Patents by Inventor Yong-Ho Kim

Yong-Ho Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230220390
    Abstract: Provided are structural properties of double-stranded RNA molecules for inducing RNA interference, and more specifically, a novel nucleic acid molecule structure for inducing RNAi with improved stability, and a use thereof. A nucleic acid molecule for inducing RNAi provided herein is capable of significantly improving stability of a double-stranded RNA molecule in vivo while maintaining inhibition efficiency for a target gene, and therefore, as a expandable platform for targeting various genes, the RNA nucleic acid molecule is expected to replace siRNA molecules in the art, and be usefully utilized in the field of diagnosis or treatment of various diseases in research and clinical fields.
    Type: Application
    Filed: June 26, 2020
    Publication date: July 13, 2023
    Applicant: IMNEWRUN, INC.
    Inventors: Yong Ho KIM, Jae Cheol LEE, Minah SUH, Han Joo KIM, Euna LEE, Ji Young NAM, Soo Yeon LEE, Bok Soo LEE
  • Publication number: 20230206851
    Abstract: A gate driving circuit that can be stably driven by improving output characteristics of a last output buffer unit, and a display device comprising the gate driving circuit, are discussed. The gate driving circuit can include a plurality of subordinately connected stages, where an Nth (N being a natural number) stage includes a node controller configured to control voltages of a first node and a second node according to a set signal and a reset signal. The Nth stage can further include a plurality of scan pulse output units configured to receive a plurality of scan clocks, and output each of the scan clocks as a scan pulse according to voltages of the first node and the second node.
    Type: Application
    Filed: October 7, 2022
    Publication date: June 29, 2023
    Applicant: LG Display Co., Ltd.
    Inventors: Jae Sung PARK, Yong Ho KIM
  • Publication number: 20230197683
    Abstract: A semiconductor package includes a redistribution layer including, a first insulating layer including a first trench, a first conductive layer including a first conductive region extending along a top surface of the first insulating layer and a second conductive region disposed inside the first trench, a second insulating layer on the first conductive layer and the first insulating layer, the second insulating layer including a second trench at least partially overlapping the first trench, the second trench exposing a part of the first conductive region and a second conductive layer including a third conductive region extending along a top surface of the second insulating layer and a fourth conductive region disposed on the second conductive region inside a via trench including sidewalls of the first trench and the second trench, and wherein the second and fourth conductive regions have a width in a range of 20 ?m to 600 ?m.
    Type: Application
    Filed: February 15, 2023
    Publication date: June 22, 2023
    Applicant: Samsung Electronics Co., Ltd.
    Inventor: Yong Ho KIM
  • Publication number: 20230170755
    Abstract: A motor includes: a stator including assemblies; and a rotor disposed on one side of the stator. Each of the assemblies includes: a bobbin; a core inserted into the bobbin; and a coil surrounding an outside of the bobbin. The bobbin includes: a main through hole into which the core is inserted; and a sub-through hole disposed in either one of a top surface and a bottom surface on one side of the main through hole. An inner space of the bobbin is communication with the outside of the bobbin through the sub-through hole.
    Type: Application
    Filed: January 13, 2023
    Publication date: June 1, 2023
    Applicant: HYUNDAI MOBIS CO., LTD.
    Inventors: Yeong Woo SEO, Hye Seong YANG, Yong Ho KIM, Ui Il JEONG
  • Publication number: 20230155641
    Abstract: Disclosed are a method and a device for indicating data transmission in a communication system supporting multiple links. A first device operating method comprises: generating a data frame including first information indicating a communication method in multiple links including a first link and a second link; transmitting the data frame to a second device in the multiple links; and receiving an ACK frame for the data frame from the second device in one or more links from among the multiple links.
    Type: Application
    Filed: April 29, 2021
    Publication date: May 18, 2023
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, KOREA NATIONAL UNIVERSITY OF TRANSPORTATION INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventor: Yong Ho Kim
  • Publication number: 20230155460
    Abstract: Provided is a device for manufacturing a stator, the device including a winding jig configured to wind a coil and to manufacture a winding coil, and an insertion jig configured to receive the winding coil from the winding jig and to insert the winding coil into a stator core, wherein the winding jig comprises a body extending along a longitudinal direction (L1), a power supply unit configured to make the body revolve around a central shaft of the body, and a protrusion formed on a surface of the body.
    Type: Application
    Filed: March 28, 2022
    Publication date: May 18, 2023
    Applicants: HYUNDAI MOBIS CO., LTD., HAYASHI KOGYOSYO Co., Ltd.
    Inventors: Yong Ho KIM, Min Mo KOO, Ko KAJITA
  • Publication number: 20230155457
    Abstract: Discloses is a method of manufacturing a stator and a jig for manufacturing a stator. An exemplary embodiment of the present disclosure provides a method of manufacturing a stator, the method including a preparation step of preparing a coil material and a stator core having a plurality of slots provided in a circumferential direction C, a winding step of manufacturing a winding coil by winding the coil material, and an insertion step of positioning the winding coil in upper regions of at least some of the plurality of slots and then dropping the winding coil into the slot.
