Patents by Inventor Yojiro Kamei

Yojiro Kamei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140365395
    Abstract: Present invention enables to easily exchange the electronic business cards, using smart phones or other type of handheld computers. First, the user sets up an electronic business card in his/her smart phone. This electronic business card is exchanged with other users through the smart phones. Thereby, the user can obtain other users' electronic business cards. The user can also scan a paper business card. The user can organize these received and scanned electronic business cards in his/her smart phone. The data related to the user's and other people's electronic business cards is backed up in a server. Furthermore, various useful functions can be called through the stored electronic business cards. Useful information related to the stored electronic business cards is also provided.
    Type: Application
    Filed: June 8, 2013
    Publication date: December 11, 2014
    Inventors: Alan ARGUELLES, Junji Suzuki, Masamichi Yamasaki, Yojiro Kamei
  • Patent number: 5287307
    Abstract: A semiconductor memory device has a device for reading stored information out of a memory element of a semiconductor by applying a reading voltage onto a word line; and a single word line clamping circuit for controlling the reading voltage applied onto the word line such that the reading voltage is close to a relatively high threshold voltage of the memory element when the reading voltage is applied onto the word line, the word line clamping circuit being commonly disposed on a plurality of word lines.
    Type: Grant
    Filed: January 25, 1991
    Date of Patent: February 15, 1994
    Assignee: Ricoh Company, Ltd.
    Inventors: Minoru Fukuda, Yojiro Kamei, Akihisa Nakano
  • Patent number: 4890151
    Abstract: A method for forming an interconnection pattern of Al on a structure, such as a semiconductor device, includes the step of introducing ions of a selected material, such as As, P, B and Ar, into a film of Al to be formed into an interconnection pattern prior to the step of heat treatment, thereby substantially preventing undesired results, such as hillocks, when the pattern is heat-treated.
    Type: Grant
    Filed: November 29, 1988
    Date of Patent: December 26, 1989
    Assignee: Ricoh Company, Ltd.
    Inventors: Masahiro Kameda, Yojiro Kamei, Kenichi Kurihara