Abstract: A blower may include a base, a case provided above the base and having an air inlet and an air outlet, a fan provided inside the case, a rotating plate connected to the case and provided to be rotatable above the base, a motor to rotate the rotating plate, and a bearing provided between the rotating plate and the base, fixed to the rotating plate, and supported movably on the base.

Abstract: A blower may include a lower case having a suction port and a fan and an upper case having at least one main discharge port and at least one auxiliary discharge port. The auxiliary discharge port may be positioned in front of and below the main discharge port to discharge air introduced through the suction port upward. A door may open and/or close the auxiliary discharge port, and a door motor may power the door. The upper case may be formed as two towers defining a blowing space therebetween, and the at least one auxiliary discharge port may include a plurality of auxiliary discharge ports formed in inner walls of the two towers to face each other.

Abstract: A blower is provided that may include a fan that creates airflow; a lower body forming a lower space therein in which the fan may be disposed, and having at least one suction hole through which air passes; a first upper body positioned above the lower body, and forming a first inner space that communicates with the lower space of the lower body; a second upper body positioned above the lower body, and forming a second inner space that communicates with the lower space of the lower body, the second upper body being spaced apart from the first upper body; and a space formed between the first upper body and the second upper body, and opened in a frontward-rearward direction. The first upper body may include a first slit formed through the first upper body such that air in the first inner space may be discharged into the space, and the second upper body may include a second slit formed through the second upper body such that air in the second inner space may be discharged into the space.

Abstract: A blower is provided that may include a fan that creates airflow; a lower body forming an inner space in which the fan may be installed, and having at least one suction hole through which air passes; an upper body positioned above the lower body and including a first upper body forming a first inner space that communicates with the inner space of the lower body, and a second upper body forming a second inner space that communicates with the inner space of the lower body and spaced apart from the first upper body; a space formed between the first upper body and the second upper body and opened in a frontward-rearward direction; a first opening formed through a first boundary surface of the first upper body facing the space; a second opening formed through a second boundary surface of the second upper body facing the space; and a door assembly including a first door installed at the first upper body and that opens and closes the first opening, and a second door installed at the second upper body and that opens

Abstract: A manufacturing process includes: depositing a first catalyst on a first gas diffusion layer (GDL) to form a first catalyst-coated GDL; depositing a first ionomer on the first catalyst-coated GDL to form a first gas diffusion electrode (GDE); depositing a second catalyst on a second GDL to form a second catalyst-coated GDL; depositing a second ionomer on the second catalyst-coated GDL to form a second GDE; and laminating the first GDE with the second GDE and with an electrolyte membrane disposed between the first GDE and the second GDE to form a membrane electrode assembly (MEA). A MEA includes a first GDL; a second GDL; an electrolyte membrane disposed between the first GDL and the second GDL; a first catalyst layer disposed between the first GDL and the electrolyte membrane; and a second catalyst layer disposed between the second GDL and the electrolyte membrane, wherein a thickness of the electrolyte membrane is about 15 ?m or less.

Abstract: A flow generator according to an embodiment of the present invention includes an upper fan configured to suction upper air and generate a first airflow, an upper fan housing configured to accommodate the upper fan from a lower side thereof and comprising a first discharge part through which the suctioned upper air is discharged, a lower fan configured to suction lower air and generate a second airflow, a lower fan housing configured to accommodate the lower fan from an upper side thereof and comprising a second discharge part through which the suctioned lower air is discharged, an air guide disposed between the upper fan and the lower fan to guide generation of a third airflow in which the first airflow and the second airflow are mixed with each other, and a control unit configured to control a rotational speed of the lower fan or the upper fan to adjust a discharge direction of the third airflow, wherein the first discharge part is disposed to face the second discharge part with respect to the flow guide par

Abstract: A flow generator according to an embodiment of the present invention includes an upper fan configured to suction upper air and generate a first airflow, an upper fan housing configured to accommodate the upper fan from a lower side thereof and comprising a first discharge part through which the suctioned upper air is discharged, a lower fan configured to suction lower air and generate a second airflow, a lower fan housing configured to accommodate the lower fan from an upper side thereof and comprising a second discharge part through which the suctioned lower air is discharged, an air guide disposed between the upper fan and the lower fan to guide generation of a third airflow in which the first airflow and the second airflow are mixed with each other, and a control unit configured to control a rotational speed of the lower fan or the upper fan to adjust a discharge direction of the third airflow, wherein the first discharge part is disposed to face the second discharge part with respect to the flow guide par

Abstract: A membrane electrode assembly manufacturing device includes a loading apparatus for supplying an MEA roll on which a membrane electrode assembly is arranged by a predetermined pitch, a hot press apparatus for pressing a surface corresponding to the membrane electrode assembly of the MEA roll at a set temperature, a buffer apparatus to which the MEA roll is supplied to one side and exhausted at the other side, and for performing a buffer function of absorbing a difference between supply and exhaustion, and a cutting apparatus for cutting a portion of the membrane electrode assembly arranged at the MEA roll.

Abstract: A semiconductor device includes a substrate with an opening formed through the substrate. A first electronic component is disposed over the substrate outside a footprint of the first opening. A second electronic component is disposed over the substrate opposite the first electrical component. A third electronic component is disposed over the substrate adjacent to the first electronic component. The substrate is disposed in a mold including a second opening of the mold over a first side of the substrate. The mold contacts the substrate between the first electronic component and the third electronic component. An encapsulant is deposited into the second opening. The encapsulant flows through the first opening to cover a second side of the substrate. In some embodiments, a mold film is disposed in the mold, and an interconnect structure on the substrate is embedded in the mold film.

