Abstract: A gripping apparatus includes a tray, a detector, a robot, and a controller. The tray has a placement surface on which multiple workpieces of plate shape are to be placed. The placement surface is provided with multiple recesses. The detector is configured to detect arrangement of the workpieces placed on the tray. The robot is attached with a hand. The controller is configured to move and insert the workpieces into the recesses by vibrating the tray, specify the workpieces in a standing state with the detector, and instruct the robot to grip one of the workpieces in the standing state with the hand in a predetermined direction.

Abstract: A vehicle seat 1 includes: a backrest frame 40 provided in the backrest 11, an opening member 30 having an opening 31 that allows a seat belt 13 extending from the inside of the backrest 11 to pass through toward the front side; and a cover holding plate 130 that holds a cover 51 covering a surface of the backrest 11. Second holes 110 of the opening member 30, third holes 142 of the cover holding plate 130 and first holes 90 of the backrest frame 40 are arranged, in the order mentioned, toward the rear side of the backrest 11, so as to coincide with each other. The opening member 30 and the cover holding plate 130 are fixed to the backrest frame 40 by screws 150 inserted in the holes 110, 142 and 90.

Abstract: A seat moves along a rail in the front-back direction of a vehicle. A juxtaposed member (receiving member) extending in the front-back direction of the vehicle is joined to a floor or the seat so as to be located next to the rail. A detected portion is provided either to the juxtaposed member or to a member which is located on the floor side or the seat side which moves relative to the floor or the seat to which the juxtaposed member is coupled. A sensor that detects the detected portion is provided either to the juxtaposed member or to the member located on the floor side or the seat side. As a result of this configuration, the installation position of the sensor is less spatially restricted than the case in which the sensor is provided to the rail.

Abstract: A seat moves along a rail in the front-back direction of a vehicle. A juxtaposed member (receiving member) extending in the front-back direction of the vehicle is joined to a floor or the seat so as to be located next to the rail. A detected portion is provided either to the juxtaposed member or to a member which is located on the floor side or the seat side which moves relative to the floor or the seat to which the juxtaposed member is coupled. A sensor that detects the detected portion is provided either to the juxtaposed member or to the member located on the floor side or the seat side. As a result of this configuration, the installation position of the sensor is less spatially restricted than the case in which the sensor is provided to the rail.

Abstract: A vehicle seat 1 includes: a backrest frame 40 provided in the backrest 11, an opening member 30 having an opening 31 that allows a seat belt 13 extending from the inside of the backrest 11 to pass through toward the front side; and a cover holding plate 130 that holds a cover 51 covering a surface of the backrest 11. Second holes 110 of the opening member 30, third holes 142 of the cover holding plate 130 and first holes 90 of the backrest frame 40 are arranged, in the order mentioned, toward the rear side of the backrest 11, so as to coincide with each other. The opening member 30 and the cover holding plate 130 are fixed to the backrest frame 40 by screws 150 inserted in the holes 110, 142 and 90.

Abstract: A fraud detection-use card information storage unit stores card information indicating that subsequent use of a card is regarded as illegal use. An illegal use information notification unit notifies a given information system about illegal use of the card, including the location where a fraudulent card was used, when a settlement system receives a settlement request from a card reading terminal device with card information identical to card information registered in the fraud detection-use card information storage unit.

Abstract: Semiconductor device comprises a memory cell region, a peripheral region, and first wiring. The memory cell region includes a first isolation region, and a first active region provided so as to be divided off by the first isolation region. The peripheral region includes a second isolation region, and a second active region divided off by the first and second isolation regions and protruding from the upper surface of an insulating film located in the first and second isolation regions. The first wiring is buried in portions of a semiconductor substrate within the memory cell region and the peripheral region, so as to extend over the first and second active regions in a first direction. The first-direction width of the second active region is constant.

Abstract: Semiconductor device comprises a memory cell region, a peripheral region, and first wiring. The memory cell region includes a first isolation region, and a first active region provided so as to be divided off by the first isolation region. The peripheral region includes a second isolation region, and a second active region divided off by the first and second isolation regions and protruding from the upper surface of an insulating film located in the first and second isolation regions. The first wiring is buried in portions of a semiconductor substrate within the memory cell region and the peripheral region, so as to extend over the first and second active regions in a first direction. The first-direction width of the second active region is constant.

Abstract: A method of forming a semiconductor device includes the following processes. A first groove is formed in a semiconductor substrate. An insulating film is formed in the first groove. An interlayer insulating film is formed over the semiconductor substrate. A removing process is performed to remove a part of the interlayer insulating film and a part of the insulating film to form an alignment mark in the first groove.

Abstract: A method of forming a semiconductor device includes the following processes. A first groove is formed in a semiconductor substrate. An insulating film is formed in the first groove. An interlayer insulating film is formed over the semiconductor substrate. A removing process is performed to remove a part of the interlayer insulating film and a part of the insulating film to form an alignment mark in the first groove.