Patents by Inventor Yohei Yamazawa
Yohei Yamazawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240154594Abstract: A filter circuit includes: a first filter provided in a wiring between a conductive member provided inside the plasma processing apparatus and a power supplier which supplies control power or DC power to the conductive member; and a second filter provided in a wiring between the first filter and the power supplier. The first filter includes a first coil connected in series to the wiring and having no core member. The second filter includes a second coil connected in series to the wiring between the first coil and the power supplier and having core members. The second coil includes a conducting wire arranged on a surface of at least one of the core members opposite to a surface of at least one of the core members facing a hollow inner cylinder, the at least one of the core members being arranged annularly around the inner cylinder.Type: ApplicationFiled: January 15, 2024Publication date: May 9, 2024Inventors: Yohei YAMAZAWA, Naoki FUJIWARA
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Publication number: 20240049379Abstract: A plasma processing apparatus includes an antenna configured to generate plasma of a processing gas in a chamber. The antenna includes: an inner coil provided around the gas supply unit to surround a gas supply unit; and an outer coil provided around the gas supply unit and the inner coil to surround them. The outer coil is configured such that both ends of a wire forming the outer coil are opened; power is supplied from a power supply unit to a central point of the wire; the vicinity of the central point of the wire is grounded; and the outer coil resonates at a wavelength that is a half of a wavelength of the high frequency power. The inner coil is configured such that both ends of a wire forming the inner coil are connected through a capacitor and the inner coil is inductively coupled with the inner coil.Type: ApplicationFiled: October 20, 2023Publication date: February 8, 2024Applicant: Tokyo Electron LimitedInventors: Yohei YAMAZAWA, Takehisa SAITO, Mayo UDA, Keigo TOYODA, Alok RANJAN, Toshiki NAKAJIMA
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Publication number: 20240038496Abstract: A radio frequency sensor assembly includes a sensor casing disposed around a central hole, the sensor casing including a first conductive cover and a second conductive cover. The assembly includes a cavity disposed around the central hole and includes a dielectric material, the cavity being bounded by a first major outer surface and a second major outer surface along a radial direction from a center of the central hole, where the first conductive cover is electrically coupled to the second conductive cover through a coupling region beyond the second major outer surface of the cavity, and electrically insulated from the second conductive cover by the cavity and the central hole. The assembly includes a current sensor electrically insulated from the sensor casing and including a current pickup disposed symmetrically around the central hole, the current pickup being disposed within the cavity and being insulated from the sensor casing.Type: ApplicationFiled: October 13, 2023Publication date: February 1, 2024Inventors: Barton Lane, Merritt Funk, Yohei Yamazawa, Justin Moses, Chelsea DuBose, Michael Hummel
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Patent number: 11832373Abstract: A plasma processing apparatus includes an antenna configured to generate plasma of a processing gas in a chamber. The antenna includes: an inner coil provided around the gas supply unit to surround a gas supply unit; and an outer coil provided around the gas supply unit and the inner coil to surround them. The outer coil is configured such that both ends of a wire forming the outer coil are opened; power is supplied from a power supply unit to a central point of the wire; the vicinity of the central point of the wire is grounded; and the outer coil resonates at a wavelength that is a half of a wavelength of the high frequency power. The inner coil is configured such that both ends of a wire forming the inner coil are connected through a capacitor and the inner coil is inductively coupled with the inner coil.Type: GrantFiled: September 21, 2022Date of Patent: November 28, 2023Assignee: TOKYO ELECTRON LIMITEDInventors: Yohei Yamazawa, Takehisa Saito, Mayo Uda, Keigo Toyoda, Alok Ranjan, Toshiki Nakajima
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Patent number: 11817296Abstract: A radio frequency sensor assembly includes a sensor casing disposed around a central hole, the sensor casing including a first conductive cover and a second conductive cover. The assembly includes a cavity disposed around the central hole and includes a dielectric material, the cavity being bounded by a first major outer surface and a second major outer surface along a radial direction from a center of the central hole, where the first conductive cover is electrically coupled to the second conductive cover through a coupling region beyond the second major outer surface of the cavity, and electrically insulated from the second conductive cover by the cavity and the central hole. The assembly includes a current sensor electrically insulated from the sensor casing and including a current pickup disposed symmetrically around the central hole, the current pickup being disposed within the cavity and being insulated from the sensor casing.Type: GrantFiled: June 26, 2020Date of Patent: November 14, 2023Assignee: Tokyo Electron LimitedInventors: Barton Lane, Merritt Funk, Yohei Yamazawa, Justin Moses, Chelsea DuBose, Michael Hummel