    Type: Application
    Filed: November 15, 2022
    Publication date: May 18, 2023
    Applicants: HYUNDAI MOBIS Co., Ltd., HAYASHI KOGYOSYO Co., Ltd.
    Inventors: Yong Ho KIM, Ko KAJITA
  • Publication number: 20230156795
    Abstract: Disclosed are a method and apparatus for transmitting and receiving data in a communication system supporting multiple links. A method for operation of a first device comprises the steps of: transmitting, in a first link from among multiple links, a first RTS frame to a second device; receiving, from the second device in the first link, a first CTS frame that is a response to the first RTS frame; when the first CTS frame is received, transmitting, in the first link, a first data frame to the second device; and transmitting, in a second link during transmission of the first data frame, a second RTS frame to the second device.
    Type: Application
    Filed: April 2, 2021
    Publication date: May 18, 2023
    Applicants: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, KOREA NATIONAL UNIVERSITY OF TRANSPORTATION INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Sung Hyun HWANG, Kyu Min KANG, Jae Cheol PARK, Jin Hyung OH, Dong Woo LIM, Su Na CHOI, Yong Ho KIM, Han Seul HONG
  • Publication number: 20230144488
    Abstract: The present disclosure relates to novel cell penetrating peptides and uses thereof. Since 12 types of cell-penetrating peptides according to the present disclosure were confirmed to have excellent cell permeability and an excellent substance delivery effect in vitro and in vivo, the cell-penetrating peptides are expected to be useful in the field of research, and in the field of diagnosis or treatment of various diseases, by being capable of effectively delivering a substance with biological activity into the body, such as cells and tissues.
    Type: Application
    Filed: April 28, 2020
    Publication date: May 11, 2023
    Inventors: Han Joo KIM, Minah SUH, Yong Ho KIM, Jae Cheol LEE, Euna LEE, Ji Young NAM, Ho Jae CHOI
  • Publication number: 20230135332
    Abstract: A method and a device are disclosed for direct communication in a wireless local area network (LAN) system. An operation method of an access point comprises the steps of: transmitting a first frame including time information of a first communication period to a first station in order to configure the first communication period; receiving, from the first station, a second frame that is a response frame to the first frame, and configuring the first communication period; and after receiving the second frame, transmitting a third frame including time information of a second communication period to a second station in order to configure the second communication period within the first communication period.
    Type: Application
    Filed: April 13, 2021
    Publication date: May 4, 2023
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, KOREA NATIONAL UNIVERSITY OF TRANSPORTATION INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventor: Yong Ho Kim
  • Publication number: 20230122740
    Abstract: Disclosed are a method and device for transmitting and receiving data in a communication system supporting multiple links. A method of operating a first device comprises: performing an operation for receiving a first frame from a second device in a first link among multiple links; performing a channel access operation to transmit a second frame to the second device in a second link among the multiple links during a period corresponding to the reception period of the first frame; and transmitting the second frame to the second device in the second link “after the channel access operation is completed and the reception period ends”.
    Type: Application
    Filed: March 25, 2021
    Publication date: April 20, 2023
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, KOREA NATIONAL UNIVERSITY OF TRANSPORTATION INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Yong Ho Kim, Han Seul Hong
  • Publication number: 20230123853
    Abstract: An inspection apparatus inspects a pressure vessel using laser ultrasound. The apparatus includes an oscillation device that oscillates an excitation laser for exciting the pressure vessel and a conduit to guide the excitation laser oscillated from the oscillation device to inside the pressure vessel. The conduit is inserted into the pressure vessel with one conduit end located inside the pressure vessel and an opposite end located outside the pressure vessel. The apparatus includes a reflector at one conduit end inside the pressure vessel to reflect the excitation laser guided by the conduit and a detector that detects ultrasonic waves generated in the pressure vessel by the excitation laser reflected by the reflector by oscillating a receiving laser from outside of the pressure vessel. At least the conduit, reflector, or detector moves to correct an optical path of the excitation laser or the receiving laser.
    Type: Application
    Filed: July 7, 2022
    Publication date: April 20, 2023
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Yong Joo Cho, Jung Ryul Lee, Yong Ho Kim
  • Publication number: 20230114284
    Abstract: A method and device are disclosed for channel connection in a wireless communication system supporting multiple links. An operation method for the device comprises the steps of: performing a first back-off operation in a first link among multiple links; stopping the first back-off operation when the first link is determined to be in a busy state due to the first back-off operation; and using a new back-off counter value to perform a second back-off operation in a second link among the multiple links when the second link is in an idle state in a preset period prior to the point in time at which the first back-off operation is stopped.
    Type: Application
    Filed: March 8, 2021
    Publication date: April 13, 2023
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, KOREA NATIONAL UNIVERSITY OF TRANSPORTATION INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Yong Ho Kim, Han Seul Hong
  • Publication number: 20230099844
    Abstract: Provided is a semiconductor package including a first chip substrate including a first surface and a second surface, a through via passing through the first chip substrate, an upper passivation layer including a trench on the second surface of the first chip substrate, the trench exposing at least a portion of the second surface of the first chip substrate, an upper pad electrically connected with the through via on the trench, a second chip substrate including a third surface and a fourth surface, a lower pad electrically connected to the second chip substrate on the third surface of the second chip substrate, and a connection bump electrically connecting the upper pad with the lower pad and contacting the lower pad, wherein a width of the connection bump increases as the connection bump becomes farther away from the first surface of the first chip substrate.
