Patents by Inventor Yong Ki Cho
Yong Ki Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240154112Abstract: A cathode active material for a lithium secondary battery according to an embodiment includes lithium metal oxide particles containing lithium and nickel, and containing a small amount of cobalt or no cobalt. An average particle diameter, a modulus and a hardness of the lithium metal oxide particles are adjusted to satisfy a desired relation. A lithium secondary battery has improved high-temperature storage properties, structural stability and high power properties.Type: ApplicationFiled: October 24, 2023Publication date: May 9, 2024Inventors: Hong Ki KIM, Min Gu KANG, Seung Hyun KIM, Young Hoon DO, Young Uk PARK, Yoon Ji LEE, Yong Hyun CHO
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Patent number: 10673492Abstract: There is provided a first unit which constitutes a point-to-multipoint communication system and is connected to communicate with each of a plurality of second units. The first unit includes a control signal extraction unit, a signal switching unit and a controller. The control signal extraction unit extracts first control signals respectively transmitted from the plurality of second units. The signal switching unit includes a switching circuit, and selects any one of the first control signals respectively received through individual signal transmission lines. The controller receives the first control signal selected by the signal switching unit, determines an allocation ID to be allocated to a second unit corresponding to the selected first control signal based on the initial identification information of the selected first control signal, and controls the determined allocation ID to be transmitted to the corresponding second unit.Type: GrantFiled: August 31, 2018Date of Patent: June 2, 2020Assignee: SOLiD, INC.Inventor: Yong Ki Cho
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Patent number: 10184181Abstract: The present invention relates to a method for checking a discharge inception voltage of a dielectric material, a method for forming a displacement field on the dielectric materials comprising applying a voltage the same as or higher than the discharge inception voltage generated by an external field obtained from the above to the dielectric material to which electrodes are connected, a method for forming plasma on the surfaces of the dielectric material comprising injecting reaction gases and applying a voltage the same as or higher than the discharge inception voltage obtained above to the dielectric material to which electrodes are connected, a method for forming a displacement field on the entire surface of the dielectric material comprising applying a voltage the same as or higher than the discharge inception voltage obtained above to the dielectric material to which electrodes are connected, and a dielectric material which is modified, in which the surfaces thereof are treated with plasma by the methodsType: GrantFiled: September 4, 2015Date of Patent: January 22, 2019Assignee: Research & Business Foundation SUNGKYUNKWAN UNIVERSITYInventors: Dong Geun Jung, Yong Ki Cho, Won Jin Ban
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Publication number: 20180375549Abstract: There is provided a first unit which constitutes a point-to-multipoint communication system and is connected to communicate with each of a plurality of second units. The first unit includes a control signal extraction unit, a signal switching unit and a controller. The control signal extraction unit extracts first control signals respectively transmitted from the plurality of second units. The signal switching unit includes a switching circuit, and selects any one of the first control signals respectively received through individual signal transmission lines. The controller receives the first control signal selected by the signal switching unit, determines an allocation ID to be allocated to a second unit corresponding to the selected first control signal based on the initial identification information of the selected first control signal, and controls the determined allocation ID to be transmitted to the corresponding second unit.Type: ApplicationFiled: August 31, 2018Publication date: December 27, 2018Applicant: SOLiD, INC.Inventor: Yong Ki CHO
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Patent number: 10079622Abstract: There is provided a first unit which constitutes a point-to-multipoint communication system and is connected to communicate with each of a plurality of second units. The first unit includes a control signal extraction unit, a signal switching unit and a controller. The control signal extraction unit extracts first control signals respectively transmitted from the plurality of second units. The signal switching unit includes a switching circuit, and selects any one of the first control signals respectively received through individual signal transmission lines. The controller receives the first control signal selected by the signal switching unit, determines an allocation ID to be allocated to a second unit corresponding to the selected first control signal based on the initial identification information of the selected first control signal, and controls the determined allocation ID to be transmitted to the corresponding second unit.Type: GrantFiled: July 18, 2014Date of Patent: September 18, 2018Assignee: SOLiD, INC.Inventor: Yong Ki Cho
