Abstract: The present disclosure relates to a battery, and more particularly to a battery electrode. According to some implementations of the present disclosure, a method for manufacturing a battery electrode includes: forming a mixture of a polymer powder and an active material into a fiber; weaving the fiber into a woven film; and carbonizing the woven film.

Abstract: A micro-resonator includes a first electrode positioned on a piezoelectric plate at a first end of the piezoelectric plate, the first electrode including a first set of fingers and a second electrode positioned on the piezoelectric plate at a second end of the piezoelectric plate. The second electrode including a second set of fingers interdigitated with the first set of fingers with an overlapping distance without touching the first set of fingers, the overlapping distance being less than seven-tenths the length of one of the first set of fingers or the second set of fingers. At least one of the first end or the second end of the piezoelectric plate may define a curved shape.

Abstract: A micro-resonator includes a first electrode positioned on a piezoelectric plate at a first end of the piezoelectric plate, the first electrode including a first set of fingers and a second electrode positioned on the piezoelectric plate at a second end of the piezoelectric plate. The second electrode including a second set of fingers interdigitated with the first set of fingers with an overlapping distance without touching the first set of fingers, the overlapping distance being less than seven-tenths the length of one of the first set of fingers or the second set of fingers. At least one of the first end or the second end of the piezoelectric plate may define a curved shape.

Abstract: A micro-resonator includes a first electrode positioned on a piezoelectric plate at a first end of the piezoelectric plate, the first electrode including a first set of fingers and a second electrode positioned on the piezoelectric plate at a second end of the piezoelectric plate. The second electrode including a second set of fingers interdigitated with the first set of fingers with an overlapping distance without touching the first set of fingers, the overlapping distance being less than seven-tenths the length of one of the first set of fingers or the second set of fingers. At least one of the first end or the second end of the piezoelectric plate may define a curved shape.

Abstract: A micro-resonator includes a first electrode positioned on a piezoelectric plate at a first end of the piezoelectric plate, the first electrode including a first set of fingers and a second electrode positioned on the piezoelectric plate at a second end of the piezoelectric plate. The second electrode including a second set of fingers interdigitated with the first set of fingers with an overlapping distance without touching the first set of fingers, the overlapping distance being less than seven-tenths the length of one of the first set of fingers or the second set of fingers. At least one of the first end or the second end of the piezoelectric plate may define a curved shape.

Abstract: Presented is a mechanical switch that may include a first electrode; a second electrode spaced apart from the first electrode; a first material electrically connected to the first electrode; and a second material electrically connected to the first electrode. Any one of a hardness, a Young's modulus, a melting point and an insensitivity degree to external contamination of the second material is lower than any corresponding one of a hardness, a Young's modulus a melting point and an insensitivity degree to external contamination of the first material. When the first electrode and the second electrode are electrically connected to each other, after the first material is connected to the second electrode, the second material is connected to the second electrode.

Abstract: Disclosed is a mechanical switch that may include a first electrode; a second electrode spaced apart from the first electrode; a first material electrically connected to the first electrode; and a second material electrically connected to the first electrode. Any one of a hardness, a Young's modulus, a melting point and an insensitivity degree to external contamination of the second material is lower than any corresponding one of a hardness, a Young's modulus a melting point and an insensitivity degree to external contamination of the first material. When the first electrode and the second electrode are electrically connected to each other, after the first material is connected to the second electrode, the second material is connected to the second electrode.

Abstract: A semiconductor device for lowering a triggering voltage includes a semiconductor substrate with a first conductivity; a semiconductor region formed in the substrate having a second conductivity; a first region formed in the substrate, having the first conductivity and being apart from the semiconductor region; a second region formed in the substrate having the second conductivity and being spaced apart from the semiconductor region and first region; a third region formed in the substrate, having the second conductivity and being spaced apart from the semiconductor region, the first and second regions; a fourth region formed in the semiconductor region, having the second conductivity and being connected to the third region through a conductive material; a fifth region formed in the semiconductor region, having the first conductivity and being spaced apart from the fourth region; and a sixth region formed in the semiconductor region, having the second conductivity and being spaced apart from the fourth and fif

Abstract: A semiconductor device for lowering a triggering voltage includes a semiconductor substrate with a first conductivity; a semiconductor region formed in the substrate having a second conductivity; a first region formed in the substrate, having the first conductivity and being apart from the semiconductor region; a second region formed in the substrate having the second conductivity and being spaced apart from the semiconductor region and first region; a third region formed in the substrate, having the second conductivity and being spaced apart from the semiconductor region, the first and second regions; a fourth region formed in the semiconductor region, having the second conductivity and being connected to the third region through a conductive material; a fifth region formed in the semiconductor region, having the first conductivity and being spaced apart from the fourth region; and a sixth region formed in the semiconductor region, having the second conductivity and being spaced apart from the fourth and fif