Patents by Inventor Yongjun HUO

Yongjun HUO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor structure having silver-indium transient liquid phase bonding joint
    Patent number: 11894284
    Abstract: A semiconductor structure having a silver-indium transient liquid phase bonding joint is provided. With the ultra-thin silver-indium transient liquid phase bonding joint formed between the semiconductor device and the heat-spreading mount, its thermal resistance can be minimized to achieve a high thermal conductivity. Therefore, the heat spreading capability of the heat-spreading mount can be fully realized, leading to an optimal performance of the high power electronics and photonics devices.
    Type: Grant
    Filed: November 24, 2021
    Date of Patent: February 6, 2024
    Assignee: LMDJ MANAGEMENT LLC
    Inventors: Yongjun Huo, Chin Chung Lee
  • Silver-indium transient liquid phase method of bonding semiconductor device and heat-spreading mount and semiconductor structure having silver-indium transient liquid phase bonding joint
    Patent number: 11373925
    Abstract: A silver-indium transient liquid phase method of bonding a semiconductor device and a heat-spreading mount, and a semiconductor structure having a silver-indium transient liquid phase bonding joint are provided. With the ultra-thin silver-indium transient liquid phase bonding joint formed between the semiconductor device and the heat-spreading mount, its thermal resistance can be minimized to achieve a high thermal conductivity. Therefore, the heat spreading capability of the heat-spreading mount can be fully realized, leading to an optimal performance of the high power electronics and photonics devices.
    Type: Grant
    Filed: May 7, 2019
    Date of Patent: June 28, 2022
    Assignee: LIGHT-MED (USA), INC.
    Inventors: Yongjun Huo, Chin Chung Lee
  • SEMICONDUCTOR STRUCTURE HAVING SILVER-INDIUM TRANSIENT LIQUID PHASE BONDING JOINT
    Publication number: 20220084903
    Abstract: A semiconductor structure having a silver-indium transient liquid phase bonding joint is provided. With the ultra-thin silver-indium transient liquid phase bonding joint formed between the semiconductor device and the heat-spreading mount, its thermal resistance can be minimized to achieve a high thermal conductivity. Therefore, the heat spreading capability of the heat-spreading mount can be fully realized, leading to an optimal performance of the high power electronics and photonics devices.
    Type: Application
    Filed: November 24, 2021
    Publication date: March 17, 2022
    Applicant: LIGHT-MED (USA), INC.
    Inventors: Yongjun HUO, Chin Chung LEE
  • SILVER-INDIUM TRANSIENT LIQUID PHASE METHOD OF BONDING SEMICONDUCTOR DEVICE AND HEAT-SPREADING MOUNT AND SEMICONDUCTOR STRUCTURE HAVING SILVER-INDIUM TRANSIENT LIQUID PHASE BONDING JOINT
    Publication number: 20220005744
    Abstract: A silver-indium transient liquid phase method of bonding a semiconductor device and a heat-spreading mount, and a semiconductor structure having a silver-indium transient liquid phase bonding joint are provided. With the ultra-thin silver-indium transient liquid phase bonding joint formed between the semiconductor device and the heat-spreading mount, its thermal resistance can be minimized to achieve a high thermal conductivity. Therefore, the heat spreading capability of the heat-spreading mount can be fully realized, leading to an optimal performance of the high power electronics and photonics devices.
    Type: Application
    Filed: May 7, 2019
    Publication date: January 6, 2022
    Applicant: LIGHT-MED (USA), INC.
    Inventors: Yongjun HUO, Chin Chung LEE