Abstract: Provided are a device whereby, during process of a process target such as a cell or the like, localized process of a process part is possible without inflicting damage due to heat, and rejoining and regeneration may proceed readily subsequent to process, and whereby an injection substance may be introduced efficiently; and a device for generating bubbles containing a plasma. Through the use of a localized ablation device employing a bubble jetting member having a core formed from a conductive material, a shell part formed from an insulating material, covering the core and including a section extending from the tip of the core, and a space formed between the extended section of the shell part and the tip of the core, a process target can be treated in localized fashion and without inflicting damage.

Abstract: A method that can plate a predetermined position on various plating targets without implementing a pretreatment thereon is provided. A plating method is performed on a plating target using a plating solution, and the plating method includes at least a bubble ejection step of ejecting a bubble generated by a bubble ejection member to a plating solution. The bubble ejection member includes an electrode formed of a conductive material and an insulating material covering at least a part of the electrode, at least a part of the insulating material forms a bubble ejection port, and an air gap surrounded by the insulating material is formed between at least a part of the electrode and the bubble ejection port.

Abstract: The present invention addresses the problem of providing a bubble ejection method based on a new principle that is different from conventional bubble ejection methods and a bubble ejecting device. To solve the problem, provided is a bubble ejection method using a bubble ejecting device, wherein the bubble ejecting device comprises a substrate formed of a dielectric, at least one bubble ejection hole formed so as to penetrate through a first face and a second face, which is a face opposite to the first face, of the substrate, a first opening formed at a position of the first face at which the bubble ejection hole penetrates, and a second opening formed at a position of the second face at which the bubble ejection hole penetrates, the bubble ejection method comprising: a substrate-conductive liquid contact step; a conductive liquid-electrode contact step; a voltage application step; and a bubble ejection step.

Abstract: The present invention enables fabrication and mass production of a bubble-jetting chip that includes a desired number of bubble jetting portions of the same size having bubble-jetting outlets of the same size. Mass production is enabled by fabricating a bubble-jetting chip comprising a substrate and a bubble-jetting portion formed on the substrate, the bubble-jetting portion comprising: an electrode that is formed of a conductive material; an insulating portion that is formed of an insulating photosensitive resin, is provided so as to sandwich the electrode, and includes an extended section that extends beyond the tip of the electrode; and a space that is formed between the extended section of the insulating portion and the tip of the electrode.

Abstract: Provided are a device whereby, during process of a process target such as a cell or the like, localized process of a process part is possible without inflicting damage due to heat, and rejoining and regeneration may proceed readily subsequent to process, and whereby an injection substance may be introduced efficiently; and a device for generating bubbles containing a plasma. Through the use of a localized ablation device employing a bubble jetting member having a core formed from a conductive material, a shell part formed from an insulating material, covering the core and including a section extending from the tip of the core, and a space formed between the extended section of the shell part and the tip of the core, a process target can be treated in localized fashion and without inflicting damage.

Abstract: A method that can plate a predetermined position on various plating targets without implementing a pretreatment thereon is provided. A plating method is performed on a plating target using a plating solution, and the plating method includes at least a bubble ejection step of ejecting a bubble generated by a bubble ejection member to a plating solution. The bubble ejection member includes an electrode formed of a conductive material and an insulating material covering at least a part of the electrode, at least a part of the insulating material forms a bubble ejection port, and an air gap surrounded by the insulating material is formed between at least a part of the electrode and the bubble ejection port.

Abstract: Provided are a device whereby, during process of a process target such as a cell or the like, localized process of a process part is possible without inflicting damage due to heat, and rejoining and regeneration may proceed readily subsequent to process, and whereby an injection substance may be introduced efficiently; and a device for generating bubbles containing a plasma. Through the use of a localized ablation device employing a bubble jetting member having a core formed from a conductive material, a shell part formed from an insulating material, covering the core and including a section extending from the tip of the core, and a space formed between the extended section of the shell part and the tip of the core, a process target can be treated in localized fashion and without inflicting damage.

