Patents by Inventor Yoko Watanabe
Yoko Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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PARTITION MEMBER, ASSEMBLED BATTERY AND METHOD FOR CONTROLLING HEAT TRANSFER IN AN ASSEMBLED BATTERY
Publication number: 20240072325Abstract: A partition member has two surfaces in a thickness direction, and separates single cells that make up an assembled battery. When the average temperature of one of the two surfaces exceeds 180° C., a thermal resistance per unit area (?1) in the thickness direction satisfies Expression 1 below, and when the average temperatures of both of the two surfaces do not exceed 80° C., a thermal resistance per unit area (?2) in the thickness direction satisfies Expression 2 below. ?1?5.0×10?3(m2·K/W)??(Expression 1), and ?2?4.0×10?3(m2·K/W)??(Expression 2).Type: ApplicationFiled: November 2, 2023Publication date: February 29, 2024Applicant: Mitsubishi Chemical CorporationInventors: Yoko WATANABE, Tomohiro KAWAI, Iwao SOGA -
Patent number: 11901535Abstract: A partition member which partitions between a pair of unit batteries or a partition member which partitions between a unit battery and a member other than the unit battery, the thermal resistances ?d1, ?d2, ?p1, and ?p2 of the partition member satisfy (?p1/?p2)/(?d1/?d2)?1.0×10?4.Type: GrantFiled: May 29, 2020Date of Patent: February 13, 2024Assignee: Mitsubishi Chemical CorporationInventors: Yoko Watanabe, Tomohiro Kawai
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Partition member, assembled battery and method for controlling heat transfer in an assembled battery
Patent number: 11837705Abstract: A partition member has two surfaces in a thickness direction, and separates single cells that make up an assembled battery. When the average temperature of one of the two surfaces exceeds 180° C., a thermal resistance per unit area (?1) in the thickness direction satisfies Expression 1 below, and when the average temperatures of both of the two surfaces do not exceed 80° C., a thermal resistance per unit area (?2) in the thickness direction satisfies Expression 2 below. ? 1 ? 5. × 10 - 3 ? ( m 2 · K / W ) , and ( Expression ? 1 ) ? 2 ? 4. × 10 - 3 ? ( m 2 · K / W ) ( Expression ? 2 ) .Type: GrantFiled: March 25, 2022Date of Patent: December 5, 2023Assignee: Mitsubishi Chemical CorporationInventors: Yoko Watanabe, Tomohiro Kawai, Iwao Soga -
Publication number: 20230322616Abstract: The present disclosure provides a coating-attached glass article having improved easy-to-clean properties. The provided coating-attached glass article includes a glass substrate and an easy-to-clean coating on the glass substrate. The coating includes cerium oxide, and a contact angle of water on a surface of the coating is 60° or more and 130° or less. The coating improves, for example, the ease of removal of dirt resulting from a water drop adhered to the surface. The glass substrate may be formed of a reinforced glass.Type: ApplicationFiled: August 20, 2021Publication date: October 12, 2023Inventor: Yoko WATANABE
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Publication number: 20230231226Abstract: A partition member has a thickness direction and a surface direction perpendicular to the thickness direction, and which separates single cells that make up an assembled battery in the thickness direction, or a single cell that makes up the assembled battery in the thickness direction and a member other than the single cells. The partition member includes, in the interior thereof, a fluid having a boiling point at normal pressure of 80° C. to 250° C., and a flow channel of the fluid extending along the surface direction. The fluid is held in a fluid holding part, and the fluid holding part is hermetically sealed by a packaging material.Type: ApplicationFiled: March 13, 2023Publication date: July 20, 2023Applicant: Mitsubishi Chemical CorporationInventors: Tomohiro KAWAI, Yoko WATANABE, Iwao SOGA
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Publication number: 20230192538Abstract: The present disclosure provides a glass substrate to which water repellency that is not lost by a heat treatment is imparted. Provided is a water-repellent-film-attached glass article including a glass substrate and a water-repellent film on the glass substrate. The water-repellent film includes cerium oxide, a contact angle of water on a surface of the water-repellent film is 75° or greater, and the contact angle is 75° or greater after the glass article is exposed to a thermal treatment at 760° C. for 4 minutes.Type: ApplicationFiled: July 13, 2021Publication date: June 22, 2023Inventors: Patricia Elena McNEIL, Yoko WATANABE