Abstract: A supported catalyst includes: (1) a catalyst support; and (2) deposits of a catalyst covering the catalyst support, wherein the deposits have an average thickness of about 2 nm or less, and the deposits are spaced apart from one another.

Abstract: A semiconductor device includes a substrate with an opening formed through the substrate. A first electronic component is disposed over the substrate outside a footprint of the first opening. A second electronic component is disposed over the substrate opposite the first electrical component. A third electronic component is disposed over the substrate adjacent to the first electronic component. The substrate is disposed in a mold including a second opening of the mold over a first side of the substrate. The mold contacts the substrate between the first electronic component and the third electronic component. An encapsulant is deposited into the second opening. The encapsulant flows through the first opening to cover a second side of the substrate. In some embodiments, a mold film is disposed in the mold, and an interconnect structure on the substrate is embedded in the mold film.

Abstract: An air conditioner includes a humidifying assembly and a control unit to control the humidifying assembly. The humidifying assembly includes a humidifying-receiving unit including a water tank configured to receive water and a humidifying-sterilizing unit configured to irradiate light to sterilize water received in the water tank. The control unit is configured to control a driving time of the humidifying-sterilizing unit based on an amount of water received in the water tank.

Abstract: A semiconductor device includes a substrate with an opening formed through the substrate. A first electronic component is disposed over the substrate outside a footprint of the first opening. A second electronic component is disposed over the substrate opposite the first electrical component. A third electronic component is disposed over the substrate adjacent to the first electronic component. The substrate is disposed in a mold including a second opening of the mold over a first side of the substrate. The mold contacts the substrate between the first electronic component and the third electronic component. An encapsulant is deposited into the second opening. The encapsulant flows through the first opening to cover a second side of the substrate. In some embodiments, a mold film is disposed in the mold, and an interconnect structure on the substrate is embedded in the mold film.

Abstract: A method of manufacturing an organic light-emitting diode (OLED) display includes forming a thin film transistor and a first storage capacitor electrode, forming a second storage capacitor electrode overlapping the first storage capacitor electrode with a passivation layer covering the first storage capacitor electrode, the passivation layer being interposed between the second storage capacitor electrode and the first storage capacitor electrode, sequentially forming a first anode electrode and an insulating layer to overlap the second storage capacitor electrode on an overcoat layer covering the second storage capacitor, forming a pixel contact hole exposing a drain electrode of the thin film transistor through the overcoat layer and the passivation layer, and forming a second anode electrode coming in contact with the drain electrode and the first anode electrode and overlapping the first anode electrode with the insulating layer interposed between the second anode electrode and the first anode electrode.

Abstract: A semiconductor device includes a substrate with an opening formed through the substrate. A first electronic component is disposed over the substrate outside a footprint of the first opening. A second electronic component is disposed over the substrate opposite the first electrical component. A third electronic component is disposed over the substrate adjacent to the first electronic component. The substrate is disposed in a mold including a second opening of the mold over a first side of the substrate. The mold contacts the substrate between the first electronic component and the third electronic component. An encapsulant is deposited into the second opening. The encapsulant flows through the first opening to cover a second side of the substrate. In some embodiments, a mold film is disposed in the mold, and an interconnect structure on the substrate is embedded in the mold film.

Abstract: A catalyst structure includes: (1) a substrate; (2) a catalyst layer on the substrate; and (3) an adhesion layer disposed between the substrate and the catalyst layer. In some implementations, an average thickness of the adhesion layer is about 1 nm or less. In some implementations, a material of the catalyst layer at least partially extends into a region of the adhesion layer. In some implementations, the catalyst layer is characterized by a lattice strain imparted by the adhesion layer.

Abstract: A membrane electrode assembly manufacturing device includes a loading apparatus for supplying an MEA roll on which a membrane electrode assembly is arranged by a predetermined pitch, a hot press apparatus for pressing a surface corresponding to the membrane electrode assembly of the MEA roll at a set temperature, a buffer apparatus to which the MEA roll is supplied to one side and exhausted at the other side, and for performing a buffer function of absorbing a difference between supply and exhaustion, and a cutting apparatus for cutting a portion of the membrane electrode assembly arranged at the MEA roll.

Abstract: A membrane electrode assembly manufacturing device includes a loading apparatus for supplying an MEA roll on which a membrane electrode assembly is arranged by a predetermined pitch, a hot press apparatus for pressing a surface corresponding to the membrane electrode assembly of the MEA roll at a set temperature, a buffer apparatus to which the MEA roll is supplied to one side and exhausted at the other side, and for performing a buffer function of absorbing a difference between supply and exhaustion, and a cutting apparatus for cutting a portion of the membrane electrode assembly arranged at the MEA roll.

Abstract: A method includes (1) functionalizing a substrate to yield a functionalized substrate; and (2) depositing a catalyst on the functionalized substrate by atomic layer deposition to form a thin film of the catalyst covering the functionalized substrate.

Abstract: Provided is an air conditioning apparatus. The air conditioning apparatus includes an air cleaner and an air washer coupled to the air cleaner.