Abstract: A rivet with improved structure for forming flat-bottom riveting of plates, which comprises a rivet cover, a rivet shoulder and a rivet body; specifically, the rivet cover is provided with a torque transmission structure and a positioning structure for driving the rivet to rotate; the rivet body comprises an inner cavity of the rivet body, an outer wall of the rivet body and an end of the rivet body; with the present invention, the bottom surface of the joint can be flush with the surface of the connected plates, which facilitates the subsequent processing of the coverage on the bottom surface, reduces the wind resistance coefficient of the joint, and broadens the application range of the process.

Abstract: An intrinsic process signal-based online expulsion detection method for resistance spot welding process, which comprises: acquiring the intrinsic process signal and current signal output by sensors installed at two electrodes in real-time during the welding process and establishing a relationship graph; performing expulsion judgement based on the relationship graph to obtain expulsion frequency, single intrinsic process signal feature and an accumulated feature; calculating expulsion metal volume according to the accumulated feature and electrode profile features to obtain a prediction expulsion metal amount. The method performs online prediction of the expulsion metal amount according to the intrinsic process signal for resistance spot welding process, thereby achieving online quantitative estimation of the expulsion intensity, overcoming the defect of the traditional technology which relies on manual detection, and improving detection efficiency and accuracy.

Abstract: A rivet rotational feeding method for friction self-piercing riveting (F-SPR) system, comprising: a semi-hollow rivet, a driving spindle and a die. The bottom surface of the rivet head is connected to the semi-hollow rivet shank. The semi-hollow rivet shank has a wedge-shaped end. The rivet head has rotation driving structures and positioning structure on the top end. The rotation driving structures are central symmetric concave or convex surfaces. The positioning structure is a central symmetric and mirror symmetric concave or convex surface. The matching between the driving spindle and the rivet can improve the rotation reliability and positioning accuracy of the riveting at a high rotational speed during F-SPR process, which is beneficial to solve the problems of poor stability and non-coincidence between the geometry axis and the rotation axis of the rivet.

Abstract: A rivet rotational feeding method for friction self-piercing riveting (F-SPR) system, comprising: a semi-hollow rivet, a driving spindle and a die. The bottom surface of the rivet head is connected to the semi-hollow rivet shank. The semi-hollow rivet shank has a wedge-shaped end. The rivet head has rotation driving structures and positioning structure on the top end. The rotation driving structures are central symmetric concave or convex surfaces. The positioning structure is a central symmetric and mirror symmetric concave or convex surface. The matching between the driving spindle and the rivet can improve the rotation reliability and positioning accuracy of the riveting at a high rotational speed during F-SPR process, which is beneficial to solve the problems of poor stability and non-coincidence between the geometry axis and the rotation axis of the rivet.

Abstract: Friction stir blind rivet systems and methods are provided for joining workpieces. A FSBR joining system includes a mandrel with a head forming a tip. A stem extends from the head and has a narrowed section forming a notch. A tail section of the mandrel is configured to break off at the notch forming a broken end. A shank also has a head and a body, with a through-hole defined through the shank. The shank head includes a shoulder forming a surface contacting one workpiece. The head has an outermost point opposite the surface. A range is defined between the outermost point of the head and the surface. A wall projects from another workpiece and is formed around the body. The wall has a size formed by the mandrel and that is controlled to enable the body to deform.

Abstract: The present disclosure relates a bonding system formed by a process that provides a first substrate and a second substrate. A flux coating is applied to the first contact surface, and a solder-adhesive mixture comprising an adhesive and a plurality of solder elements in at least a portion of the adhesive is applied to the first contact surface. The second substrate is positioned adjacent the solder-adhesive mixture much that a second contact surface of the second surface is opposite the first contact surface, and heat is applied to the solder-adhesive mixture by way of at least one of the first and second contact surfaces. The solder-adhesive mixture is heated to a temperature that is intended to at least partially melt or at least partially vaporize the flux coating upon contact to promote a bonding condition between the solder-adhesive mixture and the first substrate.

Abstract: The present disclosure relates to a bonding system comprising a first substrate, a second substrate, an adhesive, in contact with a first contact surface and a second contact surface, and a plurality of solder elements positioned in the adhesive. Each solder element has a plurality of indentations located on the perimeter of the solder element and the plurality of indentations receiving a portion of the adhesive. Also, the present disclosure relates to a bonding method to produce a solder-reinforced adhesive bond joining a first substrate and a second substrate.

Abstract: The present disclosure relates a bonding system formed by a process that provides a first substrate and a second substrate. A flux coating is applied to the first contact surface, and a solder-adhesive mixture comprising an adhesive and a plurality of solder elements in at least a portion of the adhesive is applied to the first contact surface. The second substrate is positioned adjacent the solder-adhesive mixture much that a second contact surface of the second surface is opposite the first contact surface, and heat is applied to the solder-adhesive mixture by way of at least one of the first and second contact surfaces. The solder-adhesive mixture is heated to a temperature that is intended to at least partially melt or at least partially vaporize the flux coating upon contact to promote a bonding condition between the solder-adhesive mixture and the first substrate.

Abstract: The present disclosure relates a bonding system formed by a process that provides a first substrate and a second substrate. A flux coating is applied to the first contact surface, and a solder-adhesive mixture comprising an adhesive and a plurality of solder elements in at least a portion of the adhesive is applied to the first contact surface. The solder-adhesive mixture is heated to at least partially melt or at least partially vaporize the flux coating to promote a bonding condition between the solder-adhesive mixture and the first substrate. Finally, the second contact surface is then positioned adjacent the solder-adhesive mixture. The present technology additionally includes methods to produce a solder-reinforced adhesive bond joining a first substrate and a second substrate.