Patents by Inventor Yongcheng YAO

Yongcheng YAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230222651
    Abstract: Systems and methods for articular cartilage thickness mapping and lesion quantification operate on 3D medical image data to reconstruct cartilage surfaces, estimate surface normals, determine cartilage thickness, and identify regions of full-thickness cartilage loss (FCL). Reconstructed cartilage surfaces can be parcellated into subregions using a rule-based approach.
    Type: Application
    Filed: January 10, 2023
    Publication date: July 13, 2023
    Applicant: The Chinese University of Hong Kong
    Inventors: Yongcheng YAO, Weitian CHEN