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Publication number: 20230343553Abstract: The present disclosure relates to an antenna for inductively coupled plasma excitation. The antenna comprises: a conductive plate; a plurality of coil assemblies, one end of each of the plurality of coil assemblies being connected to the conductive plate; and an impedance adjusting part disposed between the other end of each of the plurality of coil assemblies and the ground.Type: ApplicationFiled: April 18, 2023Publication date: October 26, 2023Applicant: Tokyo Electron LimitedInventor: Yohei YAMAZAWA
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Publication number: 20230282446Abstract: An antenna includes an inner structure, an outer structure, and a plurality of interconnecting structures coupling the inner structure to the outer structure. The plurality of interconnecting structures is axisymmetric with respect to a center of the antenna. Each interconnecting structure has an azimuthal component of at least 30 degrees.Type: ApplicationFiled: February 3, 2022Publication date: September 7, 2023Inventors: Yohei Yamazawa, Kazuki Moyama, Barton Lane, Merritt Funk
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Publication number: 20230260752Abstract: A plasma processing apparatus is provided. The apparatus comprises: a chamber accommodating a substrate; a window member forming an upper portion of the chamber; a gas inlet port disposed in at least one of a sidewall of the chamber and the window member, and configured to supply a gas into the chamber; and an antenna disposed above the chamber with the window member interposed therebetween, having a linear shape and made of a conductive material, and configured to produce plasma from the gas supplied into the chamber by radiating a radio frequency (RF) power into the chamber. The antenna includes: a first coil to which the RF power is supplied; and a plurality of second coils formed in the same shape and arranged around the first coil to be rotationally symmetrical with respect to a central axis of the first coil. One ends of the second coils are connected one-to-one to variable capacitors.Type: ApplicationFiled: February 16, 2023Publication date: August 17, 2023Applicant: Tokyo Electron LimitedInventor: Yohei YAMAZAWA
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Publication number: 20230132660Abstract: A radio frequency (RF) system including: a first conductive covering surface, a portion of the first conductive covering surface including a portion of the first outer wall of a first RF device; a second conductive covering surface aligned to the first conductive covering surface, the second conductive covering surface being disposed around the insulating hole; an insulating hole for an RF center conductor extending through the first conductive covering surface and the second conductive covering surface, the first conductive covering surface and the second conductive covering surface being disposed around the insulating hole; a cavity bounded by the first conductive covering surface and the second conductive covering surface, the cavity being an insulating region; and an RF signal pickup disposed within the cavity.Type: ApplicationFiled: October 29, 2021Publication date: May 4, 2023Inventors: Chelsea Dubose, Barton Lane, Merritt Funk, Justin Moses, Yohei Yamazawa
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Patent number: 11600474Abstract: A radio frequency (RF) system includes a RF power source configured to power a load with an RF signal; an RF pipe including an inner conductor and an outer conductor connected to ground coupling the RF power source to the load; and a current sensor aligned to a central axis of the RF pipe carrying the RF signal. A sensor casing is disposed around the RF pipe, where the sensor casing includes a conductive material connected to the outer conductor of the RF pipe. A gallery is disposed within the sensor casing and outside the outer conductor of the RF pipe, where the current sensor is disposed in the gallery. A slit in the outer conductor of the RF pipe exposes the current sensor to a magnetic field due to the current of the RF signal in the inner conductor of the RF pipe.Type: GrantFiled: June 26, 2020Date of Patent: March 7, 2023Assignee: Tokyo Electron LimitedInventors: Barton Lane, Merritt Funk, Yohei Yamazawa, Justin Moses, Chelsea Dubose, Michael Hummel