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Patent number: 11626635Abstract: A partition member has a thickness direction and a surface direction perpendicular to the thickness direction, and which separates single cells that make up an assembled battery in the thickness direction, or a single cell that makes up the assembled battery in the thickness direction and a member other than the single cells. The partition member includes, in the interior thereof, a fluid having a boiling point at normal pressure of 80° C. to 250° C., and a flow channel of the fluid extending along the surface direction. The fluid is held in a fluid holding part, and the fluid holding part is hermetically sealed by a packaging material.Type: GrantFiled: September 16, 2019Date of Patent: April 11, 2023Assignee: Mitsubishi Chemical CorporationInventors: Tomohiro Kawai, Yoko Watanabe, Iwao Soga
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PARTITION MEMBER, ASSEMBLED BATTERY AND METHOD FOR CONTROLLING HEAT TRANSFER IN AN ASSEMBLED BATTERY
Publication number: 20220223946Abstract: A partition member has two surfaces in a thickness direction, and separates single cells that make up an assembled battery. When the average temperature of one of the two surfaces exceeds 180° C., a thermal resistance per unit area (?1) in the thickness direction satisfies Expression 1 below, and when the average temperatures of both of the two surfaces do not exceed 80° C., a thermal resistance per unit area (?2) in the thickness direction satisfies Expression 2 below. ? 1 ? 5.0 × 10 - 3 ? ( m 2 · K / W ) , and ( Expression ? ? 1 ) ? 2 ? 4.0 × 10 - 3 ? ( m 2 · K / W ) .Type: ApplicationFiled: March 25, 2022Publication date: July 14, 2022Applicant: Mitsubishi Chemical CorporationInventors: Yoko WATANABE, Tomohiro KAWAI, Iwao SOGA -
Publication number: 20200295416Abstract: A partition member which partitions between a pair of unit batteries or a partition member which partitions between a unit battery and a member other than the unit battery, the thermal resistances ?d1, ?d2, ?p1, and ?p2 defined as follows satisfy Expression below. (?p1/?p2)/(?d1/?d2)?1.Type: ApplicationFiled: May 29, 2020Publication date: September 17, 2020Applicant: Mitsubishi Chemical CorporationInventors: Yoko WATANABE, Tomohiro KAWAI
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Publication number: 20200058972Abstract: A partition member has a thickness direction and a surface direction perpendicular to the thickness direction, and which separates single cells that make up an assembled battery in the thickness direction, or a single cell that makes up the assembled battery in the thickness direction and a member other than the single cells. The partition member includes, in the interior thereof, a fluid having a boiling point at normal pressure of 80° C. to 250° C., and a flow channel of the fluid extending along the surface direction. The fluid is held in a fluid holding part, and the fluid holding part is hermetically sealed by a packaging material.Type: ApplicationFiled: September 16, 2019Publication date: February 20, 2020Applicant: Mitsubishi Chemical CorporationInventors: Tomohiro Kawai, Yoko Watanabe, lwao Soga
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PARTITION MEMBER, ASSEMBLED BATTERY AND METHOD FOR CONTROLLING HEAT TRANSFER IN AN ASSEMBLED BATTERY
Publication number: 20190319223Abstract: A partition member has two surfaces in a thickness direction, and separates single cells that make up an assembled battery. When the average temperature of one of the two surfaces exceeds 180° C., a thermal resistance per unit area (?1) in the thickness direction satisfies Expression 1 below, and when the average temperatures of both of the two surfaces do not exceed 80° C., a thermal resistance per unit area (?2) in the thickness direction satisfies Expression 2 below. ?1?5.0×10?3 (m2·K/W)??(Expression 1), and ?2?4.0×10?3 (m2·K/W)??(Expression 2).Type: ApplicationFiled: June 26, 2019Publication date: October 17, 2019Applicant: Mitsubishi Chemical CorporationInventors: Yoko WATANABE, Tomohiro KAWAI, lwao SOGA -
