Patents by Inventor YongLiang HUANG

YongLiang HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240051496
    Abstract: A winding drum used for winding a safety belt extends in the axial direction and is rotatably supported in a frame of a retractor. A gear mechanism is installed at one side of the winding drum through a force limiting mechanism and comprises a stop wheel and a ball gear which are riveted and fixedly connected in the axial direction. The stop wheel is rotatably installed on the frame, and the ball gear comprises a penetrating shaft hole. The force limiting mechanism is inserted into the shaft hole in the axial direction and both ends of the force limiting mechanism are respectively connected with the winding drum and the gear mechanism to prevent passengers from being excessively restrained by realizing the force limiting function. The gear mechanism and the force limiting mechanism are directly assembled to the winding drum, with simple steps and few independent components.
    Type: Application
    Filed: August 11, 2023
    Publication date: February 15, 2024
    Inventors: Wei ZHAO, Bin CHEN, Yongliang HUANG
  • Publication number: 20220370917
    Abstract: A method for allocating virtual reward resources performed by an electronic device are provided. The method includes: obtaining behavior information of each virtual character in a target camp during a teamfight of a game, the target camp including at least one virtual character, the behavior information being a behavior applied by each virtual character in the target camp to a virtual object, and the virtual object being a virtual character in at least one of the target camp or an enemy camp; determining, according to the behavior information, contribution information achieved by each virtual character in the target camp during the teamfight; determining, according to the contribution information, a target virtual character and a target virtual reward resource corresponding to the target virtual character from at least one virtual character included in the target camp; and updating attribute information of the target virtual character according to the target virtual reward resource.
    Type: Application
    Filed: May 10, 2022
    Publication date: November 24, 2022
    Inventors: Zexian DONG, Chen LIANG, Yong GAO, Shenyang HU, Yongliang HUANG, Meng WANG
  • Patent number: 11413528
    Abstract: A method for displaying a skin of a virtual character includes: displaying a matchmaking user interface (UI) for matching k user accounts online for gaming in the same virtual world, k being a positive integer; obtaining a customization parameter of a customized skin model of a target virtual character from a server when the target virtual character is present in virtual characters used by the k user accounts; loading n target skin component materials of the customized skin model according to the customization parameter, n being a positive integer; and displaying a gaming UI. The customized skin model is one of complete skin set models corresponding to the target virtual character and includes n skin components in a same style. The gaming UI includes the target virtual character located in the virtual world, the target virtual character wearing the customized skin model.
    Type: Grant
    Filed: March 16, 2021
    Date of Patent: August 16, 2022
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Tianyu Wang, Zidong Mo, Haichao Zhang, Yongliang Huang, Chuan Lv, Xiangya Feng
  • Publication number: 20220196810
    Abstract: The present disclosure relates to a time of flight ranging system and a ranging method thereof, the ranging method comprising: performing scattering detection, and obtaining a scattering coefficient of each pixel unit in the sensing array, specifically comprising: emitting scattering detection light into a detection field of view, the detection field of view includes detected objects at different distances and is divided into a close-range area and a far-range area; obtaining a detection value of each pixel unit generated by reflected light and scattered light generated by the reflected light, calculating a ratio of the detection value generated by each pixel unit to a sum of the detection values generated by all pixel units of the entire sensing array as a pixel scattering coefficient corresponding to the pixel unit; performing distance measurement, and obtaining an initial measurement value output by each pixel unit; correcting initial measurement values output by at least part of the pixel units according
    Type: Application
    Filed: September 27, 2020
    Publication date: June 23, 2022
    Inventors: Yongliang HUANG, Jian MEI
  • Publication number: 20220023758
    Abstract: Embodiments of this application disclose a method for previewing an in-game action in an out-of-game environment performed by a terminal. The method includes: displaying an out-of-game environment interface; obtaining, when a trigger operation for a target preview control in the out-of-game environment interface is received, a target configuration file corresponding to the target preview control, the target configuration file being used for controlling a target character model to perform a corresponding in-game action in a battle of an online game application; generating out-of-game model preview information according to the target configuration file; and controlling, according to the out-of-game model preview information, the target character model to perform the in-game action in the out-of-game environment interface. An in-game action of a character model is previewed in an out-of-game environment by reusing in-game configuration files, so that types of in-game actions that can be previewed are enriched.
