Patents by Inventor Yoichiro FURUTA

Yoichiro FURUTA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11923781
    Abstract: Provided is a power conversion device capable of suppressing an increase in cost and an increase in size of the device. A control board 113 that includes a connection unit 140 to which a signal connector 114 which transmits a signal is connected, a base member 120 that supports the control board 113 and has conductivity, and a case 110 that accommodates the control board 113 and the base member 120 and is connected to a ground is provided. The base member 120 includes a supporting portion 141 that is connected to one surface of the control board 113, and a first extending portion 130 of which one end is connected to the supporting portion 141 and the other end extends to the case 110 to be connected to the case 110. An electronic component 113a that generates noise is mounted on the control board 113, and the first extending portion 130 and the supporting portion 141 form an electrical path.
    Type: Grant
    Filed: May 8, 2019
    Date of Patent: March 5, 2024
    Assignee: Hitachi Astemo, Ltd.
    Inventors: Yoichiro Furuta, Kenichirou Nakajima, Yuta Numakura
  • Publication number: 20220271683
    Abstract: A power conversion device including: a circuit board including a first ground constituting a ground of a first circuit and a second ground formed to be electrically separated from the first ground; a second circuit in which a joining portion is formed; a metal base plate provided between the second circuit and the circuit board and provided with an opening portion corresponding to the joining portion; and a housing that stores the circuit board, the second circuit, and the metal base plate and is electrically connected to the second ground of the circuit board and the metal base plate, in which the joining portion of the second circuit is disposed corresponding to the second ground via the opening portion of the metal base plate.
    Type: Application
    Filed: April 20, 2020
    Publication date: August 25, 2022
    Applicant: HITACHI ASTEMO, LTD.
    Inventors: Isao HOUDA, Hiroki FUNATO, Yuta NUMAKURA, Yoichiro FURUTA
  • Publication number: 20210249967
    Abstract: Provided is a power conversion device capable of suppressing an increase in cost and an increase in size of the device. A control board 113 that includes a connection unit 140 to which a signal connector 114 which transmits a signal is connected, a base member 120 that supports the control board 113 and has conductivity, and a case 110 that accommodates the control board 113 and the base member 120 and is connected to a ground is provided. The base member 120 includes a supporting portion 141 that is connected to one surface of the control board 113, and a first extending portion 130 of which one end is connected to the supporting portion 141 and the other end extends to the case 110 to be connected to the case 110. An electronic component 113a that generates noise is mounted on the control board 113, and the first extending portion 130 and the supporting portion 141 form an electrical path.
    Type: Application
    Filed: May 8, 2019
    Publication date: August 12, 2021
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Yoichiro FURUTA, Kenichirou NAKAJIMA, Yuta NUMAKURA
  • Patent number: 10944332
    Abstract: Provided is a power converter capable of being miniaturized while securing noise resistance and insulation between a power semiconductor module and a drive circuit board.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: March 9, 2021
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Yoichiro Furuta, Kenichirou Nakajima, Yuta Numakura
  • Publication number: 20190326827
    Abstract: Provided is a power converter capable of being miniaturized while securing noise resistance and insulation between a power semiconductor module and a drive circuit board.
    Type: Application
    Filed: December 6, 2017
    Publication date: October 24, 2019
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Yoichiro FURUTA, Kenichirou NAKAJIMA, Yuta NUMAKURA