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Publication number: 20230054430Abstract: According to an embodiment, an apparatus for a plasma processing system is provided. The apparatus includes an interface, a radiating structure, and conductive offsets. The interface includes a first conductive plate couplable to an RF source, a second conductive plate disposed between the RF source and the first conductive plate, and conductive concentric ring structures disposed between the second conductive plate and a substrate holder. The conductive offsets are arranged to couple the conductive concentric ring structures to the radiating structure.Type: ApplicationFiled: May 23, 2022Publication date: February 23, 2023Inventors: Barton Lane, Yohei Yamazawa, Jason Mehigan, Merritt Funk
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Publication number: 20230021588Abstract: A plasma processing apparatus includes an antenna configured to generate plasma of a processing gas in a chamber. The antenna includes: an inner coil provided around the gas supply unit to surround a gas supply unit; and an outer coil provided around the gas supply unit and the inner coil to surround them. The outer coil is configured such that both ends of a wire forming the outer coil are opened; power is supplied from a power supply unit to a central point of the wire; the vicinity of the central point of the wire is grounded; and the outer coil resonates at a wavelength that is a half of a wavelength of the high frequency power. The inner coil is configured such that both ends of a wire forming the inner coil are connected through a capacitor and the inner coil is inductively coupled with the inner coil.Type: ApplicationFiled: September 21, 2022Publication date: January 26, 2023Applicant: Tokyo Electron LimitedInventors: Yohei YAMAZAWA, Takehisa Saito, Mayo Uda, Keigo Toyoda, Alok Ranjan, Toshiki Nakajima
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Patent number: 11470712Abstract: A plasma processing apparatus includes an antenna configured to generate plasma of a processing gas in a chamber. The antenna includes: an inner coil provided around the gas supply unit to surround a gas supply unit; and an outer coil provided around the gas supply unit and the inner coil to surround them. The outer coil is configured such that both ends of a wire forming the outer coil are opened; power is supplied from a power supply unit to a central point of the wire; the vicinity of the central point of the wire is grounded; and the outer coil resonates at a wavelength that is a half of a wavelength of the high frequency power. The inner coil is configured such that both ends of a wire forming the inner coil are connected through a capacitor and the inner coil is inductively coupled with the inner coil.Type: GrantFiled: September 27, 2018Date of Patent: October 11, 2022Assignee: TOKYO ELECTRON LIMITEDInventors: Yohei Yamazawa, Takehisa Saito, Mayo Uda, Keigo Toyoda, Alok Ranjan, Toshiki Nakajima
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Patent number: 11410832Abstract: In accordance with an embodiment, a measurement system includes a sensor circuit configured to provide a voltage sense signal proportional to an electric field sensed by the RF sensor and a current sense signal proportional to a magnetic field sensed by the RF sensor; an analysis circuit comprising a frequency selective demodulator circuit configured to: demodulate the voltage sense signal into a first set of analog demodulated signals according to a set of demodulation frequencies, demodulate the current sense signal into a second set of analog demodulated signals according to the set of demodulation frequencies, and determine a phase shift between the voltage sense signal and the current sense signal for at least one frequency of the set of demodulation frequencies; and analog-to-digital converters configured to receive the first and second sets of analog demodulated signals.Type: GrantFiled: June 26, 2020Date of Patent: August 9, 2022Assignee: TOKYO ELECTRON LIMITEDInventors: Merritt Funk, Yohei Yamazawa, Chelsea Dubose, Barton Lane
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Publication number: 20220148854Abstract: There is provided a filter circuit provided in a plasma processing device for processing a substrate using plasma generated using power of a first frequency of 4 MHz or more and power of a second frequency of 100 Hz or more and less than 4 MHz. The filter circuit comprises: a first filter provided in a wiring between a conductive member provided in the plasma processing device and a power supply configured to supply power of a third frequency of less than 100 Hz or control power which is direct-current (DC) power, to the conductive member; and a second filter provided in a wiring between the first filter and the power supply.Type: ApplicationFiled: November 5, 2021Publication date: May 12, 2022Applicant: TOKYO ELECTRON LIMITEDInventor: Yohei YAMAZAWA
