Abstract: A semiconductor package comprises a plurality of pads disposed along a surface edge of a semiconductor chip, a plurality of mounting bumps formed on a surface of the semiconductor chip and disposed away from the plurality of pads at a predetermined distance, a plurality of redistribution connecting wires for electrically connecting the plurality of pads to the plurality of mounting bumps, and a plurality of test bumps disposed on the plurality of pads.

Abstract: A method of forming an integrated circuit device includes the steps of forming a conductive pattern on an integrated circuit device, and forming an insulating layer on the conductive pattern and on the integrated circuit substrate. An upper surface portion of the insulating layer opposite the substrate is removed, and a photoresist layer is formed on the insulating layer after the step of removing the upper surface portion. The photoresist layer is patterned, and exposed portions of the insulating layer are etched using the patterned photoresist layer as an etching mask thereby forming contact holes through the insulating layer.