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Publication number: 20170155430Abstract: There is provided a first unit which constitutes a point-to-multipoint communication system and is connected to communicate with each of a plurality of second units. The first unit includes a control signal extraction unit, a signal switching unit and a controller. The control signal extraction unit extracts first control signals respectively transmitted from the plurality of second units. The signal switching unit includes a switching circuit, and selects any one of the first control signals respectively received through individual signal transmission lines. The controller receives the first control signal selected by the signal switching unit, determines an allocation ID to be allocated to a second unit corresponding to the selected first control signal based on the initial identification information of the selected first control signal, and controls the determined allocation ID to be transmitted to the corresponding second unit.Type: ApplicationFiled: July 18, 2014Publication date: June 1, 2017Inventor: Yong Ki CHO
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Patent number: 9653629Abstract: The present invention relates to an exclusive alloy substrate material for CIGS solar cells. Particularly, the present invention provides a substrate material having a thermal expansion coefficient similar to that of a CIGS layer. The substrate material according to the present invention may prevent damage such as interlayer separation due to differing thermal expansion coefficients from occurring because the substrate material has a thermal expansion coefficient similar to that of the CIGS layer.Type: GrantFiled: December 28, 2011Date of Patent: May 16, 2017Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGYInventors: Tai Hong Yim, Heung Yeol Lee, Tae Jin Hwang, Young Sik Song, Yong Ki Cho, Min Su Lee, Yoon Ho Han
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Patent number: 9549807Abstract: The present invention relates to a preparation method of a tube and a transplantable polymer tube prepared by such method, which includes modifying the inner surface of a tube using plasma. A preparation method of a tube may include preparing a tube, modifying the inner surface of the tube using microplasma so as to have reactivity, forming a thin film layer on the modified surface of the tube to prevent aging or impart adhesiveness, and modifying the surface of the thin film layer using microplasma so as to enhance cell adhesion thereon.Type: GrantFiled: January 29, 2014Date of Patent: January 24, 2017Assignee: RESEARCH & BUSINESS FOUNDATION SUNGYUNKWAN UNIVERSITYInventors: Dong Geun Jung, Yong Ki Cho, Dae Won Park, Heon Yong Park, Hye Rim Lee
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Patent number: 9384796Abstract: A semiconductor memory device includes a core region for storing data and a peripheral region for controlling the core region. The semiconductor memory device includes a digital noise measurement circuit and an output selection circuit. The digital noise measurement circuit selects a first operation voltage among a plurality of operation voltages based on a voltage selection signal, generates first noise data by digitizing first noise in the first operation voltage based on a plurality of reference voltages, and outputs the first noise data. The plurality of operation voltages are supplied to the core region and the peripheral region. The output selection circuit outputs one of first data and the first noise data based on an output selection signal. The first data is provided from the core region.Type: GrantFiled: June 1, 2015Date of Patent: July 5, 2016Assignee: Samsung Electronics Co., Ltd.Inventors: Yong-Ki Cho, Du-Yeul Kim
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Patent number: 9288087Abstract: Provided are a data receiver circuit and a method of adaptively controlling an equalization coefficient using the same. The data receiver circuit includes n sampling receivers, n decision feedback equalizer (DFE) circuits, and a data recovery circuit. The n sampling receivers are configured to sample an input signal and output n respective sampling signals in response to n respective clock signals. The n DFE circuits are configured to equalize the n respective sampling signals in response to a DFE control signal and generate n respective pre-recovery signals in response to the n equalized sampling signals and n respective previous pre-recovery signals, the DFE control signal for changing an equalization ability of the n DFE circuits. The data recovery circuit is configured to select one of the n respective pre-recovery signals, and output the selected n pre-recovery signal as a recovered input signal.Type: GrantFiled: October 19, 2012Date of Patent: March 15, 2016Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Won-Hwa Shin, Yong-Ki Cho
