Abstract: In a circuit module for a high frequency, a resistance film is formed on a side of a semiconductor circuit chip, mounted above a dielectric substrate through ground metal layers, opposite to the dielectric substrate. A distance from the ground metal layer to the resistance film is a ¼ wavelength at a predetermined frequency, and the resistance film has a sheet resistance equal to a characteristic impedance of air. A second dielectric substrate with the metal layer formed on a side opposite to the resistance film can be mounted. When being adhered to the second dielectric substrate, the resistance film has a characteristic impedance determined by a permittivity of a material of the semiconductor circuit chip. When being formed in space from the semiconductor circuit chip, the resistance film has a sheet resistance equal to a characteristic impedance of air. The thickness of the second dielectric substrate is a ¼ wavelength in a desired frequency.

Abstract: A disclosed group delay characteristic correcting device corrects group delay characteristics of an analog low-pass filter used to remove aliasing of a digital-analog converter or an analog-digital converter. The group delay characteristic correcting device includes a digital signal processing unit configured to have an all-pass phase circuit at a stage previous to the digital-analog converter or at a stage subsequent to the analog-digital converter so as to correct the group delay characteristics of the analog low-pass filter.

Abstract: A phase tracking circuit includes a divider part dividing an input signal that includes data sub-carriers and pilot sub-carriers into groups so that each of the groups includes at least one of the pilot sub-carriers, and a correcting part correcting phases of data sub-carriers of the input signal included in one of the groups on the basis of an amount of phase rotation of the at least one of the pilot sub-carriers included in the above one of the groups.

Abstract: In a wireless communication apparatus in a time division duplex system, a transmission signal generation unit generates a transmission signal. A power amplifying device amplifies the generated transmission signal. A control signal generation device generates a drain voltage control signal for control of the drain voltage of the power amplifying device, and a gate voltage control signal for control of the gate voltage of the power amplifying device. The switch unit switches off the drain power supply of the power amplifying device during reception in the time division duplex system according to the drain voltage control signal. In addition, the power amplifying device sets a higher gate voltage during reception in the time division duplex system higher than during transmission according to the gate voltage control signal.

Abstract: A waveguide substrate has improved signal conversion characteristic to a cavity waveguide at a post wall waveguide less suffering a manufacturing error occurring at a portion leading the signal to the cavity waveguide. The waveguide substrate has a converting part provided at a position shutting off an end of the waveguide, waveguide shutting-off conducting posts penetrating a dielectric plate to electrically conduct between conductor layers on the both surfaces of the dielectric plate, and two slit-like regions, in which no conductor layer is formed, arranged in parallel in the upper stream and the lower stream with respect to a direction of propagation of a high-frequency signal from the waveguide toward the waveguide shutting-off conducting posts.

Abstract: A communication radio-frequency module is provided that has a semiconductor device to which an antenna element is connected. This communication radio-frequency module includes: a supporting body that has a waveguide formed therein; a wiring board that is fixed onto a surface of the supporting body; the semiconductor device that is flip-chip mounted onto the wiring board by ultrasonic bonding; and the antenna element that is disposed on the other surface of the supporting body. In this module, the wiring board includes a board core member that is made of a resin material, and the supporting body includes a supporting body core member that is also made of a resin material.

Abstract: A high-frequency module includes a stiffener (a support substrate), a resin base member of which one surface is fixed to the stiffener, a first conductive pattern formed on said one surface of the resin base member, a second conductive pattern formed on the other surface of the resin base member for constituting a waveguide in combination with the first conductive pattern to pass a high-frequency signal through the resin base member and including a window for allowing the high-frequency signal to pass therethrough, a cap for covering a semiconductor element and for absorbing or reflecting the high-frequency signal, an adopter (a waveguide tube) fixed onto the second conductive pattern such that one open end thereof surrounds the window, and an antenna fixed to the other open end of the adaptor.

Abstract: In a circuit module for a high frequency, a resistance film is formed on a side of a semiconductor circuit chip, mounted above a dielectric substrate through ground metal layers, opposite to the dielectric substrate. A distance from the ground metal layer to the resistance film is a ¼ wavelength at a predetermined frequency, and the resistance film has a sheet resistance equal to a characteristic impedance of air. A second dielectric substrate with the metal layer formed on a side opposite to the resistance film can be mounted. When being adhered to the second dielectric substrate, the resistance film has a characteristic impedance determined by a permittivity of a material of the semiconductor circuit chip. When being formed in space from the semiconductor circuit chip, the resistance film has a sheet resistance equal to a characteristic impedance of air. The thickness of the second dielectric substrate is a ¼ wavelength in a desired frequency.

Abstract: A high-frequency module includes a stiffener (a support substrate), a resin base member of which one surface is fixed to the stiffener, a first conductive pattern formed on said one surface of the resin base member, a second conductive pattern formed on the other surface of the resin base member for constituting a waveguide in combination with the first conductive pattern to pass a high-frequency signal through the resin base member and including a window for allowing the high-frequency signal to pass therethrough, a cap for covering a semiconductor element and for absorbing or reflecting the high-frequency signal, an adopter (a waveguide tube) fixed onto the second conductive pattern such that one open end thereof surrounds the window, and an antenna fixed to the other open end of the adaptor.

Abstract: A waveguide substrate has improved signal conversion characteristic to a cavity waveguide at a post wall waveguide less suffering a manufacturing error occurring at a portion leading the signal to the cavity waveguide. The waveguide substrate has a converting part provided at a position shutting off an end of the waveguide, waveguide shutting-off conducting posts penetrating a dielectric plate to electrically conduct between conductor layers on the both surfaces of the dielectric plate, and two slit-like regions, in which no conductor layer is formed, arranged in parallel in the upper stream and the lower stream with respect to a direction of propagation of a high-frequency signal from the waveguide toward the waveguide shutting-off conducting posts.

