Corporation
    Inventors: Toshikazu Kushida, Yohei Oka