Abstract: This anisotropic conductive sheet includes: a plurality of conductive paths; and an insulation layer which is disposed to fill the space between the plurality of conductive paths and has a first surface and a second surface. Each of the conductive path extends in a thickness direction of the insulation layer and has a first end part on the first surface side and a second end part on the second surface side. When the conductive paths are seen through so that the center of the first end part overlaps the center of the second end part, at least a portion of the conductive paths does not overlap the first end part and the second end part.

Abstract: This method for producing a semiconductor device comprises: a first step wherein a plurality of semiconductor chips are affixed onto a supporting substrate such that circuit surfaces of the semiconductor chips face the supporting substrate; a second step wherein a plurality of sealed layers are formed at intervals by applying the sealing resin onto the semiconductor chips by three-dimensional modeling method, each sealed layer containing one or more semiconductor chips embedded in a sealing resin; a third step wherein the sealed layers are cured or solidified; and a fourth step wherein sealed bodies are obtained by separating the cured or solidified sealed layers from the supporting substrate.

Abstract: This anisotropic conductive sheet includes: a plurality of conductive paths; and an insulation layer which is disposed to fill the space between the plurality of conductive paths and has a first surface and a second surface. Each of the conductive path extends in a thickness direction of the insulation layer and has a first end part on the first surface side and a second end part on the second surface side. When the conductive paths are seen through so that the center of the first end part overlaps the center of the second end part, at least a portion of the conductive paths does not overlap the first end part and the second end part.

Abstract: To shorten an operation time for a tilt angle and to avoid unintentional changing of the tilt angle to an improper tilt angle, an imaging control apparatus for controlling a camera limits a tilt angle based on an installation direction of the camera and information stored in a memory, wherein the information relates to the limitation of the tilt angle corresponding to respective installation direction of the camera.

Abstract: This method for producing a semiconductor device comprises: a first step wherein a plurality of semiconductor chips are affixed onto a supporting substrate such that circuit surfaces of the semiconductor chips face the supporting substrate; a second step wherein a plurality of sealed layers are formed at intervals by applying the sealing resin onto the semiconductor chips by three-dimensional modeling method, each sealed layer containing one or more semiconductor chips embedded in a sealing resin; a third step wherein the sealed layers are cured or solidified; and a fourth step wherein sealed bodies are obtained by separating the cured or solidified sealed layers from the supporting substrate.

Abstract: An angle of rotation of a sheet is determined so as to match a processing area that is processed in a processing step defined by specification information with a processing area that is processed on the sheet placed in a placement direction designated in correspondence with a processing apparatus used in the processing step. After rotating the designated placement method by the determined angle of rotation, the resultant direction is printed in, for example, an area to be trimmed off as a placement direction of the sheet in the processing step.

Abstract: An angle of rotation of a sheet is determined so as to match a processing area that is processed in a processing step defined by specification information with a processing area that is processed on the sheet placed in a placement direction designated in correspondence with a processing apparatus used in the processing step. After rotating the designated placement method by the determined angle of rotation, the resultant direction is printed in, for example, an area to be trimmed off as a placement direction of the sheet in the processing step.

Abstract: In a print control apparatus which causes a print apparatus to print via a hot folder, it is monitored whether a file is submitted to the hot folder. Upon submitting the file, it is identified whether the submitted file is a reference information file indicating an external content file, and, upon identifying the reference information file, it is determined whether an acquisition process of acquiring the external content file indicated by the reference information file is to be executed by the print control apparatus or the print apparatus. Upon determining that the acquisition process is to be executed by the print control apparatus, print data is generated based on the acquired external content file, and, upon determining that the acquisition process is to be executed by the print apparatus, print data including the reference information file indicating the external content file is generated.

Abstract: In a print control apparatus which causes a print apparatus to print via a hot folder, it is monitored whether a file is submitted to the hot folder. Upon submitting the file, it is identified whether the submitted file is a reference information file indicating an external content file, and, upon identifying the reference information file, it is determined whether an acquisition process of acquiring the external content file indicated by the reference information file is to be executed by the print control apparatus or the print apparatus. Upon determining that the acquisition process is to be executed by the print control apparatus, print data is generated based on the acquired external content file, and, upon determining that the acquisition process is to be executed by the print apparatus, print data including the reference information file indicating the external content file is generated.

Abstract: In a print control apparatus which causes a print apparatus to print via a hot folder, it is monitored whether a file is submitted to the hot folder. Upon submitting the file, it is identified whether the submitted file is a reference information file indicating an external content file, and, upon identifying the reference information file, it is determined whether an acquisition process of acquiring the external content file indicated by the reference information file is to be executed by the print control apparatus or the print apparatus. Upon determining that the acquisition process is to be executed by the print control apparatus, print data is generated based on the acquired external content file, and, upon determining that the acquisition process is to be executed by the print apparatus, print data including the reference information file indicating the external content file is generated.

Abstract: A color conversion apparatus includes a plurality of color conversion units configured to perform color conversion using a conversion table with different algorithms, a weighting unit configured to set weightings applied to the plurality of color conversion units, and a mixing unit configured to mix a plurality of color conversion results obtained by the plurality of color conversion units using the weightings calculated by the weighting unit.

Abstract: A color conversion apparatus includes a plurality of color conversion units configured to perform color conversion using a conversion table with different algorithms, a weighting unit configured to set weightings applied to the plurality of color conversion units, and a mixing unit configured to mix a plurality of color conversion results obtained by the plurality of color conversion units using the weightings calculated by the weighting unit.

Abstract: The adhesive resin of the invention comprises a polyimide resin obtained by reacting a diamine component containing the compound (1) as an essential component with a tetracarboxylic dianhydride component. The diamine component contains a silicone diamine having a specific structure and/or the tetracarboxylic dianhydride component contains a silicone acid dianhydride having a specific structure. Film adhesives made by using the adhesive resin preferably together with a thermosetting resin, and, if necessary, an inorganic filler are excellent in low-temperature adhesion, resistance to moisture absorption, heat resistance, and workability in adhesive adhering and are favorably usable as semiconductor-mounting materials for adhering semiconductor elements to substrates.

Abstract: A heat resistance resin composition having superb low-temperature adhesiveness and a polyimide/metal laminate which is superior in solder heat resistance and hardly generates swelling when forming a Au—Sn bond or Au—Au bond, which are used for lead-free soldering and COF packaging.

Abstract: The aromatic diamine compound of the present invention is represented by the following formula (1), and from the aromatic diamine compound a polyimide having a repeating unit represented by the following formula (4), which has low-temperature adherability, can be obtained. In the formulas (1) and (4), n is an integer of 3 to 7, each R is independently an atom or a group selected from the group consisting of a hydrogen atom, a halogen atom and a hydrocarbon group, the same or different two hetero atoms selected from nitrogen atoms and oxygen atoms bonded to each benzene ring are at the ortho- or meta-positions to each other on at least one benzene ring, and when n is 3, the hetero atoms are at the ortho- or meta-positions to each other on all the benzene rings. In the formula (4), Y is a tetravalent organic group.

Abstract: The aromatic diamine compound of the present invention is represented by the following formula (1), and from the aromatic diamine compound a polyimide having a repeating unit represented by the following formula (4), which has low-temperature adherability, can be obtained.