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Publication number: 20220108871Abstract: A plasma processing apparatus includes: a main coil disposed on or above a plasma processing chamber; and a sub-coil assembly disposed radially inside or outside the main coil. The sub-coil assembly includes a first spiral coil and a second spiral coil. Each turn of the first spiral coil and each turn of the second spiral coil are alternately arranged in a vertical direction. A first upper terminal of the first spiral coil is connected to a ground potential via one or more capacitors, and a first lower terminal of the first spiral coil is connected to the ground potential. A second upper terminal of the second spiral coil is connected to the ground potential via one or more capacitors or one or more other capacitors, and a second lower terminal of the second spiral coil is connected to the ground potential.Type: ApplicationFiled: October 6, 2021Publication date: April 7, 2022Applicant: TOKYO ELECTRON LIMITEDInventors: Yohei Yamazawa, Takehisa Saito, Naoki Fujiwara, Kaori Fujiwara, Daisuke Kurashina, Yuki Hosaka
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Publication number: 20210407771Abstract: In accordance with an embodiment, a measurement system includes a sensor circuit configured to provide a voltage sense signal proportional to an electric field sensed by the RF sensor and a current sense signal proportional to a magnetic field sensed by the RF sensor; an analysis circuit comprising a frequency selective demodulator circuit configured to: demodulate the voltage sense signal into a first set of analog demodulated signals according to a set of demodulation frequencies, demodulate the current sense signal into a second set of analog demodulated signals according to the set of demodulation frequencies, and determine a phase shift between the voltage sense signal and the current sense signal for at least one frequency of the set of demodulation frequencies; and analog-to-digital converters configured to receive the first and second sets of analog demodulated signals.Type: ApplicationFiled: June 26, 2020Publication date: December 30, 2021Inventors: Merritt Funk, Yohei Yamazawa, Chelsea Dubose, Barton Lane
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Publication number: 20210407770Abstract: A radio frequency sensor assembly includes a sensor casing disposed around a central hole, the sensor casing including a first conductive cover and a second conductive cover. The assembly includes a cavity disposed around the central hole and includes a dielectric material, the cavity being bounded by a first major outer surface and a second major outer surface along a radial direction from a center of the central hole, where the first conductive cover is electrically coupled to the second conductive cover through a coupling region beyond the second major outer surface of the cavity, and electrically insulated from the second conductive cover by the cavity and the central hole. The assembly includes a current sensor electrically insulated from the sensor casing and including a current pickup disposed symmetrically around the central hole, the current pickup being disposed within the cavity and being insulated from the sensor casing.Type: ApplicationFiled: June 26, 2020Publication date: December 30, 2021Inventors: Justin Moses, Barton Lane, Merritt Funk, Chelsea Dubose, Yohei Yamazawa, Michael Hummel
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Publication number: 20210407775Abstract: A radio frequency (RF) system includes a RF power source configured to power a load with an RF signal; an RF pipe including an inner conductor and an outer conductor connected to ground coupling the RF power source to the load; and a current sensor aligned to a central axis of the RF pipe carrying the RF signal. A sensor casing is disposed around the RF pipe, where the sensor casing includes a conductive material connected to the outer conductor of the RF pipe. A gallery is disposed within the sensor casing and outside the outer conductor of the RF pipe, where the current sensor is disposed in the gallery. A slit in the outer conductor of the RF pipe exposes the current sensor to a magnetic field due to the current of the RF signal in the inner conductor of the RF pipe.Type: ApplicationFiled: June 26, 2020Publication date: December 30, 2021Inventors: Justin Moses, Barton Lane, Merritt Funk, Chelsea Dubose, Yohei Yamazawa, Michael Hummel
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Patent number: 11037762Abstract: A plasma processing apparatus includes at least one asymmetry member that causes a non-uniformity of plasma density around the high frequency electrode; and a plasma density distribution controller that is arranged depending on arrangement of the at least one asymmetry member to suppress the non-uniformity of plasma density around the high frequency electrode in the azimuthal direction. The plasma density distribution controller includes a first conductor which has first and second surfaces facing opposite directions to each other and is electrically connected with the rear surface of the high frequency electrode with respect to the first high frequency power; and a second conductor which includes a first connecting portion(s) electrically connected with a portion of the second surface of the first conductor and a second connecting portion electrically connected with a conductive grounding member electrically grounded around the high frequency electrode with respect to the first high frequency power.Type: GrantFiled: October 31, 2017Date of Patent: June 15, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Yohei Yamazawa, Naohiko Okunishi, Hironobu Misawa, Hidehito Soeta