Patent number: 9724762Abstract: A surface-coated cutting tool with a hard coating layer exhibits excellent chipping resistance and wear resistance in a high-speed cutting process. The surface-coated cutting tool comprises a lower layer consisting of a titanium compound layer and an upper layer consisting of an aluminum oxide layer deposited on a surface of a tool substrate constituted of a tungsten carbide-based cemented carbide as a hard coating layer. In the upper layer, a (006) plane texture coefficient TC(006) is 1.8 or more, a ratio I(104)/I(110) of a peak intensity I(104) of an (104) plane to a peak intensity I(110) of an (110) plane is in a range of 0.5 to 2.0, and furthermore, an absolute value of a residual stress in the aluminum oxide layer is 100 MPa or less.Type: GrantFiled: December 20, 2012Date of Patent: August 8, 2017Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Akira Sobana, Shin Nishida, Takahiro Okuyama, Yoko Watanabe
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Publication number: 20150359238Abstract: Provided are a yoghurt material for making a homemade yoghurt at home and a yoghurt making method using the yoghurt material. The powdery yoghurt material comprises: a milk powder and a lactic acid bacterium fermented at an ordinary temperature, wherein the powdery yoghurt material is converted into a yoghurt when the material to which water was added is fermented. The powdery yoghurt material further comprises a casein powder, an oligosaccharide and a propionic acid bacterium. The milk powder includes a whey as a main ingredient. Additionally, provided is a yoghurt making method using such a powdery yoghurt material.Type: ApplicationFiled: August 25, 2015Publication date: December 17, 2015Inventors: Hiromasa SUZUKI, Masahito ISHIKAWA, Yoko WATANABE
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Publication number: 20140377024Abstract: A surface-coated cutting tool with a hard coating layer exhibits excellent chipping resistance and wear resistance in a high-speed cutting process. The surface-coated cutting tool comprises a lower layer consisting of a titanium compound layer and an upper layer consisting of an aluminum oxide layer deposited on a surface of a tool substrate constituted of a tungsten carbide-based cemented carbide as a hard coating layer. In the upper layer, a (006) plane texture coefficient TC(006) is 1.8 or more, a ratio I(104)/I(110) of a peak intensity I(104) of an (104) plane to a peak intensity I(110) of an (110) plane is in a range of 0.5 to 2.0, and furthermore, an absolute value of a residual stress in the aluminum oxide layer is 100 MPa or less.Type: ApplicationFiled: December 20, 2012Publication date: December 25, 2014Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Akira Sobana, Shin Nishida, Takahiro Okuyama, Yoko Watanabe
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Patent number: 8153454Abstract: A fabrication apparatus and fabrication method of a semiconductor device are provided, allowing the temperature distribution of a substrate to be rendered uniform. The fabrication apparatus for a semiconductor device includes a susceptor holding the substrate, a heater arranged at a back side of the susceptor, a support member located between the substrate and susceptor, including a support portion, and a spacer located between the susceptor and support member. The spacer has an opening formed corresponding to the site where said support portion is located, at an opposite face side of the support member.Type: GrantFiled: September 12, 2008Date of Patent: April 10, 2012Assignee: Sumitomo Electric Industries, Ltd.Inventors: Masaki Ueno, Toshio Ueda, Yoko Watanabe
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Patent number: 7655377Abstract: An antireflection film wherein, even where exposure light enters obliquely in a liquid immersion lithography technique, a sufficiently reduced reflectance can be achieved at the interface between a resist layer and a silicon substrate. A two-layer antireflection film is used in exposure by an exposure system having a wavelength of 190 to 195 nm and a numerical aperture of 1.0 or less and formed between the resist layer and the silicon substrate. Where complex refractive indices N1 and N2 and film thicknesses of upper and lower layers of the antireflection film are represented by n1-k1i, n2-k2i and d1, d2, respectively, and a predetermined combination of values of [n10, k10, d10, n20, k20, d20] is selected, n1, k1, d1, n2, k2 and d2 satisfy {(n1-n10)/(n1m-n10)}2+{(k1-k10)/(k1m-k10)}2+{(d1-d10)/(d1m-d10)}2+{(n2-n20)/(n2m-n20)}2+{(k2-k20)/(k2m-k20)}2+{(d2-d20)/(d2m-d20)}2?1.Type: GrantFiled: February 23, 2006Date of Patent: February 2, 2010Assignee: Sony CorporationInventors: Nobuyuki Matsuzawa, Yoko Watanabe, Boontarika Thunnakart, Ken Ozawa, Yuko Yamaguchi
