Abstract: An apparatus and method for measuring air currents on the surface of a substrate, which can accurately measure the magnitude and direction of air currents on the surface of a wafer with wafer-type air current measurement sensors, are provided. The apparatus includes: a first air current measurement module measuring a magnitude of air currents on a surface of a first substrate, which is processed in accordance with a semiconductor manufacturing process; a second air current measurement module measuring a movement direction of the air currents; and a power module supplying power to the first and second air current measurement modules, wherein the first air current measurement module, the second air current measurement module, and the power module are mounted on a second substrate, which has the same shape as the first substrate.

Abstract: A binder solution for an all-solid-state battery, an electrode slurry for an all-solid-state battery including the same and a method of manufacturing an all-solid-state battery using the same, and more particularly to a binder solution for an all-solid-state battery, in which a polymer binder configured such that a non-polar functional group is bonded to the end of a polar functional group is used, whereby the polar functional group is provided by a deprotection mechanism of the polymer binder through a thermal treatment, thus increasing adhesion between electrode materials to thereby improve battery capacity and enabling a wet process to thereby reduce manufacturing costs, an electrode slurry for an all-solid-state battery including the same and a method of manufacturing an all-solid-state battery using the same.

Abstract: A hydrogen storage system is disclosed and includes a storage unit including a plurality of unit storage containers, in which metal hydride materials are respectively provided in an interior thereof and which are connected to each other in parallel, and a thermal fluid line defining a thermal fluid passage, which passes via the plurality of unit storage containers continuously and through which a thermal fluid flows for heating or cooling the unit storage containers, thereby enhancing a storage performance and an efficiency of the hydrogen.

Abstract: A hydrogen storage device includes a storage container having an accommodation space in an interior thereof, a first metal hydride material provided in the interior of the storage container and that stores hydrogen, and a second metal hydride material provided in the interior of the storage container and that stores the hydrogen at a pressure that is different from that of the first metal hydride material. An advantageous effect of restraining an excessive rise of a pressure of the storage container and enhancing safety and reliability may be obtained.

Abstract: A battery module includes at least one cell assembly including a plurality of secondary batteries, a gas pipe configured to allow gas produced in a module housing to move therein, and the module housing including a lower case having one open side and an internal space in which the at least one cell assembly is received, and an upper case coupled to one side of the lower case to cover the one open side of the lower case and having a receiving space in which the gas pipe is received, and a connection hole to which one end of the gas pipe is connected such that the gas pipe and the internal space are in communication with each other.

Abstract: A coil component includes a body having a first surface, and a first end surface and a second end surface connected to the first surface and opposing each other in a length direction; a support substrate disposed inside the body; a coil portion comprising a first coil pattern and first and second lead-out patterns, each disposed on a first surface of the support substrate; first and second slit portions, respectively defined on edge portions of the first surface of the body to expose the first and second lead-out patterns; and first and second external electrodes disposed on the first and second slit portions to be connected to the first and second lead-out patterns. At least one of the first and second lead-out patterns has a thickness greater than a thickness of each of the first coil pattern and the first dummy lead-out pattern.

Abstract: A motor drive device is proposed. The motor drive device is configured to drive a motor having a plurality of windings respectively corresponding to a plurality of phases, and includes: a first inverter including a plurality of first switching elements, and connected to a first end of each of the plurality of windings; a second inverter including a plurality of second switching elements, and connected to a second end of each of the plurality of windings; and a controller configured to generate phase voltage commands of the first inverter and phase voltage commands of the second inverter based on preset voltage commands of the motor so that the phase voltage commands of the first inverter and the phase voltage commands of the second inverter are respectively represented as vectors of different angles.

Abstract: A battery module includes: a battery cell assembly having a plurality of battery cells; a top plate configured to cover an upper side of the battery cell assembly; a bottom plate configured to cover a lower side of the battery cell assembly; a sensing assembly disposed to cover a front side and a rear side of the battery cell assembly; a pair of side plates disposed at side surfaces, respectively, of the battery cell assembly; and a pair of compression pads disposed between the pair of side plates and the battery cell assembly, respectively.

Abstract: A coil component is provided. The coil component includes a body having fifth and sixth surfaces opposing each other, first and second surfaces respectively connecting the fifth and sixth surfaces of the body and opposing each other, and third and fourth surfaces respectively connecting the first and second surfaces of the body and opposing each other in one direction, a recess disposed in an edge between one of the first and second surfaces of the body and the sixth surface of the body, a coil portion disposed inside the body and exposed through the recess, and an external electrode including a connection portion disposed in the recess and connected to the coil portion, and a pad portion disposed on one surface of the body. A length of the pad portion in the one direction is greater than a length of the connection portion in the one direction.

Abstract: A power tool includes a housing that defines a battery pack attachment portion, which has a first cavity and a flange. A printed circuit board and a motor are positioned within the housing. The motor is electrically communicates with the printed circuit board. A battery pack receptacle is positioned within the first cavity, is movably coupled to the battery pack attachment portion. The battery pack receptacle includes a groove in which the flange of the battery pack attachment portion is received and a second cavity configured to receive at least a portion of a battery pack. One of a spring or a resilient body is positioned between the battery pack attachment portion and the battery pack receptacle and is configured to bias the battery pack attachment relative to the battery pack receptacle. Power tool terminals are supported by the battery pack receptacle and electrically communicate with the printed circuit board.