    Type: Application
    Filed: October 8, 2021
    Publication date: January 27, 2022
    Inventors: Yongliang HUANG, Yiwei SONG
  • Publication number: 20210197089
    Abstract: A method for displaying a skin of a virtual character includes: displaying a matchmaking user interface (UI) for matching k user accounts online for gaming in the same virtual world, k being a positive integer; obtaining a customization parameter of a customized skin model of a target virtual character from a server when the target virtual character is present in virtual characters used by the k user accounts; loading n target skin component materials of the customized skin model according to the customization parameter, n being a positive integer; and displaying a gaming UI. The customized skin model is one of complete skin set models corresponding to the target virtual character and includes n skin components in a same style. The gaming UI includes the target virtual character located in the virtual world, the target virtual character wearing the customized skin model.
    Type: Application
    Filed: March 16, 2021
    Publication date: July 1, 2021
    Inventors: Tianyu WANG, Zidong MO, Haichao ZHANG, Yongliang HUANG, Chuan LV, Xiangya FENG
  • Patent number: 10957243
    Abstract: A display drive circuit, a method for operating the display drive circuit, and a display panel. The method for operating the display drive circuit comprises: reversing output values of a first voltage output terminal and a second voltage output terminal to make a reference voltage output terminal outputs a high voltage, and a sampling voltage output terminal outputs a low voltage; scan lines providing a scan voltage, data lines providing a data voltage, and a sensor sensing a voltage variation value of a anode of a light-emitting diode; and adjusting the data voltage provided by the data lines according to the voltage variation value.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: March 23, 2021
    Assignee: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Quansheng Liu, Yongliang Huang
  • Patent number: 10678003
    Abstract: The disclosure provides an optical module that includes a circuit board, a first chip, a second chip, and a lens assembly, wherein the first chip and the second chip are arranged respectively on the surface of the circuit board, and the lens assembly is arranged above the first chip and the second chip; the lens assembly includes a first optic fiber insertion port, a second optic fiber insertion port, a first reflecting surface, and a second reflecting surface; the distance between the axis of the first optic fiber insertion port, and the axis of the second optic fiber insertion port is less than the distance between the first chip and the second chip; and the first reflecting surface faces the first chip, the first reflecting surface faces the second reflecting surface, and the second reflecting surface faces the first optic fiber insertion port.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: June 9, 2020
    Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE USA CORPORATION, HISENSE INTERNATIONAL CO., LTD.
    Inventors: Xuxia Liu, Yongliang Huang, Qian Shao
  • Patent number: 10624203
    Abstract: The disclosure discloses an optical module, and relates to the field of optic fiber communications. A circuit according to an embodiment of the disclosure includes: a chip, which includes at least one wiring side, and on which there are arranged first signal interface pads arranged parallel to the wiring side; a circuit board on which there are arranged a number of second signal interface pads corresponding to the first signal interface pads, wherein at least two of the distances between the respective second signal interface pads and the wiring side are different from each other; and signal wires configured to connect the corresponding first signal interface pads and second signal interface pads.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: April 14, 2020
    Assignees: Hisense Broadband Multimedia Technologies Co., Ltd., Hisense USA Corporation, Hisense International Co., Ltd.
    Inventors: Sigeng Yang, Shijian Ben, Jingsheng Xia, Yongliang Huang
  • Patent number: 10587093
    Abstract: A connection structure for a laser and a laser assembly are provided. The connection structure for a laser includes a first insulation substrate, where the first insulation substrate includes a conductive path separately on an upper surface and a lower surface thereof. A second insulation substrate is disposed on the upper surface of the first insulation substrate. An upper surface of the second insulation substrate includes a conductive path. The conductive path on the upper surface of the second insulation substrate is electrically connected to the conductive path on the lower surface of the first insulation substrate via a through-hole. The connection structure for a laser and the laser assembly in the present disclosure are configured to supplying power to a laser.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: March 10, 2020
    Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE USA CORP., HISENSE INTERNATIONAL CO., LTD.
    Inventors: Hao Wang, Hongwei Mu, YongLiang Huang, Shun Zhang
  • Patent number: 10459180
    Abstract: The disclosure provides an optical module, including a housing, a circuit board and a light conducting structure; a portion of the light conducting structure is disposed in the housing, another portion of the light conducting structure juts out from the housing; the circuit board is provided with a light source, and the light conducting structure is configured to conduct light emitted by the light source to an outside of the housing. The optical conducting module in the optical module can conduct light emitted from the optical module to outside of the optical module. The optical module allows the state inside the optical module to be conducted to and displayed in the outside of the optical module with optical signals as propagation medium. The state inside the optical module can be directly learned from the outside of the optical module housing, thereby extending application scenarios of the optical module.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: October 29, 2019
    Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES, LTD.
