Abstract: A photoelectric conversion apparatus has a first filter arranged so as to correspond to a first photoelectric conversion unit and a second filter arranged so as to correspond to a second photoelectric conversion unit. The photoelectric conversion apparatus has a first processing unit configured to process an output signal from the first photoelectric conversion unit and having a first learned model, and a second processing unit configured to process an output signal from the second photoelectric conversion unit and having a second learned model different from the first learned model.

Abstract: The present invention provides a technology for performing a test for prostate cancer. This method is for testing the possibility of having prostate cancer, the method comprising (1) measuring the amount or concentration of a biomarker in a body fluid sample collected from a subject, the biomarker being at least one member selected from the group consisting of dimethyl glutarate, 2,6-xylidine, 2-hydroxy-2-methylpropiophenone, 2,6-di(propan-2-yl) phenol, dimethyl succinate, acetophenone, 2-phenyl-2-propanol, and 3,5,5-trimetyl-2-cyclohexenone.

Abstract: A polishing table holds a polishing pad. A top ring holds a semiconductor wafer. A swing arm holds the top ring. The swing arm swings around a swing center on the swing arm during polishing. An optical sensor is disposed on the polishing table and measures an optical characteristic changeable in accordance with a variation in film thickness of the semiconductor wafer. A fluid supply control apparatus determines a distance from an axis of rotation to the optical sensor when the semiconductor wafer is rotated by the top ring. An end point detection section detects a polishing end point indicating an end of polishing based on the optical characteristic measured by the optical sensor and the determined distance.

Abstract: Provided is a nanoparticle for photochromic materials that enables the production of photochromic materials in which the reaction time of a photochromic reaction is short. The nanoparticle for photochromic materials is represented by the following formula (1): ZnX ??(1), wherein X represents a Group 16 element, the nanoparticle being doped with and/or having, adsorbed thereto, a transition metal, the nanoparticle having organic ligands containing elemental sulfur on the surface thereof.

Abstract: Provided is a fence which can prevent a person from clambering over the fence while ensuring sufficient ventilation. The fence includes: a plurality of posts; a pair of plate members extending in a horizontal direction and spaced away from each other in a vertical direction; and a blocking member arranged in the space between the plate members for keeping a foot of a person from entering the space between the plate members to prevent the person from clambering over the fence, wherein a lower end of the blocking member is spaced upward from the plate member at a lower position, and defines a lower gap against an upper surface of the plate member at the lower position, the lower gap having such a dimension as to keep a tip of the foot of the person from entering the lower gap.

Abstract: Provided is a fence which can prevent a person from clambering over the fence while ensuring sufficient ventilation. The fence includes: a plurality of posts; a pair of plate members extending in a horizontal direction and spaced away from each other in a vertical direction; and a blocking member arranged in the space between the plate members for keeping a foot of a person from entering the space between the plate members to prevent the person from clambering over the fence, wherein a lower end of the blocking member is spaced upward from the plate member at a lower position, and defines a lower gap against an upper surface of the plate member at the lower position, the lower gap having such a dimension as to keep a tip of the foot of the person from entering the lower gap.

Abstract: The present invention improves usability by making it possible to change a display gauge of an added amount of regenerated energy. A regenerated energy display device (1) according to the present invention is installed in a vehicle (10) that is capable of collecting the regenerated energy and comprises: a display unit (2) that is capable of displaying a graph (5) that shows an added amount (Aa) of regenerated energy; and a control unit (3) that controls the display unit (2) such that it is possible to change a gauge (the upper limit) of information indicating the added amount (Aa) displayed on the display unit.

Abstract: A method for authenticating a security mark containing a photochromic compound can provide higher security performance. The method comprises a process of irradiating a security mark containing a photochromic compound with excitation light, a process of acquiring first security information on a time-dependent change in the absorption spectrum and/or reflection spectrum of the security mark after the irradiation with excitation light, and a process of checking the acquired first security information against previously acquired first security information on the security mark. In this method, the security mark preferably contains two or more photochromic compounds different from one another in color development and/or in quenching rate after the color development in a photochromic reaction.

Abstract: The present invention relates to a polishing method and a polishing apparatus for polishing a substrate such as a wafer while measuring a film thickness based on optical information included in reflected light from the substrate.

Abstract: A polishing apparatus for polishing a substrate is provided. The polishing apparatus includes: a polishing table holding a polishing pad; a top ring configured to press the substrate against the polishing pad; first and second optical heads each configured to apply the light to the substrate and to receive reflected light from the substrate; spectroscopes each configured to measure at each wavelength an intensity of the reflected light received; and a processor configured to produce a spectrum indicating a relationship between intensity and wavelength of the reflected light. The first optical head is arranged so as to face a center of the substrate, and the second optical head is arranged so as to face a peripheral portion of the substrate.

Abstract: The present invention improves usability by making it possible to change a display gauge of an added amount of regenerated energy. A regenerated energy display device (1) according to the present invention is installed in a vehicle (10) that is capable of collecting the regenerated energy and comprises: a display unit (2) that is capable of displaying a graph (5) that shows an added amount (Aa) of regenerated energy; and a control unit (3) that controls the display unit (2) such that it is possible to change a gauge (the upper limit) of information indicating the added amount (Aa) displayed on the display unit.

