Abstract: A microfluidic device includes: a base plate allowing an electromagnetic wave to pass therethrough and having no autofluorescence; a microwell array formed on the base plate and including a wall layer in which a plurality of through-holes are formed in a thickness direction; and a lid member disposed opposite to the base plate in a state of being separated from the wall layer, wherein microwells are formed by the base plate and the through-holes formed in the wall layer, and wherein the wall layer is formed of a material containing a colored component that absorbs an electromagnetic wave of a predetermined wavelength.

Abstract: A method of detecting a biological substance, including introducing a first substance dispersed in a solvent into a flow channel formed between a first substrate and a second substrate such that the first substance is placed in a first well formed in the first substrate, and detecting the first substance. The first well is formed such that the first well has an open side which faces downwards and is communicated with the flow channel, and the solvent has a specific gravity larger than a specific gravity of the first sub stance.

Abstract: An analytical device includes a plate including a first substrate having a front surface and a back surface and a second substrate facing the back surface of the first substrate such that at least one detection space observable from outside is formed between the second substrate and the back surface of the first substrate, and an adapter. The first substrate has a first port having a through hole formed through the front surface and communicated with the detection space for delivering a liquid-containing substance into the detection space, the first substrate has a second port having a through hole formed through the front surface and communicated with the detection space for discharging a liquid-containing substance or a gas from the detection space, and the adapter is attachable to and detachable from the first port and the second port, and the front surface of the first substrate without the adapter is flat.

Abstract: A plurality of workpieces on which components are to be placed are lined up in a row and held by a workpiece holding body, and the workpiece holding body is placed on a carrier and is transported to a working position using a transport conveyor. After the workpiece holding body is chucked by a chuck portion, the workpiece holding body is separated from the carrier by linking an operation of lifting and lowering the chuck portion using a lifting-lowering mechanism and an operation of moving the carrier in a transport direction. The chuck portion which chucks the workpiece holding body is rotated by a rotation mechanism, postures of the plurality of workpieces which are held in the workpiece holding body are adjusted, and then, the components are placed on component placing parts using a placing head.

Abstract: After a chuck portion chucks a workpiece holding body which aligns and holds a plurality of workpieces on which components are to be placed, the posture of the workpieces held in the workpiece holding body is adjusted due to rotation mechanism by rotating the chuck portion around an axial line which extends in an aligning direction of the plurality of workpieces held in the workpiece holding body. Then, a placing head places the components on each of the plurality of workpieces which are subjected to posture adjustment.

Abstract: An array device including a base having wells, a cover positioned over the base with a gap from the base such that openings of the wells are covered by the cover with the gap in between, an injection port communicating with the gap, a discharge port communicating with the gap and positioned apart from the injection port, and a waste liquid vessel which collects liquid that flows from the gap via the discharge port and is positioned at a level different from the gap forming a channel. The discharge port is placed to discharge a surplus aqueous solution outside the wells from the discharge port by an oleaginous sealing liquid to be delivered from the injection port.

Abstract: A substrate conveyance mechanism includes conveyance units and a clamp mechanism. The conveyance units include a working unit corresponding to a working area for types of substrates having different sizes of length taken as objects, an area length of the working area being variable in accordance with the sizes of length, and a stand-by unit corresponding to a stand-by area for the substrate to be carried-in to the working area. The clamp members include commonly used first clamp members and second clamp members which are attachable and detachable and are selectively used in accordance with the sizes of length of the plurality of types of substrates in addition to the first clamp members.

Abstract: A biomolecule analysis kit includes a reaction container configured to perform an enzymatic reaction, the reaction container including a base portion which has a container-shaped portion and a low-adsorption structural portion which is provided on at least the inner surface of the container-shaped portion, the low-adsorption structural portion having an adsorption rate lower than the base portion at which at least one of a sample which becomes a target of analysis in the enzymatic reaction and a reagent for the enzymatic reaction is adsorbed thereonto, wherein a signal resulting from the enzymatic reaction is configured to be detected when the enzymatic reaction is performed in the reaction container.

Abstract: A membrane vesicle recovery device includes: a liquid filler; and at least a fused membrane having a lipid bilayer membrane which covers at least a part of the outer periphery of the liquid filler, in which a content of a membrane vesicle is mixed into the liquid filler through fusing of the membrane vesicle and the fused membrane.

