Patents by Inventor Yong Ha Woo
Yong Ha Woo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240170379Abstract: A packaging substrate according to an embodiment includes a cavity region in which an element is accommodated, and a core substrate in which the cavity region is disposed. The cavity region includes an accommodation portion that is a space formed by recessing a portion of the core substrate, a side surface that is formed on an inner side in a thickness direction of the core substrate and forms an outer periphery of the accommodation portion, and an elastic layer disposed adjacent to the side surface. An elastic modulus of the elastic layer is 2 GPa to 15 GPa. The packaging substrate may have excellent thermomechanical reliability and long-term durability.Type: ApplicationFiled: November 2, 2023Publication date: May 23, 2024Applicant: Absolics Inc.Inventors: Sungjin KIM, YONG HA WOO
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Publication number: 20240162167Abstract: An embodiment relates to a substrate and a semiconductor module. A substrate capable of manufacturing a substrate for packaging, which is an individual product, with excellent yield despite cracks that may occur at edges or side surfaces of a core is provided.Type: ApplicationFiled: November 14, 2023Publication date: May 16, 2024Applicant: Absolics Inc.Inventors: Tae Kyoung KIM, YONG HA WOO, Sungjin KIM, Jun Rok OH
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Patent number: 11246091Abstract: A method for scanning an Access Point (AP) in a portable terminal includes determining whether a request to activate the portable terminal is detected; and upon detecting the request, immediately and additionally scanning an AP independently of a predetermined scan cycle.Type: GrantFiled: April 27, 2020Date of Patent: February 8, 2022Assignee: Samsung Electronics Co., Ltd.Inventor: Yong-Ha Woo
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Publication number: 20200260374Abstract: A method for scanning an Access Point (AP) in a portable terminal includes determining whether a request to activate the portable terminal is detected; and upon detecting the request, immediately and additionally scanning an AP independently of a predetermined scan cycle.Type: ApplicationFiled: April 27, 2020Publication date: August 13, 2020Inventor: Yong-Ha WOO
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Patent number: 10681628Abstract: A method for scanning an Access Point (AP) in a portable terminal includes determining whether a request to activate the portable terminal is detected; and upon detecting the request, immediately and additionally scanning an AP independently of a predetermined scan cycle.Type: GrantFiled: June 20, 2018Date of Patent: June 9, 2020Assignee: Samsung Electronics Co., Ltd.Inventor: Yong-Ha Woo
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Publication number: 20180302860Abstract: A method for scanning an Access Point (AP) in a portable terminal includes determining whether a request to activate the portable terminal is detected; and upon detecting the request, immediately and additionally scanning an AP independently of a predetermined scan cycle.Type: ApplicationFiled: June 20, 2018Publication date: October 18, 2018Inventor: Yong-Ha WOO
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Patent number: 9362248Abstract: A coreless package structure and a method for manufacturing same includes the steps of providing a supporting substrate comprising an etching resist layer and a copper foil. A groove is defined in the copper foil and a plurality of contact pads are formed on the surface of the copper foil. A chip including a plurality of electrode pads is received in the groove and a packaging layer is formed on a side of the copper foil. An insulating layer and a conductive pattern layer are formed on the packaging layer in that order, the conductive pattern layer being electrically connected to the contact pads and the electrode pads by a plurality of conductive bumps. Finally, the etching resist layer and the copper foil are removed to obtain a coreless package structure.Type: GrantFiled: July 15, 2014Date of Patent: June 7, 2016Assignee: Zhen Ding Technology Co., Ltd.Inventors: Yong Ha Woo, E-Tung Chou, Wen-Lun Lo
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Publication number: 20150380391Abstract: A packaging substrate includes a circuit board, a number of first conductive posts, and a number of second conductive posts. The circuit board includes a first base and a first conductive pattern layer formed on a first surface of the first base. The first conductive posts extend from and are electrically connected to the first conductive pattern layer. The second conductive posts extend from and are electrically connected to the first conductive pattern layer. The height of each of the second conductive posts is larger than that of each of the first conductive posts. A manufacturing method thereof is also provided.Type: ApplicationFiled: September 9, 2015Publication date: December 31, 2015Inventors: Yong HA WOO, E-Tung CHOU, Wen-Lun LO
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Patent number: 9173298Abstract: A packaging substrate includes a circuit board, a number of first conductive posts, and a number of second conductive posts. The circuit board includes a first base and a first conductive pattern layer formed on a first surface of the first base. The first conductive posts extend from and are electrically connected to the first conductive pattern layer. The second conductive posts extend from and are electrically connected to the first conductive pattern layer. The height of each of the second conductive posts are larger than that of each of the first conductive posts.Type: GrantFiled: December 5, 2013Date of Patent: October 27, 2015Assignee: Zhen Ding Technology Co., Ltd.Inventors: Yong Ha Woo, E-Tung Chou, Wen-Lun Lo
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Patent number: 9165790Abstract: A packaging substrate includes a base layer, a first wiring layer, a second wiring layer, a first solder mask layer, a second solder mask layer and copper portions. The first second wiring layers are arranged on opposite sides of the base layer. The first solder mask layer covers the first wiring layer, and defines plenty of first openings. The first wiring layer exposed through the first openings serves as first contact pads. The second solder mask layer covers the second wiring layer. The second solder mask layer defines plenty of second openings. The second wiring layer exposed through the second openings serves as second contact pads. The copper portions are formed on the second contact pads. The copper portions protrude beyond the second solder mask layer. This disclosure further relates to a method of manufacturing the packaging substrate and a chip packaging body.Type: GrantFiled: August 15, 2013Date of Patent: October 20, 2015Assignee: Zhen Ding Technology Co., Ltd.Inventors: Yong Ha Woo, E-Tung Chou, Wen-Lun Lo