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Patent number: 7582411Abstract: An antireflective film is provided between a resist layer and a silicon oxide layer formed on a surface of a silicon substrate, for exposure of the resist layer in an exposure system having a wavelength of 190 nm to 195 nm and a numerical aperture NA of 0.93 to 1.2. Assuming that the complex refractive indexes of upper and lower layers constituting the antireflective film are N1 (=n1?k1i) and N2 (=n2?k2i), respectively, and the thicknesses of both layers are d1 and d2, when a predetermined combination of values of [n10, k10, d10, n20, k20, d20] is selected, n1, k1, d1, n2, k2, and d2 satisfy the relational expression {(n1?n10)/(n1m?n10)}2+{(k1?k10)/(k1m?k10)}2+{(d1?d10)/(d1m?d10)}2+{(n2?n20)/(n2m?n20)}2+{(k2?k20)/(k2m?k20)}2+{(d2?d20)/(d2m?d20)}2?1.Type: GrantFiled: August 29, 2006Date of Patent: September 1, 2009Assignee: Sony CorporationInventors: Nobuyuki Matsuzawa, Yoko Watanabe, Boontarika Thunnakart, Ken Ozawa
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Publication number: 20090075409Abstract: A fabrication apparatus and fabrication method of a semiconductor device are provided, allowing the temperature distribution of a substrate to be rendered uniform. The fabrication apparatus for a semiconductor device includes a susceptor holding the substrate, a heater arranged at a back side of the susceptor, a support member located between the substrate and susceptor, including a support portion, and a spacer located between the susceptor and support member. The spacer has an opening formed corresponding to the site where said support portion is located, at an opposite face side of the support member.Type: ApplicationFiled: September 12, 2008Publication date: March 19, 2009Applicant: Sumitomo Electric Industries, Ltd.Inventors: Masaki UENO, Toshio UEDA, Yoko WATANABE
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Patent number: 7496034Abstract: A packet transmission device improved in packet transmission efficiency. Each packet input processor generates a pointer and identifies a packet type with respect to a received packet, and generates identification data including the pointer and the packet type identification result. A memory access controller detects a header readout amount of the packet based on the packet type identification result, generates first readout data including the header readout amount and a readout pointer indicative of a storage location of the packet in a shared memory, and adaptively reads out header data of the packet from the shared memory in accordance with the first readout data. A protocol processor analyzes the destination of the read header data, and a packet updater updates the old destination address of the packet to a new one to generate a packet with the updated destination address, and outputs the generated packet.Type: GrantFiled: March 11, 2005Date of Patent: February 24, 2009Assignee: Fujitsu LimitedInventors: Hideyo Fukunaga, Katsumi Imamura, Yasushi Kurokawa, Hideyuki Kudou, Yoko Watanabe
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Patent number: 7247410Abstract: A complementary division method able to suppress a pattern deformation by wet washing, having the steps of determining a definite division length able to suppress the pattern deformation when wet washing to a width and distance of a pattern that is assumed the pattern deformation over an elasticity limit is easiest given by wet washing in advance, dividing the entire line-and-space patterns at the determined division length in the longitudinal direction to divide suitably the line-and-space pattern by a simple algorithm, and further providing a method of producing a mask and program.Type: GrantFiled: July 7, 2004Date of Patent: July 24, 2007Assignee: Sony CorporationInventors: Yoko Watanabe, Shinji Omori