Abstract: A method for supporting block coding is provided. The method includes the steps of: determining an arrangement position of a coding block selected by a user on the basis of a sentence component-specific arrangement order specified from a sentence structure of a spoken language; and providing the user with an arrangement result of the coding block specified on the basis of the arrangement position.

Abstract: Fin field effect transistors (FinFETs) having various different thicknesses of gate oxides and related apparatuses, methods, and computing systems are disclosed. An apparatus includes first FinFETs, second FinFETs, and third FinFETs. The first FinFETs include a first gate oxide material, a second gate oxide material, and a third gate oxide material. The second FinFETs include the second gate oxide material and the third gate oxide material. The third FinFETs include the third gate oxide material. A method includes forming the first gate oxide material on first fins, second fins, and third fins; removing the first gate oxide material from the second fins and the third fins; forming a second gate oxide material over the first fins, the second fins, and the third fins; and removing the second gate oxide material from the third fins.

Abstract: A method for supporting block coding is provided. The method includes the steps of: determining an arrangement position of a coding block selected by a user on the basis of a sentence component-specific arrangement order specified from a sentence structure of a spoken language; and providing the user with an arrangement result of the coding block specified on the basis of the arrangement position.

Abstract: Some embodiments include an integrated assembly having a CMOS region with fins extending along a first direction, and with gating structures extending across the fins. A circuit arrangement is associated with the CMOS region and includes a pair of the gating structures spaced by an intervening region having a missing gating structure. The circuit arrangement has a first dimension along the first direction. A second region is proximate to the CMOS region. Conductive structures are associated with the second region. Some of the conductive structures are electrically coupled with the circuit arrangement. A second dimension is a distance across said some of the conductive structures along the first direction. The conductive structures and the circuit arrangement are aligned such that the second dimension is substantially the same as the first dimension. Some embodiments include methods of forming integrated assemblies.

Abstract: One illustrative IC product disclosed herein includes first and second final gate structures and an insulating gate separation structure positioned between the first and second final gate structures. In one embodiment, the insulating gate separation structure has a stepped bottom surface with a substantially horizontally oriented bottom central surface that is surrounded by a substantially horizontally oriented recessed surface, wherein the substantially horizontally oriented bottom central surface is positioned a first level above the substrate and the substantially horizontally oriented recessed surface is positioned at a second level above the substrate, wherein the second level is greater than the first level.

Abstract: Some embodiments include an integrated assembly having a CMOS region with fins extending along a first direction, and with gating structures extending across the fins. A circuit arrangement is associated with the CMOS region and includes a pair of the gating structures spaced by an intervening region having a missing gating structure. The circuit arrangement has a first dimension along the first direction. A second region is proximate to the CMOS region. Conductive structures are associated with the second region. Some of the conductive structures are electrically coupled with the circuit arrangement. A second dimension is a distance across said some of the conductive structures along the first direction. The conductive structures and the circuit arrangement are aligned such that the second dimension is substantially the same as the first dimension. Some embodiments include methods of forming integrated assemblies.

Abstract: This application provides a communication method. The communication method includes: A first device sends indication information, where the indication information is used to indicate whether the first device sends a first synchronization signal block in a synchronization slot of a sidelink, and the synchronization slot is used to transmit a synchronization signal block; and the first device sends first data in the synchronization slot of the sidelink. Because the first device indicates a sending behavior of the first device in the synchronization slot before sending the first data, a receiver may determine a processing manner of the receiver in the synchronization slot based on the indication information.

Abstract: Some embodiments include an integrated assembly having capacitor-contact-regions. Metal-containing interconnects are coupled with the capacitor-contact-regions. A first insulative material is between the metal-containing interconnects. A second insulative material is over the first insulative material. A third insulative material is over the second insulative material. First capacitor electrodes extend through the second and third insulative materials and are coupled with the metal-containing interconnects. Fourth insulative material is adjacent the first capacitor electrodes. Capacitor plate electrodes are adjacent the fourth insulative material and are spaced from the first capacitor electrodes by the fourth insulative material. Some embodiments include methods of forming integrated assemblies.

Abstract: Structures and fabrication methods for a field-effect transistor. First and second spacers are formed adjacent to opposite sidewalls of a gate structure. A section of the gate structure is partially removed with a first etching process to form a cut that extends partially through the gate structure. After partially removing the section of the gate structure with the first etching process, upper sections of the first and second sidewall spacers arranged above the gate structure inside the cut are at least partially removed. After at least partially removing the upper sections of the first and second sidewall spacers, the section of the gate structure is completely removed from the cut with a second etching process. A dielectric material is deposited inside the cut to form a dielectric pillar.

Abstract: A pipe fixing device comprising a plurality of pipes, for conducting liquid or gas, arranged to cross each other, and a fixing member for fixing the plurality of pipes. The fixing member comprises a plurality of pipe fixing bores, and a plurality of fitting bores for the fitting of bands used to tighten the pipes. The present invention can secure not only easy insertion of the pipes arranged to cross each other, but also enhancement in a coupling force of the pipes through the use of the tightening bands, resulting in stable and reliable fixation of the pipes.