Abstract: A communication radio-frequency module is provided that has a semiconductor device to which an antenna element is connected. This communication radio-frequency module includes: a supporting body that has a waveguide formed therein; a wiring board that is fixed onto a surface of the supporting body; the semiconductor device that is flip-chip mounted onto the wiring board by ultrasonic bonding; and the antenna element that is disposed on the other surface of the supporting body. In this module, the wiring board includes a board core member that is made of a resin material, and the supporting body includes a supporting body core member that is also made of a resin material.

Abstract: A millimeter wave system includes a plurality of millimeter wave modules, each of which comprises a substrate; a microstrip conductor formed on one surface side of the substrate; a ground plate formed on the other surface side of the substrate; and conductive pads which are disposed on both sides of a strip conductor portion which extends from said microstrip conductor via a tapered portion, and which are connected to the ground potential of said ground plate through a via hole, wherein the strip conductors of this plurality of millimeter wave modules are connected to each other using conductive ribbon. Moreover, when a plurality of millimeter wave modules is connected to form a millimeter wave system, the effect produced by the interaction between the unnecessary conductive pads connected to the ground potential and the strip conductor can be reduced.

Abstract: Disclosed are planar structures for coupling electromagnetic signals between planar transmission lines and waveguides. A preferred exemplary structure comprises a shielded patch antenna and one or more capacitive diaphragms disposed adjacent to the patch antenna. This structure is advantageous to MMIC modules in connecting from a planar transmission line of a substrate carrying an MMIC to an external waveguide without the need of a non-planar back metal short, which is normally essential to avoid back scattering from the waveguide and also normally needed to achieve impedance matching. In structures according to the present invention, a patch antenna radiates into the waveguide while the antenna's ground plane reduces back scattering from the waveguide. The one or more capacitive diaphragms provide impedance matching between the microstrip and the waveguide.

Abstract: A high-frequency integrated circuit (IC) module comprising a multilayer mounting board on which an integrated circuit with a plurality of high-frequency signal terminals is mounted, and IC connecting portions disposed on one surface of the multilayer mounting board and respectively connected with the high-frequency signal terminals. The high-frequency IC module further comprises external connection terminal portions disposed at wider intervals than those between the high-frequency signal terminals, high-frequency signal lines provided within the multilayer mounting board, first through holes for connecting the inner ends of the high-frequency signal lines with the IC connecting portions, and second through holes for connecting the outer ends of the high-frequency signal lines with the external connection terminal portions.

Abstract: A high-frequency integrated circuit (IC) module comprising a multilayer mounting board on which an integrated circuit with a plurality of high-frequency signal terminals is mounted, and IC connecting portions disposed on one surface of the multilayer mounting board and respectively connected with the high-frequency signal terminals. The high-frequency IC module further comprises external connection terminal portions disposed at wider intervals than those between the high-frequency signal terminals, high-frequency signal lines provided within the multilayer mounting board, first through holes for connecting the inner ends of the high-frequency signal lines with the IC connecting portions, and second through holes for connecting the outer ends of the high-frequency signal lines with the external connection terminal portions.

Abstract: Disclosed are planar structures for coupling electromagnetic signals between planar transmission lines and waveguides. A preferred exemplary structure comprises a shielded patch antenna and one or more capacitive diaphragms disposed adjacent to the patch antenna. This structure is advantageous to MMIC modules in connecting from a planar transmission line of a substrate carrying an MMIC to an external waveguide without the need of a non-planar back metal short, which is normally essential to avoid back scattering from waveguide and also normally needed to achieve impedance matching. In structures according to the present invention, a patch antenna radiates into the waveguide while the antenna's ground plane reduces back scattering from waveguide. The one or more capacitive diaphragms provide impedance matching between the microstrip and the waveguide.

Abstract: A millimeter wave system includes a plurality of millimeter wave modules, each of which comprises a substrate; a microstrip conductor formed on one surface side of the substrate; a ground plate formed on the other surface side of the substrate; and conductive pads which are disposed on both sides of a strip conductor portion which extends from said microstrip conductor via a tapered portion, and which are connected to the ground potential of said ground plate through a via hole, wherein the strip conductors of this plurality of millimeter wave modules are connected to each other using conductive ribbon. Moreover, when a plurality of millimeter wave modules is connected to form a millimeter wave system, the effect produced by the interaction between the unnecessary conductive pads connected to the ground potential and the strip conductor can be reduced.

Abstract: A coaxial line assembly in a package which houses a high frequency element. The assembly includes a metal wall having a hole extending through the metal wall. The metal wall has a step at substantially an intermediate portion of the hole to define a smaller diameter, inner hole portion opened to the inside of the package and a larger diameter, outer hole portion opened to the outside of the package. A lead for transmitting a high frequency signal passes through the hole and is hermetically sealed in the outer hole portion by glass filled in the outer hole portion. A sealing plate closes an opening of the inner hole portion at the step, the lead extending through the sealing plate. The sealing plate is made of a dielectric material having a dielectric constant near to that of the glass and a melting point higher than that of the glass.

Abstract: A FM-CW radar device is provided for frequency-modulating a high frequency signal with a modulation signal, transmitting the modulated high frequency signal, receiving a signal reflected by a target object and frequency-modulating the reflection signal with a signal generated by a local oscillator signal source provided by branching a portion of the transmitting signal. A modulator is disposed between a radar transmitting section and a transmitting antenna. The modulator modulates the transmitting signal with a second frequency which is far lower than the radar transmitting frequency and twice as much as the sum or the difference of a Doppler frequency generated by a relative propagation velocity and a beat frequency generated by a propagation delay time. A first frequency converter frequency modulates the received signal reflected by the target object with the local oscillator.