Patents by Inventor Yong-Ki Baek
Yong-Ki Baek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9903667Abstract: A distribution structure of a heat exchanger includes one inlet pipe connected to a header. The heat exchanger includes a first header having a first chamber and a second chamber, a second header having a third chamber and a fourth chamber, and a plurality of tubes arranged in a plurality of rows. An inlet pipe is connected to the first chamber and an outlet pipe is connected to the second chamber. A distributer distributes the refrigerant flowing into the first chamber to the tubes of the front row, the distributor includes a first separating baffle dividing the first chamber into a mixing chamber in which the refrigerant is mixed and a supplying chamber for supplying the refrigerant to the tubes, a distribution pipe communicating the mixing chamber with the supplying chamber, and a second separating baffle dividing the supplying chamber into a plurality of independent chambers.Type: GrantFiled: April 17, 2014Date of Patent: February 27, 2018Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kan Tae Seo, Yong Ki Baek, Hayase Gaku
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Patent number: 9863714Abstract: A heat exchanger including a plurality of horizontally arranged tubes, headers to support the tubes and to enable a refrigerant to flow in the tubes, and a corrugated fin horizontally disposed between the tubes, wherein the corrugated fins includes a vertical fin body, flat contact parts formed at an upper part and a lower part of the fin body, the flat contact parts being in surface contact with a top and a bottom of the tubes, and curved contact parts extending from opposite ends of the flat contact parts, the curved contact parts being in surface contact with the sides of the tubes, the fin body includes drainage guides formed outside the flat contact parts in a lateral direction, and each drainage guide includes protruding parts protruding more upward and downward than the flat contact parts.Type: GrantFiled: July 25, 2014Date of Patent: January 9, 2018Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kang Tae Seo, Yong Ki Baek, Gaku Hayase
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Publication number: 20150034289Abstract: A heat exchanger including a plurality of horizontally arranged tubes, headers to support the tubes and to enable a refrigerant to flow in the tubes, and a corrugated fin horizontally disposed between the tubes, wherein the corrugated fins includes a vertical fin body, flat contact parts formed at an upper part and a lower part of the fin body, the flat contact parts being in surface contact with a top and a bottom of the tubes, and curved contact parts extending from opposite ends of the flat contact parts, the curved contact parts being in surface contact with the sides of the tubes, the fin body includes drainage guides formed outside the flat contact parts in a lateral direction, and each drainage guide includes protruding parts protruding more upward and downward than the flat contact parts.Type: ApplicationFiled: July 25, 2014Publication date: February 5, 2015Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kang Tae SEO, Yong Ki Baek, Gaku Hayase
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Publication number: 20140311714Abstract: A distribution structure of a heat exchanger includes one inlet pipe connected to a header. The heat exchanger includes a first header having a first chamber and a second chamber, a second header having a third chamber and a fourth chamber, and a plurality of tubes arranged in a plurality of rows. An inlet pipe is connected to the first chamber and an outlet pipe is connected to the second chamber. A distributer distributes the refrigerant flowing into the first chamber to the tubes of the front row, the distributor includes a first separating baffle dividing the first chamber into a mixing chamber in which the refrigerant is mixed and a supplying chamber for supplying the refrigerant to the tubes, a distribution pipe communicating the mixing chamber with the supplying chamber, and a second separating baffle dividing the supplying chamber into a plurality of independent chambers.Type: ApplicationFiled: April 17, 2014Publication date: October 23, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kang Tae SEO, Yong Ki BAEK, Hayase GAKU
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Publication number: 20140096944Abstract: A heat exchanger having an improved distribution structure in which one inlet pipe is connected to a header which is partitioned into a first sub-chamber in which a refrigerant flows through the inlet pipe and a second sub-chamber in which tubes communicate with each other, and a distribution pipe is installed at the header and causes the first sub-chamber and the second sub-chamber to communicate so that the refrigerant in the first sub-chamber can be distributed to the tubes. The distribution pipe can pass through and can be combined with a partitioning baffle that is combined with the header to partition a chamber of the header into the first sub-chamber and the second sub-chamber.Type: ApplicationFiled: October 2, 2013Publication date: April 10, 2014Applicant: Samsung Electronics Co., Ltd.Inventors: Kang Tae SEO, Yong Ki Baek, Seung Hee Ha, Hayase Gaku
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Patent number: 8020607Abstract: The present invention provides a pipe for a heat exchanger. The header includes a tube insertion hole for insertion of a tube, a filler metal groove formed in a length direction on one side or both sides at a point separated from the tube insertion hole, and a filler metal that flows down following the tube and the periphery where the tube and tube insertion hole come in contact. Filler metal is inserted in the filler metal groove so as to enable brazing fusion. A lead groove is formed between the tube insertion hole and filler metal groove and provides a pathway so as to enable smooth flow of the filler metal, and so that molten filler metal can flow smoothly into the fused areas between the tube and header pipe in desired locations and amounts.Type: GrantFiled: April 18, 2008Date of Patent: September 20, 2011Assignee: Modine Korea, LLCInventors: Ki-Hun Kim, Yong-Ki Baek, Hyeong-Ki Kim
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Publication number: 20080302521Abstract: The present invention provides a pipe for a heat exchanger. The header includes a tube insertion hole for insertion of a tube, a filler metal groove formed in a length direction on one side or both sides at a point separated from the tube insertion hole, and a filler metal that flows down following the tube and the periphery where the tube and tube insertion hole come in contact. Filler metal is inserted in the filler metal groove so as to enable brazing fusion. A lead groove is formed between the tube insertion hole and filler metal groove and provides a pathway so as to enable smooth flow of the filler metal, and so that molten filler metal can flow smoothly into the fused areas between the tube and header pipe in desired locations and amounts.Type: ApplicationFiled: April 18, 2008Publication date: December 11, 2008Inventors: Ki-Hun Kim, Yong-Ki Baek, Hyeong-Ki Kim