Abstract: A substrate conveyance mechanism includes conveyance units and a working area length change part. The conveyance units include a working unit corresponding to a working area for types of substrates having different sizes of length taken as objects, an area length of the working area being variable in accordance with the sizes of length, and a stand-by unit corresponding to a stand-by area for the substrate to be carried-in to the working area. The working area length change part changes an interval between a commonly used first pulley and one of second pulleys selectively used in accordance with the area length of the working area by changing a belt winding form of a conveyance belt wound on the pulleys in the working unit.

Abstract: A substrate conveyance mechanism includes conveyance units and a clamp mechanism. The conveyance units include a working unit corresponding to a working area for types of substrates having different sizes of length taken as objects, an area length of the working area being variable in accordance with the sizes of length, and a stand-by unit corresponding to a stand-by area for the substrate to be carried-in to the working area. The clamp members include commonly used first clamp members and second clamp members which are attachable and detachable and are selectively used in accordance with the sizes of length of the plurality of types of substrates in addition to the first clamp members.

Abstract: The method of the present invention is a method for determining an HLA-A*24 group, which includes determining the HLA-A*24 group on the basis of the results of the typing of (a) a 211st base and (b) a 395th base, in which A (adenine) in the initiation codon for an HLA gene is defined as the 1st base in the genomic DNA of a test subject.

Abstract: Disclosed is a method of detecting a target base sequence having a polymorphic base, the method including: (a) a step of adding to a nucleic acid sample having a target nucleic acid that includes a base sequence including the target base sequence: at least one type of detection primer, at least one type of competitive primer, and at least one type of common primer; (b) a step of annealing the detection primer and the competitive primer to the target nucleic acid in a competitive manner, thereby synthesizing an extension product A; (c) a step of annealing the common primer to the extension product A obtained in the step (b) or in the following step (d), thereby synthesizing an extension product B; (d) a step of annealing the detection primer or the competitive primer to the extension product B obtained in the previous step (c), thereby synthesizing the extension product A; and (e) a step of detecting the extension product A or the extension product B.

Abstract: A component mounting apparatus for mounting a plurality of components on a board. The apparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

Abstract: In a chip reversing method for holding and vertically reversing a chip placed by a bonding nozzle, the chip is held on a chip holding unit disposed in a reversing member and is vertically reversed by turning the reversing member downward on an reversal shaft. After the reversed chip was received by a chip receiving unit, this chip receiving unit is lowered to a retracted position to return the reversing member to an original position. In this state, the chip receiving unit is raised to position the chip at a height level L for a chip transferring action. As a result, the reversing member does not protrude to above the height level for the chip transfer thereby to interfere with another mechanism, so that the chip mounting actions can be made efficient.

Abstract: While a vicinity of a bottom surface-side region of a pressure-sensitive adhesive sheet, corresponding to an adhesion region of a semiconductor chip, is sucked and held, a plurality of protruding portions of a removing member are brought into contact with the bottom surface of the semiconductor chip through the adhesive sheet at the adhesion region. Also, the adhesive sheet is sucked in between the respective protruding portions so as to change an adhesive surface bond of the semiconductor chip to the adhesive sheet to point bonding. Further, the removing member is moved along the bottom surface of the semiconductor chip so as to change the position of the point bonding and decrease the adhesive bonding force to the adhesive sheet. Then, the semiconductor chip is removed from the adhesive sheet.

Abstract: A component mounting apparatus for mounting a plurality of components on a board. The apparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

Abstract: A component mounting apparatus and method for mounting a plurality of components on a board. The aparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

Abstract: A component mounting apparatus is provided with a board holding device for holding a board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

Abstract: In a chip reversing device used in a chip mounting apparatus for holding and vertically reversing a chip placed by a bonding nozzle, the chip is held on a chip holding unit disposed in a reversing member and is vertically reversed by turning the reversing member downward on an reversal shaft. After the reversed chip was received by a chip receiving unit, this chip receiving unit is lowered to a retracted position to return the reversing member to an original position. In this state, the chip receiving unit is raised to position the chip at a height level L for a chip transferring action. As a result, the reversing member does not protrude to above the height level for the chip transfer thereby to interfere with another mechanism, so that the chip mounting actions can be made efficient.