Patents by Inventor Yoichi Nabeta

Yoichi Nabeta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7432580
    Abstract: A semiconductor apparatus comprises a substrate, a semiconductor chip fixedly secured on one side of the substrate, a spirally shaped coil formed on the other side of the substrate and electrically connected to the semiconductor chip, and a conductive pattern formed on a surface of the one side of the substrate facing to the semiconductor chip for stabilizing an inductance characteristic of the coil.
    Type: Grant
    Filed: December 20, 2005
    Date of Patent: October 7, 2008
    Assignees: Sanyo Electric Co., Ltd., Kanto Sanyo Semiconductors Co., Ltd.
    Inventors: Akihiro Sato, Satoru Sekiguchi, Kiyokazu Kamado, Kazunari Kurokawa, Makoto Tsubonoya, Kiyoshi Mita, Yoichi Nabeta, Tetsuro Sawai, Toshikazu Imaoka
  • Patent number: 7365628
    Abstract: A semiconductor apparatus having a semiconductor chip, a first coil electrically connected to the semiconductor chip and a first electrode electrically connected to the first coil is comprised of a second electrode which can be electrically connected to the first electrode as well as which can be electrically connected to a second coil on the outside of the semiconductor apparatus, and is characterized by that inductance composed of the first coil and the second coil is obtained by electrically connecting the second electrode to the first electrode and the second coil.
    Type: Grant
    Filed: January 24, 2006
    Date of Patent: April 29, 2008
    Assignees: Sanyo Electric Co., Ltd., Kanto Sanyo Semiconductors Co., Ltd.
    Inventors: Akihiro Sato, Satoru Sekiguchi, Kiyokazu Kamado, Makoto Tsubonoya, Kiyoshi Mita, Yoichi Nabeta
  • Publication number: 20060176137
    Abstract: A semiconductor apparatus having a semiconductor chip, a first coil electrically connected to the semiconductor chip and a first electrode electrically connected to the first coil is comprised of a second electrode which can be electrically connected to the first electrode as well as which can be electrically connected to a second coil on the outside of the semiconductor apparatus, and is characterized by that inductance composed of the first coil and the second coil is obtained by electrically connecting the second electrode to the first electrode and the second coil.
    Type: Application
    Filed: January 24, 2006
    Publication date: August 10, 2006
    Applicants: Sanyo Electric Co., Ltd., Kanto Sanyo Semiconductors Co., Ltd.
    Inventors: Akihiro Sato, Satoru Sekiguchi, Kiyokazu Kamado, Makoto Tsubonoya, Kiyoshi Mita, Yoichi Nabeta
  • Publication number: 20060131724
    Abstract: A semiconductor apparatus comprises a substrate, a semiconductor chip fixedly secured on one side of the substrate, a spirally shaped coil formed on the other side of the substrate and electrically connected to the semiconductor chip, and a conductive pattern formed on a surface of the one side of the substrate facing to the semiconductor chip for stabilizing an inductance characteristic of the coil.
    Type: Application
    Filed: December 20, 2005
    Publication date: June 22, 2006
    Applicants: Sanyo Electric Co., Ltd., Kanto Sanyo Semiconductors Co., Ltd.
    Inventors: Akihiro Sato, Satoru Sekiguchi, Kiyokazu Kamado, Kazunari Kurokawa, Makoto Tsubonoya, Kiyoshi Mita, Yoichi Nabeta, Tetsuro Sawai, Toshikazu Imaoka
  • Patent number: 4393434
    Abstract: A capacitance humidity sensor according to the disclosure a non-conductive base plate, electrodes oppositely arranged on the base plate, a metal compound membrane formed by ion-plating independently on the electrodes, the metal compound membrane being roughened on its surface by plasma etching and being active to the humidity, and a moisture permeable metal skin formed on the metal compound membrane. The metal compound is preferably an oxide or nitride of aluminum or magnesium.
    Type: Grant
    Filed: November 20, 1981
    Date of Patent: July 12, 1983
    Assignee: Yoshio Imai
    Inventors: Yoshio Imai, Yoichi Nabeta, Tadao Inuzuka