    Type: Application
    Filed: June 2, 2022
    Publication date: March 30, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong Ho KIM, Woo Jin JANG, Jeong Hoon AHN, Yun Ki CHOI
  • Patent number: 11600596
    Abstract: A semiconductor package includes a redistribution layer including, a first insulating layer including a first trench, a first conductive layer including a first conductive region extending along a top surface of the first insulating layer and a second conductive region disposed inside the first trench, a second insulating layer on the first conductive layer and the first insulating layer, the second insulating layer including a second trench at least partially overlapping the first trench, the second trench exposing a part of the first conductive region and a second conductive layer including a third conductive region extending along a top surface of the second insulating layer and a fourth conductive region disposed on the second conductive region inside a via trench including sidewalls of the first trench and the second trench, and wherein the second and fourth conductive regions have a width in a range of 20 ?m to 600 ?m.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: March 7, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Yong Ho Kim
  • Publication number: 20230040910
    Abstract: A method and an apparatus for STR in a wireless LAN that supports multi-links are disclosed. An operating method of a first communication node comprises the steps of: transmitting a first frame to a second communication node through a first link from among multi-links; receiving, from the second communication node, a response frame for the first frame through the first link; checking a channel occupancy time in a second link from among the multi-links on the basis of first information included in the response frame; and performing a sensing operation in a preset section after the end of the channel occupancy time in the second link.
    Type: Application
    Filed: January 6, 2021
    Publication date: February 9, 2023
    Applicants: ELECTRONICS AND TELECOMMUNICATICATIONS RESEARCH INSTITUTE, KOREA NATIONAL UNIVERSITY OF TRANSPORTATION INDUSTRY ACADEMIC COOPERATION FOUNDATION
    Inventors: Sung Hyun HWANG, Kyu Min KANG, Jae Cheol PARK, Jin Hyung OH, Dong Woo LIM, Su Na CHOI, Yong Ho KIM, Han Seul HONG
  • Publication number: 20230034210
    Abstract: A rotor assembly includes: a shaft; a rotor core having a through-hole which is formed in an axial direction (A) and into which the shaft is inserted; a magnet inserted into an inner space of the rotor core; and a plate provided in close contact with one side of the rotor core in the axial direction (A). The plate includes a protrusion formed in a region, which faces a region between the magnet and the circumference of the rotor core, and protruding toward the rotor core.
    Type: Application
    Filed: August 2, 2022
    Publication date: February 2, 2023
    Applicant: HYUNDAI MOBIS Co., Ltd.
    Inventors: Yong Ho KIM, Bit Na LEE
  • Publication number: 20230034654
    Abstract: A semiconductor package is provided. The semiconductor package includes: a first stack including a first semiconductor substrate; a through via that penetrates the first semiconductor substrate in a first direction; a second stack that includes a second face facing a first face of the first stack, on the first stack; a first pad that is in contact with the through via, on the first face of the first stack; a second pad including a concave inner side face that defines an insertion recess, the second pad located on the second face of the second stack; and a bump that connects the first pad and the second pad, wherein the bump includes a first upper bump on the first pad, and a first lower bump between the first upper bump and the first pad.
    Type: Application
    Filed: March 23, 2022
    Publication date: February 2, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong Ho KIM, Bo In NOH, Jeong Hoon AHN
  • Patent number: 11553426
    Abstract: Disclosed is a method for operating a communication node supporting a low power mode in a wireless LAN. A method for operating a station, which includes a PCR and a WURx, comprises the steps of: allowing the WURx, which operates in a wake-up state, to receive a wake-up packet from an access point; transitioning an operating state of the PCR from a sleep state to the wake-up state when the wake-up packet is received; allowing the PCR, which operates in the wake-up state, to receive a data frame from an access point; and allowing the PCR to transmit, to the access point, a response to the data frame.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: January 10, 2023
    Assignees: Electronics and Telecommunications Research Institute, Korea National University of Transportation Industry-Academic Cooperation Foundation
    Inventors: Yong Ho Kim, Sung Hyun Hwang, Igor Kim, Seung Keun Park
  • Publication number: 20220407622
    Abstract: A method and apparatus for transmitting and receiving a block ACK in a wireless LAN system are disclosed. An operation method for a first communication node comprises the steps of: generating a first data frame including first ADDBA information; transmitting the first data frame to a second communication node; and receiving, from the second communication node, a first RA including second ADDBA information generated by the second communication node in response to the first data frame.
    Type: Application
    Filed: November 3, 2020
    Publication date: December 22, 2022
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, KOREA NATIONAL UNIVERSITY OF TRANSPORTATION INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Yong Ho Kim, Yong Su Gwak