    Inventors: Sigeng Yang, Yinlong Liu, Yongliang Huang, Shijian Ben, Jingsheng Xia, Peng He, Haiqiang Xu, Shengwei Bo, Tengyue Li
  • Patent number: 10302881
    Abstract: An optical component includes: a first substrate, a second substrate, and a transfer board. A first electrically conductive path is disposed on a top surface of the first substrate. A second electrically conductive path is disposed on a bottom surface of the first substrate. A third electrically conductive path is disposed on a top surface of the second substrate. A microstrip line structure is disposed on the transfer board. The microstrip line structure includes a transfer line disposed on a top surface of the transfer board. The top surface of the second substrate is opposite to the bottom surface of the first substrate, where the second electrically conductive path fits the third electrically conductive path. The transfer board is disposed on the top of the top surface of the second substrate. One end of the transfer line is electrically connected to the first electrically conductive path by a wire bonding.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: May 28, 2019
    Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE USA CORP., HISENSE INTERNATIONAL CO., LTD.
    Inventors: Hao Wang, Hongwei Mu, YongLiang Huang, Shun Zhang
  • Patent number: 10185103
    Abstract: The disclosure provides an optical module that includes a circuit board, a first chip, a second chip, and a lens assembly, wherein the first chip and the second chip are arranged respectively on the surface of the circuit board, and the lens assembly is arranged above the first chip and the second chip; the lens assembly includes a first optic fiber insertion port, a second optic fiber insertion port, a first reflecting surface, and a second reflecting surface; the distance between the axis of the first optic fiber insertion port, and the axis of the second optic fiber insertion port is less than the distance between the first chip and the second chip; and the first reflecting surface faces the first chip, the first reflecting surface faces the second reflecting surface, and the second reflecting surface faces the first optic fiber insertion port.
    Type: Grant
    Filed: October 10, 2016
    Date of Patent: January 22, 2019
    Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE USA CORPORATION, HISENSE INTERNATIONAL CO., LTD.
    Inventors: Xuxia Liu, Yongliang Huang, Qian Shao
  • Patent number: 10183646
    Abstract: According to one embodiment, an occupant restraining apparatus includes a webbing W, a tongue 4, an airbag 20 provided along the webbing W, a bag cover 40 surrounding the airbag 20, and a webbing guide 30 through which the webbing W is passed. The webbing guide 30 extends continuously from one end to the other end of the bag cover 40. The lower end of the bag cover 40 surrounds the lower end of the webbing guide 30, and the lower end of the bag cover 40 and the lower end of the webbing guide 30 are bound together. The upper end of the bag cover 40 surrounds the upper end of the webbing guide 30, and the upper end of the bag cover 40 and the upper end of the webbing guide 30 are bound together.
    Type: Grant
    Filed: May 3, 2017
    Date of Patent: January 22, 2019
    Assignee: JOYSON SAFETY SYSTEMS JAPAN K.K.
    Inventors: Yoshiki Murakami, Hiroaki Isozaki, Tatsuya Higuchi, Yongliang Huang
  • Publication number: 20180372967
    Abstract: The disclosure provides an optical module that includes a circuit board, a first chip, a second chip, and a lens assembly, wherein the first chip and the second chip are arranged respectively on the surface of the circuit board, and the lens assembly is arranged above the first chip and the second chip; the lens assembly includes a first optic fiber insertion port, a second optic fiber insertion port, a first reflecting surface, and a second reflecting surface; the distance between the axis of the first optic fiber insertion port, and the axis of the second optic fiber insertion port is less than the distance between the first chip and the second chip; and the first reflecting surface faces the first chip, the first reflecting surface faces the second reflecting surface, and the second reflecting surface faces the first optic fiber insertion port.
