Patents by Inventor Yongzhen Gao

Yongzhen Gao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device and Method for Enhancing Nitrogen and Phosphorus Removal Based on Multistage AO Partial Denitrification Coupled with Anammox in Combination with Sludge Hydrolytic Acidification
    Publication number: 20240067546
    Abstract: A device and method for enhancing nitrogen and phosphorus removal based on a multistage AO partial denitrification coupled with Anammox process in combination with a sludge hydrolytic acidification mixture belong to the technical field of active sludge method wastewater treatment. A system includes a water tank, a water pump, a biochemical reaction zone, a hydrolytic acidification tank and other devices.
    Type: Application
    Filed: July 21, 2021
    Publication date: February 29, 2024
    Inventors: Yongzhen Peng, Qi Zhao, Ruitao Gao, Jianwei Li, Liyan Deng
  • Millimeter-wave active antenna unit, and interconnection structure between PCB boards
    Patent number: 11716812
    Abstract: A millimeter-wave active antenna unit and an interconnection structure between PCBs is provided. The interconnection structure between PCBs comprises a mainboard and an AIP antenna module. The mainboard is a first multilayer PCB on which a signal transmission line and a first pad electrically connected to the signal transmission line are provided. The AIP antenna module is a second multilayer PCB on which a second pad, an impedance matching transformation branch, an impedance line and a signal processing circuit are provided. The mainboard and the AIP antenna module are interconnected by directly welding multiple PCBs.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: August 1, 2023
    Inventors: Yongzhen Gao, Shangkun Wu, Zhimei Zhang, Xia Gao, Weidong Zhong
  • Millimeter-Wave Active Antenna Unit, And Interconnection Structure Between PCB Boards
    Publication number: 20220256702
    Abstract: A millimeter-wave active antenna unit and an interconnection structure between PCBs is provided. The interconnection structure between PCBs comprises a mainboard and an AIP antenna module. The mainboard is a first multilayer PCB on which a signal transmission line and a first pad electrically connected to the signal transmission line are provided. The AIP antenna module is a second multilayer PCB on which a second pad, an impedance matching transformation branch, an impedance line and a signal processing circuit are provided. The mainboard and the AIP antenna module are interconnected by directly welding multiple PCBs.
    Type: Application
    Filed: December 11, 2019
    Publication date: August 11, 2022
    Applicant: Comba Network Systems Company Limited
    Inventors: Yongzhen Gao, Shangkun Wu, Zhimei Zhang, Xia Gao, Weidong Zhong