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Publication number: 20160068960Abstract: The present invention relates to a method for checking a discharge inception voltage of a dielectric material, a method for forming a displacement field on the dielectric materials comprising applying a voltage the same as or higher than the discharge inception voltage generated by an external field obtained from the above to the dielectric material to which electrodes are connected, a method for forming plasma on the surfaces of the dielectric material comprising injecting reaction gases and applying a voltage the same as or higher than the discharge inception voltage obtained above to the dielectric material to which electrodes are connected, a method for forming a displacement field on the entire surface of the dielectric material comprising applying a voltage the same as or higher than the discharge inception voltage obtained above to the dielectric material to which electrodes are connected, and a dielectric material which is modified, in which the surfaces thereof are treated with plasma by the methodsType: ApplicationFiled: September 4, 2015Publication date: March 10, 2016Applicant: Research & Business Foundation Sungkyunkwan UniversityInventors: Dong Geun JUNG, Yong Ki CHO, Won Jin BAN
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Publication number: 20160042773Abstract: A semiconductor memory device includes a core region for storing data and a peripheral region for controlling the core region. The semiconductor memory device includes a digital noise measurement circuit and an output selection circuit. The digital noise measurement circuit selects a first operation voltage among a plurality of operation voltages based on a voltage selection signal, generates first noise data by digitizing first noise in the first operation voltage based on a plurality of reference voltages, and outputs the first noise data. The plurality of operation voltages are supplied to the core region and the peripheral region. The output selection circuit outputs one of first data and the first noise data based on an output selection signal. The first data is provided from the core region.Type: ApplicationFiled: June 1, 2015Publication date: February 11, 2016Inventors: YONG-KI CHO, DU-YEUL KIM
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Patent number: 9114897Abstract: According to example embodiments, an automatic packing apparatus includes at least one box supply unit configured to move a box stack upwards such that a product is inserted into a packing box of the box stack, the packing box being the uppermost box of the box stack, an inlet formation unit configured to lift the upper surface of the packing box to form an inlet on at least one unbonded side surface of the packing box, a product supply unit configured to transfer the product to the inlet; and a side surface bonding unit configured to bond the at least one unbonded side surface of the packing box. The at least one unbonded side surface includes the inlet and the packing box includes the product inserted therein.Type: GrantFiled: October 5, 2011Date of Patent: August 25, 2015Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jin Ho Kim, Byoung Oh Park, Yong Ki Cho, Jong Soo Jeong, Bong Sup Lim, Yun Jin Jung
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Publication number: 20140345677Abstract: The present invention relates to an exclusive alloy substrate material for CIGS solar cells. Particularly, the present invention provides a substrate material having a thermal expansion coefficient similar to that of a CIGS layer. The substrate material according to the present invention may prevent damage such as interlayer separation due to differing thermal expansion coefficients from occurring because the substrate material has a thermal expansion coefficient similar to that of the CIGS layer.Type: ApplicationFiled: December 28, 2011Publication date: November 27, 2014Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGYInventors: Tai Hong Yim, Heung Yeol Lee, Tae Jin Hwang, Young Sik Song, Yong Ki Cho, Min Su Lee, Yoon Ho Han
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Publication number: 20140257450Abstract: The present invention relates to a preparation method of a tube and a transplantable polymer tube prepared by such method, which includes modifying the inner surface of a tube using plasma. A preparation method of a tube may include preparing a tube, modifying the inner surface of the tube using microplasma so as to have reactivity, forming a thin film layer on the modified surface of the tube to prevent aging or impart adhesiveness, and modifying the surface of the thin film layer using microplasma so as to enhance cell adhesion thereon.Type: ApplicationFiled: January 29, 2014Publication date: September 11, 2014Applicant: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITYInventors: Dong Geun JUNG, Yong Ki Cho, Dae Won Park, Heon Yong Park, Hye Rim Lee