    Type: Application
    Filed: August 31, 2018
    Publication date: December 27, 2018
    Inventors: Xuxia LIU, Yongliang HUANG, Qian SHAO
  • Publication number: 20180314018
    Abstract: The disclosure provides an optical module, including a housing, a circuit board and a light conducting structure; a portion of the light conducting structure is disposed in the housing, another portion of the light conducting structure juts out from the housing; the circuit board is provided with a light source, and the light conducting structure is configured to conduct light emitted by the light source to an outside of the housing. The optical conducting module in the optical module can conduct light emitted from the optical module to outside of the optical module. The optical module allows the state inside the optical module to be conducted to and displayed in the outside of the optical module with optical signals as propagation medium. The state inside the optical module can be directly learned from the outside of the optical module housing, thereby extending application scenarios of the optical module.
    Type: Application
    Filed: April 24, 2018
    Publication date: November 1, 2018
    Inventors: SIGENG YANG, YINLONG LIU, YONGLIANG HUANG, SHIJIAN BEN, JINGSHENG XIA, PENG HE, HAIQIANG XU, SHENGWEI BO, TENGYUE LI
  • Publication number: 20180317315
    Abstract: The disclosure discloses an optical module, and relates to the field of optic fiber communications. A circuit according to an embodiment of the disclosure includes: a chip, which includes at least one wiring side, and on which there are arranged first signal interface pads arranged parallel to the wiring side; a circuit board on which there are arranged a number of second signal interface pads corresponding to the first signal interface pads, wherein at least two of the distances between the respective second signal interface pads and the wiring side are different from each other; and signal wires configured to connect the corresponding first signal interface pads and second signal interface pads.
    Type: Application
    Filed: July 6, 2018
    Publication date: November 1, 2018
    Inventors: Sigeng YANG, Shijian BEN, Jingsheng XIA, Yongliang HUANG
  • Patent number: 9983373
    Abstract: The disclosure provides an optical module, including a housing, a circuit board and a light conducting structure; a portion of the light conducting structure is disposed in the housing, another portion of the light conducting structure juts out from the housing; the circuit board is provided with a light source, and the light conducting structure is configured to conduct light emitted by the light source to an outside of the housing. The optical conducting module in the optical module can conduct light emitted from the optical module to outside of the optical module. The optical module allows the state inside the optical module to be conducted to and displayed in the outside of the optical module with optical signals as propagation medium. The state inside the optical module can be directly learned from the outside of the optical module housing, thereby extending application scenarios of the optical module.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: May 29, 2018
    Assignees: Hisense Broadband Multimedia Technologies Co., Ltd., Hisense Broadband Multimedia Technologies Ltd.
    Inventors: Sigeng Yang, Yinlong Liu, Yongliang Huang, Shijian Ben, Jingsheng Xia, Peng He, Haiqiang Xu, Shengwei Bo, Tengyue Li
  • Publication number: 20180138656
    Abstract: A connection structure for a laser and a laser assembly are provided. The connection structure for a laser includes a first insulation substrate, where the first insulation substrate includes a conductive path separately on an upper surface and a lower surface thereof. A second insulation substrate is disposed on the upper surface of the first insulation substrate. An upper surface of the second insulation substrate includes a conductive path. The conductive path on the upper surface of the second insulation substrate is electrically connected to the conductive path on the lower surface of the first insulation substrate via a through-hole. The connection structure for a laser and the laser assembly in the present disclosure are configured to supplying power to a laser.
    Type: Application
    Filed: December 22, 2017
    Publication date: May 17, 2018
    Applicants: Hisense Broadband Multimedia Technologies Co., Ltd ., Hisense USA Corp., Hisense International Co., Ltd.
    Inventors: Hao Wang, Hongwei Mu, YongLiang Huang, Shun Zhang
  • Publication number: 20180095229
    Abstract: An optical component includes: a first substrate, a second substrate, and a transfer board. A first electrically conductive path is disposed on a top surface of the first substrate. A second electrically conductive path is disposed on a bottom surface of the first substrate. A third electrically conductive path is disposed on a top surface of the second substrate. A microstrip line structure is disposed on the transfer board. The microstrip line structure includes a transfer line disposed on a top surface of the transfer board. The top surface of the second substrate is opposite to the bottom surface of the first substrate, where the second electrically conductive path fits the third electrically conductive path. The transfer board is disposed on the top of the top surface of the second substrate. One end of the transfer line is electrically connected to the first electrically conductive path by a wire bonding.
    Type: Application
    Filed: December 5, 2017
    Publication date: April 5, 2018
    Applicants: Hisense Broadband Multimedia Technologies Co., Ltd ., Hisense USA Corp., Hisense International Co., Ltd.
    Inventors: Hao Wang, Hongwei Mu, YongLiang Huang, Shun Zhang