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Patent number: 8953568Abstract: A roaming method and a data transmission system for a portable terminal in a Wireless Local Area Network (WLAN) are provided. The method includes transitioning to an active mode, by a control unit in a standby mode in response to a request from a WLAN module during roaming from a first Access Point (AP) to a second AP, and performing authentication in conjunction with a server, by the control unit in the active mode. As a result, when a portable terminal roams in a WLAN, the network connection is not disrupted.Type: GrantFiled: June 16, 2009Date of Patent: February 10, 2015Assignee: Samsung Electronics Co., Ltd.Inventor: Yong Ha Woo
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Publication number: 20150014849Abstract: A coreless package structure and a method for manufacturing same includes the steps of providing a supporting substrate comprising an etching resist layer and a copper foil. A groove is defined in the copper foil and a plurality of contact pads are formed on the surface of the copper foil. A chip including a plurality of electrode pads is received in the groove and a packaging layer is formed on a side of the copper foil. An insulating layer and a conductive pattern layer are formed on the packaging layer in that order, the conductive pattern layer being electrically connected to the contact pads and the electrode pads by a plurality of conductive bumps. Finally, the etching resist layer and the copper foil are removed to obtain a coreless package structure.Type: ApplicationFiled: July 15, 2014Publication date: January 15, 2015Inventors: YONG HA WOO, E-TUNG CHOU, WEN-LUN LO
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Publication number: 20140185259Abstract: A packaging substrate includes a circuit board, a number of first conductive posts, and a number of second conductive posts. The circuit board includes a first base and a first conductive pattern layer formed on a first surface of the first base. The first conductive posts extend from and are electrically connected to the first conductive pattern layer. The second conductive posts extend from and are electrically connected to the first conductive pattern layer. The height of each of the second conductive posts are larger than that of each of the first conductive posts.Type: ApplicationFiled: December 5, 2013Publication date: July 3, 2014Applicant: ZHEN DING TECHNOLOGY CO., LTD.Inventors: YONG HA WOO, E-TUNG CHOU, WEN-LUN LO
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Publication number: 20140117553Abstract: A packaging substrate includes a base layer, a first wiring layer, a second wiring layer, a first solder mask layer, a second solder mask layer and copper portions. The first second wiring layers are arranged on opposite sides of the base layer. The first solder mask layer covers the first wiring layer, and defines plenty of first openings. The first wiring layer exposed through the first openings serves as first contact pads. The second solder mask layer covers the second wiring layer. The second solder mask layer defines plenty of second openings. The second wiring layer exposed through the second openings serves as second contact pads. The copper portions are formed on the second contact pads. The copper portions protrude beyond the second solder mask layer. This disclosure further relates to a method of manufacturing the packaging substrate and a chip packaging body.Type: ApplicationFiled: August 15, 2013Publication date: May 1, 2014Applicant: ZHEN DING TECHNOLOGY CO., LTD.Inventors: YONG HA WOO, E-TUNG CHOU, WEN-LUN LO
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Patent number: 8161302Abstract: An Apparatus, method, and system for transmitting data in a Wireless Local Access Network (WLAN) in a power management state are provided. The method includes registering a standby state entrance to an Access Point (AP), switching to an active state at a period, determining whether transmission standby data exists in the AP, transmitting, if the transmission standby data exist in the AP, a standby state entrance frame notifying the entrance to the standby state to the AP, transmitting an active request signal requesting a switching to an active state to the CPU, transmitting a signal notifying standby state release to the AP if a signal notifying switch completion to an active state is received from the CPU after the active request signal is transmitted, and receiving transmission standby data from the AP.Type: GrantFiled: April 10, 2009Date of Patent: April 17, 2012Assignee: Samsung Electronics Co., LtdInventor: Yong Ha Woo
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Publication number: 20090312016Abstract: A roaming method and a data transmission system for a portable terminal in a Wireless Local Area Network (WLAN) are provided. The method includes transitioning to an active mode, by a control unit in a standby mode in response to a request from a WLAN module during roaming from a first Access Point (AP) to a second AP, and performing authentication in conjunction with a server, by the control unit in the active mode. As a result, when a portable terminal roams in a WLAN, the network connection is not disrupted.Type: ApplicationFiled: June 16, 2009Publication date: December 17, 2009Applicant: SAMSUNG ELECTRONICS CO. LTD.Inventor: Yong Ha WOO
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Publication number: 20090276646Abstract: An Apparatus, method, and system for transmitting data in a Wireless Local Access Network (WLAN) in a power management state are provided. The method includes registering a standby state entrance to an Access Point (AP), switching to an active state at a period, determining whether transmission standby data exists in the AP, transmitting, if the transmission standby data exist in the AP, a standby state entrance frame notifying the entrance to the standby state to the AP, transmitting an active request signal requesting a switching to an active state to the CPU, transmitting a signal notifying standby state release to the AP if a signal notifying switch completion to an active state is received from the CPU after the active request signal is transmitted, and receiving transmission standby data from the AP.Type: ApplicationFiled: April 10, 2009Publication date: November 5, 2009Applicant: Samsung Electronics Co., Ltd.Inventor: Yong Ha Woo