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Publication number: 20130101011Abstract: Provided are a data receiver circuit and a method of adaptively controlling an equalization coefficient using the same. The data receiver circuit includes n sampling receivers, n decision feedback equalizer (DFE) circuits, and a data recovery circuit. The n sampling receivers are configured to sample an input signal and output n respective sampling signals in response to n respective clock signals. The n DFE circuits are configured to equalize the n respective sampling signals in response to a DFE control signal and generate n respective pre-recovery signals in response to the n equalized sampling signals and n respective previous pre-recovery signals, the DFE control signal for changing an equalization ability of the n DFE circuits. The data recovery circuit is configured to select one of the n respective pre-recovery signals, and output the selected n pre-recovery signal as a recovered input signal.Type: ApplicationFiled: October 19, 2012Publication date: April 25, 2013Inventors: Won-Hwa SHIN, Yong-Ki CHO
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Publication number: 20120079796Abstract: According to example embodiments, an automatic packing apparatus includes at least one box supply unit configured to move a box stack upwards such that a product is inserted into a packing box of the box stack, the packing box being the uppermost box of the box stack, an inlet formation unit configured to lift the upper surface of the packing box to form an inlet on at least one unbonded side surface of the packing box, a product supply unit configured to transfer the product to the inlet; and a side surface bonding unit configured to bond the at least one unbonded side surface of the packing box. The at least one unbonded side surface includes the inlet and the packing box includes the product inserted therein.Type: ApplicationFiled: October 5, 2011Publication date: April 5, 2012Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jin Ho Kim, Byoung Oh Park, Yong Ki Cho, Jong Soo Jeong, Bong Sup Lim, Yun Jin Jung
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Publication number: 20110246940Abstract: Manuals of various electronic devices are stored in a portable memory device, and the manuals are displayed on the electronic devices as the portable memory device is connected with the electronic devices whenever the manuals are necessary, so that users easily refer to the manuals. Convenience of the users is improved. The portable memory device is individually utilized, so user satisfaction is improved. The portable memory device storing the manuals is provided to the users free of charge, so the user satisfaction is improved. Wastes and environment contamination caused by book-type manuals are reduced. Since the portable memory device is used instead of the book-type manual, the size of a box for accessory parts is minimized, so that transportation cost is reduced.Type: ApplicationFiled: April 1, 2011Publication date: October 6, 2011Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jin Ho Kim, Jae Young Shim, Yong Ki Cho, Byoung Oh Park
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Publication number: 20100185788Abstract: Disclosed is a system for providing a manual. The system includes a memory device storing the manual, a port into which the memory device is inserted, and an electronic device provided with a display unit that displays the manual if the portable memory device is connected with the port. According to the system, manuals of various electronic devices are stored in a portable memory device, and the manuals are displayed on the electronic devices after the portable memory device is connected with the electronic devices whenever the manuals are necessary, so that users may more easily locate and refer to the manuals.Type: ApplicationFiled: January 13, 2010Publication date: July 22, 2010Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jin Ho Kim, Kyung Jun Yoo, Byoung Oh Park, Yong Ki Cho
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Patent number: 7408379Abstract: An impedance calibration circuit and a semiconductor device including the same are provided. An embodiment of the invention provides an impedance calibration circuit with a variable reference voltage generation unit. The impedance calibration circuit maximizes the number of semiconductor devices that can be tested in test equipment at one time and permits the operation of an impedance matching unit (e.g., an on-die-termination (ODT) circuit and/or an off-chip-driver (OCD)) to be tested for a variety of reference resistor values.Type: GrantFiled: September 12, 2007Date of Patent: August 5, 2008Assignee: Samsung Electronics Co., Ltd.Inventors: Yong-Ki Cho, Mi-Jin Lee, Sung-Jinn Chung