Abstract: Provided are a protein crystal device and method for crystallizing protein capable of generating protein crystal without imparting a heat effect, a protein crystal-cutting device and method for cutting protein crystal capable of cutting protein crystal without imparting a heat effect on protein crystal, and bubble-jetting member and protein-adsorbing-bubble-jetting member used in said device. A bubble-jetting member is used in a protein crystal device to jet bubbles into a protein solution to thereby allow protein crystals to be obtained, the bubble-jetting member comprising: a core formed of a conductive material; a shell part formed of an insulating material, including an extended section extending from the tip of the core, and in which at least a portion closely adheres to the core to cover the core; and a gap having a bubble-jetting port, the gap being formed between the extended section and the tip of the core.

Abstract: Provided is a bubble-jetting member, the tip section of which is not damaged even when high voltage is applied thereto. There can be provided a bubble jetting member comprising: a core that is formed of a conductive material; a shell part that is formed of an insulating material, includes an extended section that extends beyond the tip of the core, and is closely adhered at least partially to the core and covers the core; and a space that is formed between the extended section and the tip of the core and has a bubble-jetting port, wherein there is formed on the tip of the extended section a thick portion that is thicker than the rest of the extended section whereby the tip section is not damaged.

Abstract: A bubble-jetting chip capable of jetting bubbles upward from a substrate is provided. Bubbles can be jetted upward from a substrate by a bubble-jetting chip comprising: at least a substrate, an energizing portion, and a bubble-jetting portion; the energizing portion being formed on the substrate; the bubble-jetting portion comprising an electrode that is formed of a conductive material, a shell part formed of an insulating photosensitive resin, and an extended section that extends from the shell part, the shell part covering a periphery of the electrode, the extended section extending beyond a tip of the electrode, and the bubble-jetting portion further comprising a space formed between the extended section and the electrode; and the electrode of the bubble-jetting portion being formed on the energizing portion.

Abstract: The present invention enables fabrication and mass production of a bubble-jetting chip that includes a desired number of bubble jetting portions of the same size having bubble-jetting outlets of the same size. Mass production is enabled by fabricating a bubble-jetting chip comprising a substrate and a bubble-jetting portion formed on the substrate, the bubble-jetting portion comprising: an electrode that is formed of a conductive material; an insulating portion that is formed of an insulating photosensitive resin, is provided so as to sandwich the electrode, and includes an extended section that extends beyond the tip of the electrode; and a space that is formed between the extended section of the insulating portion and the tip of the electrode.

Abstract: Provided is a bubble-jetting member, the tip section of which is not damaged even when high voltage is applied thereto. There can be provided a bubble jetting member comprising: a core that is formed of a conductive material; a shell part that is formed of an insulating material, includes an extended section that extends beyond the tip of the core, and is closely adhered at least partially to the core and covers the core; and a space that is formed between the extended section and the tip of the core and has a bubble-jetting port, wherein there is formed on the tip of the extended section a thick portion that is thicker than the rest of the extended section whereby the tip section is not damaged.

Abstract: Provided are a protein crystal device and method for crystallizing protein capable of generating protein crystal without imparting a heat effect, a protein crystal-cutting device and method for cutting protein crystal capable of cutting protein crystal without imparting a heat effect on protein crystal, and bubble-jetting member and protein-adsorbing-bubble-jetting member used in said device. A bubble-jetting member is used in a protein crystal device to jet bubbles into a protein solution to thereby allow protein crystals to be obtained, the bubble-jetting member comprising: a core formed of a conductive material; a shell part formed of an insulating material, including an extended section extending from the tip of the core, and in which at least a portion closely adheres to the core to cover the core; and a gap having a bubble-jetting port, the gap being formed between the extended section and the tip of the core.

Abstract: Provided are a device whereby, during process of a process target such as a cell or the like, localized process of a process part is possible without inflicting damage due to heat, and rejoining and regeneration may proceed readily subsequent to process, and whereby an injection substance may be introduced efficiently; and a device for generating bubbles containing a plasma. Through the use of a localized ablation device employing a bubble jetting member having a core formed from a conductive material, a shell part formed from an insulating material, covering the core and including a section extending from the tip of the core, and a space formed between the extended section of the shell part and the tip of the core, a process target can be treated in localized fashion and without inflicting damage.