Patents by Inventor Yong Wan JI
Yong Wan JI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12004296Abstract: A printed circuit board includes: an insulating member; a first wiring layer disposed in the insulating member, and including first and second pattern layers spaced apart from each other based on a thickness direction of the printed circuit board; and a second wiring layer disposed in the insulating member, and spaced apart from the first pattern layer over the first pattern layer based on the thickness direction. Based on the thickness direction, an insulation distance between the first pattern layer and the second pattern layer is smaller than an insulation distance between the first pattern layer and the second wiring layer, and each of the first and second pattern layers is thinner than the second wiring layer.Type: GrantFiled: April 4, 2022Date of Patent: June 4, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Uk Lee, Chi Won Hwang, Eun Sun Kim, Yong Wan Ji, Young Hun You
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Publication number: 20240147620Abstract: The present disclosure relates to a printed circuit board including, a first insulating layer, a first metal layer disposed on the first insulating layer, a bridge disposed on the first metal layer and including a bridge insulating layer and a bridge circuit layer, a second insulating layer disposed on the first insulating layer and covering at least a portion of the bridge, a second metal layer disposed on the second insulating layer, and a connecting via penetrating the bridge and the second insulating layer to connect the first metal layer to the second insulating layer. The connecting via is spaced apart from the bridge circuit layer.Type: ApplicationFiled: April 17, 2023Publication date: May 2, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Uk LEE, Youn Gyu HAN, Jin Oh PARK, Yong Wan JI, Yong Duk LEE, Eun Sun KIM
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Publication number: 20230199955Abstract: A printed circuit board includes: an insulating member; a first wiring layer disposed in the insulating member, and including first and second pattern layers spaced apart from each other based on a thickness direction of the printed circuit board; and a second wiring layer disposed in the insulating member, and spaced apart from the first pattern layer over the first pattern layer based on the thickness direction. Based on the thickness direction, an insulation distance between the first pattern layer and the second pattern layer is smaller than an insulation distance between the first pattern layer and the second wiring layer, and each of the first and second pattern layers is thinner than the second wiring layer.Type: ApplicationFiled: April 4, 2022Publication date: June 22, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Uk Lee, Chi Won Hwang, Eun Sun Kim, Yong Wan Ji, Young Hun You
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Publication number: 20230066381Abstract: A printed circuit board includes a first board including a plurality of first insulating layers and a plurality of first wiring layers disposed between the plurality of first insulating layers, respectively; and a second board disposed on one surface of the first board and including a plurality of second insulating layers and a plurality of second wiring layers disposed on or between the plurality of second insulating layers, respectively. At least one of the plurality of first insulating layers has a thickness less than a thickness of at least one of the plurality of second insulating layers. The first board further includes a through-via penetrating each of the plurality of first insulating layers and connected to one of the plurality of second wiring layers.Type: ApplicationFiled: January 19, 2022Publication date: March 2, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Uk LEE, Chi Won HWANG, Eun Sun KIM, Yong Wan JI
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Publication number: 20230030484Abstract: A printed circuit board includes: a first insulating layer having a recess portion in one surface of the first insulating layer; a first circuit pattern embedded in the first insulating layer and being in contact with a lower surface of the recess portion; a second insulating layer disposed on the one surface of the first insulating layer to be disposed in at least a portion of the recess portion; and a via penetrating through at least a portion of the second insulating layer, disposed in the recess portion, and connected to the first circuit pattern.Type: ApplicationFiled: May 18, 2022Publication date: February 2, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yong Wan Ji, Jin Uk Lee, Eun Sun Kim, Young Hun You
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Patent number: 10021785Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a first circuit layer disposed on an upper surface of a substrate, an insulating layer disposed on the substrate and the first circuit layer, a second circuit layer disposed on an upper surface of the insulating layer, and a via configured to connect between the first circuit layer and the second circuit layer, and a lower part of the via is in contact with the upper surface of the substrate.Type: GrantFiled: December 11, 2015Date of Patent: July 10, 2018Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Myung-Sam Kang, Young-Gwan Ko, Sang-Hoon Kim, Kang-Wook Bong, Hye-Won Jung, Yong-Wan Ji
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Patent number: 9554466Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes an insulating layer including a first resin layer and a second resin layer, circuit layers disposed on upper and lower surfaces of the insulating layer, and a via configured to connect the circuit layer formed on the upper surface to the circuit layer formed on the lower surface, and the second resin layer extends from an upper surface of the first resin layer to a lower surface of the first resin layer by passing through the first resin layer as to contact a side surface of the via.Type: GrantFiled: December 11, 2015Date of Patent: January 24, 2017Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Myung-Sam Kang, Young-Gwan Ko, Sang-Hoon Kim, Kang-Wook Bong, Hye-Won Jung, Yong-Wan Ji
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Publication number: 20160192490Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes an insulating layer including a first resin layer and a second resin layer, circuit layers disposed on upper and lower surfaces of the insulating layer, and a via configured to connect the circuit layer formed on the upper surface to the circuit layer formed on the lower surface, and the second resin layer extends from an upper surface of the first resin layer to a lower surface of the first resin layer by passing through the first resin layer as to contact a side surface of the via.Type: ApplicationFiled: December 11, 2015Publication date: June 30, 2016Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Myung-Sam KANG, Young-Gwan KO, Sang-Hoon KIM, Kang-Wook BONG, Hye-Won JUNG, Yong-Wan JI
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Publication number: 20160192491Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a first circuit layer disposed on an upper surface of a substrate, an insulating layer disposed on the substrate and the first circuit layer, a second circuit layer disposed on an upper surface of the insulating layer, and a via configured to connect between the first circuit layer and the second circuit layer, and a lower part of the via is in contact with the upper surface of the substrate.Type: ApplicationFiled: December 11, 2015Publication date: June 30, 2016Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Myung-Sam KANG, Young-Gwan KO, Sang-Hoon KIM, Kang-Wook BONG, Hye-Won JUNG, Yong-Wan JI
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Publication number: 20160100485Abstract: Disclosed are a printed circuit board and a method of manufacturing the printed circuit board, which includes: a first resist layer; a first circuit formed on the first resist layer; an insulation film formed on the first resist layer so as to cover an upper surface and a lateral surface of the first circuit; a ground formed on the insulation film so as to be connected with the first circuit electrically; and an insulation layer formed on the insulation film so as to cover the ground.Type: ApplicationFiled: March 2, 2015Publication date: April 7, 2016Inventors: Hye-Won JUNG, Myung-Sam KANG, Yong-Wan JI, Yong-Jin PARK, Young-Gwan KO, Kang-Wook BONG
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Publication number: 20160021749Abstract: There are provided a package board, a method of manufacturing the same, and a stack type package using the same. The package board according to an exemplary embodiment of the present invention includes a first insulating layer formed with a cavity and an external connection terminal formed to penetrate through the first insulating layer and have one end protruding to an outside of one surface of the first insulating layer.Type: ApplicationFiled: June 10, 2015Publication date: January 21, 2016Inventors: Kang Wook BONG, Myung Sam KANG, Yong Wan JI, Hye Won JUNG, Yong Jin PARK, Young Gwan KO