Abstract: A polishing table holds a polishing pad. A top ring holds a semiconductor wafer. A swing arm holds the top ring. The swing arm swings around a swing center on the swing arm during polishing. An optical sensor is disposed on the polishing table and measures an optical characteristic changeable in accordance with a variation in film thickness of the semiconductor wafer. A fluid supply control apparatus determines a distance from an axis of rotation to the optical sensor when the semiconductor wafer is rotated by the top ring. An end point detection section detects a polishing end point indicating an end of polishing based on the optical characteristic measured by the optical sensor and the determined distance.

Abstract: A processing end point detection method detects a timing of a processing end point (e.g., polishing stop, changing of polishing conditions) by calculating a characteristic value of a surface of a workpiece (an object of polishing) such as a substrate. This method includes producing a spectral waveform indicating a relationship between reflection intensities and wavelengths at a processing end point, with use of a reference workpiece or simulation calculation, based on the spectral waveform, selecting wavelengths of a local maximum value and a local minimum value of the reflection intensities, calculating the characteristic value with respect to a surface, to be processed, from reflection intensities at the selected wavelengths, setting a distinctive point of time variation of the characteristic value at a processing end point of the workpiece as the processing end point, and detecting the processing end point of the workpiece by detecting the distinctive point during processing of the workpiece.

Abstract: A polishing method capable of obtaining a stable film thickness without being affected by a difference in measurement position is disclosed. The polishing method includes: rotating a polishing table that supports a polishing pad; pressing the surface of the wafer against the polishing pad; obtaining a plurality of film-thickness signals from a film thickness sensor during a latest predetermined number of revolutions of the polishing pad, the film thickness sensor being installed in the polishing table; determining a plurality of measured film thicknesses from the plurality of film-thickness signals; determining an estimated film thickness at a topmost portion of the raised portion based on the plurality of measured film thicknesses; and monitoring polishing of the wafer based on the estimated film thickness at the topmost portion of the raised portion.

Abstract: A polishing apparatus for polishing a substrate is provided. The polishing apparatus includes: a polishing table holding a polishing pad; a top ring configured to press the substrate against the polishing pad; first and second optical heads each configured to apply the light to the substrate and to receive reflected light from the substrate; spectroscopes each configured to measure at each wavelength an intensity of the reflected light received; and a processor configured to produce a spectrum indicating a relationship between intensity and wavelength of the reflected light. The first optical head is arranged so as to face a center of the substrate, and the second optical head is arranged so as to face a peripheral portion of the substrate.

Abstract: A polishing apparatus capable of achieving a highly-precise polishing result is disclosed. The polishing apparatus includes an in-line film-thickness measuring device configured to measure a film thickness of the substrate in a stationary state, and an in-situ spectral film-thickness monitor having a film thickness sensor disposed in a polishing table, the in-situ spectral film-thickness monitor being configured to subtract an initial film thickness, measured by the in-situ spectral film-thickness monitor before polishing of the substrate, from an initial film thickness, measured by the in-line film-thickness measuring device before polishing of the substrate, to determine a correction value, add the correction value to a film thickness that is measured when the substrate is being polished to obtain a monitoring film thickness, and monitor a progress of polishing of the substrate based on the monitoring film thickness.

Abstract: A polishing apparatus for polishing a substrate is provided. The polishing apparatus includes: a polishing table holding a polishing pad; a top ring configured to press the substrate against the polishing pad; first and second optical heads each configured to apply the light to the substrate and to receive reflected light from the substrate; spectroscopes each configured to measure at each wavelength an intensity of the reflected light received; and a processor configured to produce a spectrum indicating a relationship between intensity and wavelength of the reflected light. The first optical head is arranged so as to face a center of the substrate, and the second optical head is arranged so as to face a peripheral portion of the substrate.

Abstract: The present invention relates to a polishing method and a polishing apparatus for polishing a substrate such as a wafer while measuring a film thickness based on optical information included in reflected light from the substrate.

Abstract: A polishing method capable of obtaining a stable film thickness without being affected by a difference in measurement position is disclosed. The polishing method includes: rotating a polishing table that supports a polishing pad; pressing the surface of the wafer against the polishing pad; obtaining a plurality of film-thickness signals from a film thickness sensor during a latest predetermined number of revolutions of the polishing pad, the film thickness sensor being installed in the polishing table; determining a plurality of measured film thicknesses from the plurality of film-thickness signals; determining an estimated film thickness at a topmost portion of the raised portion based on the plurality of measured film thicknesses; and monitoring polishing of the wafer based on the estimated film thickness at the topmost portion of the raised portion.

Abstract: A method for authenticating a security mark containing a photochromic compound can provide higher security performance. The method comprises a process of irradiating a security mark containing a photochromic compound with excitation light, a process of acquiring first security information on a time-dependent change in the absorption spectrum and/or reflection spectrum of the security mark after the irradiation with excitation light, and a process of checking the acquired first security information against previously acquired first security information on the security mark. In this method, the security mark preferably contains two or more photochromic compounds different from one another in color development and/or in quenching rate after the color development in a photochromic reaction.