Patents by Inventor Yoo Jeong LEE
Yoo Jeong LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11935701Abstract: A capacitor component includes a body including dielectric layers, first and second internal electrodes, laminated in a first direction, facing each other, and first and second cover portions, disposed on outermost portions of the first and second internal electrodes, and first and second external electrodes, respectively disposed on both external surfaces of the body in a second direction, perpendicular to the first direction, and respectively connected to the first and second internal electrodes. An indentation including a glass is disposed at at least one of boundaries between the first internal electrodes and the first external electrode or one of boundaries between the second internal electrodes and the second external electrode.Type: GrantFiled: April 4, 2023Date of Patent: March 19, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jang Yeol Lee, Ji Hong Jo, Yoo Jeong Lee, Myung Jun Park, Jong Ho Lee, Hye Young Choi, Jae Hyun Lee, Hyun Hee Gu
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Patent number: 11842853Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes: an electronic component body including a body having a dielectric layer and an internal electrode, and an external electrode disposed on the body; and a coating layer disposed on an external surface of the electronic component body, including one or more of silicon (Si) and fluorine (F), and having an average thickness of 5 nm or more and 15 nm or less.Type: GrantFiled: September 9, 2021Date of Patent: December 12, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyung Jong Choi, Yoo Jeong Lee, Kwan Young Son, Woo Kyung Sung, Kyu Sik Park, Myung Jun Park, Kwang Yeun Won
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Publication number: 20230260709Abstract: A multilayer electronic component includes a body including a plurality of internal electrodes and a dielectric layer interposed between the plurality of internal electrodes, and an external electrode including an electrode layer disposed on the body to be connected to the plurality of internal electrodes and a conductive resin layer disposed on the electrode layer. The electrode layer includes an island region.Type: ApplicationFiled: December 22, 2022Publication date: August 17, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yoo Jeong Lee, Hyung Jong Choi, Chung Yeol Lee, Kwang Yeun Won, So Jung An, Woo Kyung Sung, Myung Jun Park, Jong Ho Lee
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Publication number: 20230260707Abstract: A capacitor component includes a body including dielectric layers, first and second internal electrodes, laminated in a first direction, facing each other, and first and second cover portions, disposed on outermost portions of the first and second internal electrodes, and first and second external electrodes, respectively disposed on both external surfaces of the body in a second direction, perpendicular to the first direction, and respectively connected to the first and second internal electrodes. An indentation including a glass is disposed at at least one of boundaries between the first internal electrodes and the first external electrode or one of boundaries between the second internal electrodes and the second external electrode.Type: ApplicationFiled: April 4, 2023Publication date: August 17, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jang Yeol Lee, Ji Hong Jo, Yoo Jeong Lee, Myung Jun Park, Jong Ho Lee, Hye Young Choi, Jae Hyun Lee, Hyun Hee Gu
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Publication number: 20230260708Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other and third and fourth surfaces connected to the first and second surfaces and opposing each other, the body including dielectric layers and internal electrodes interposed between the dielectric layers, and an external electrode disposed on the body to be connected to the internal electrodes. The external electrode includes first and second plating layers respectively covering the third and fourth surfaces, a first electrode layer covering portions of the first and second surfaces and having one side surface in contact with one side surface of the first plating layer, a second electrode layer covering the portions of the first and second surfaces and having one side surface in contact with one side surface of the second plating layer, and third and fourth plating layers respectively covering the first and second plating layers.Type: ApplicationFiled: December 20, 2022Publication date: August 17, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: So Jung AN, Yoo Jeong LEE, Hyung Jong CHOI, Chung Yeol LEE, Kwang Yeun WON, Woo Kyung SUNG, Myung Jun PARK, Jong Ho LEE
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Publication number: 20230238182Abstract: A multilayer electronic component includes a body including a dielectric layer and a first internal electrode and a second internal electrode and having first to sixth surfaces, a first external electrode including a first connection portion on the third surface, a first band portion on the first surface, and a third band portion on the second surface, a second external electrode including a second connection portion on the fourth surface, a second band portion on the first surface, and a fourth band portion on the second surface, an insulating layer disposed on the second surface and extending onto the first and second connection portions, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion. The insulating layer includes glass, and a region disposed on the second surface in the insulating layer has a convex shape in the first direction.Type: ApplicationFiled: September 13, 2022Publication date: July 27, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyung Jong CHOI, Yoo Jeong LEE, Chung Yeol LEE, Kwang Yeun WON, So Jung AN, Kang Ha LEE, Woo Kyung SUNG, Myung Jun PARK, Jong Ho LEE
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Publication number: 20230230770Abstract: A multilayer electronic component includes: a body having first and second surfaces opposing each other in a first direction, and third and fourth surfaces connected to first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion disposed on the third surface, a first band portion extending from the first connection portion onto a portion of the first surface, and a third band portion extending from the first connection portion onto a portion of the second surface; a second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer including a silicone-based resin and disposed on the first and second connection portions.Type: ApplicationFiled: September 1, 2022Publication date: July 20, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: So Jung AN, Hyung Jong CHOI, Yoo Jeong LEE, Chung Yeol LEE, Kwang Yeun WON, Woo Kyung SUNG, Myung Jun PARK, Jong Ho LEE
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Publication number: 20230223195Abstract: A multilayer electronic component includes: a body including a dielectric layer and internal electrodes alternately disposed while having the dielectric layer interposed therebetween; a first external electrode including a first connection portion and first and third band portions extending from ends of the first connection portion; a second external electrode including a second connection portion and second and fourth band portions extending from the second connection portion; an insulating layer disposed on the first and second connection portions and covering a top surface of the body and the third and fourth band portions; first and second plating layers disposed on the first and second band portions, respectively. An end of the plating layer and an end of the insulating layer contact with each other, and a thickness of the end of the plating layer and a thickness of the end of the insulating layer decreases toward the contact point.Type: ApplicationFiled: October 25, 2022Publication date: July 13, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyung Jong CHOI, Yoo Jeong LEE, Chung Yeol LEE, Kwang Yeun WON, So Jung AN, Kang Ha LEE, Woo Kyung SUNG, Myung Jun PARK, Jong Ho LEE
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Publication number: 20230215647Abstract: A multilayer electronic component includes: a body including dielectric layers and internal electrodes alternately disposed with respective dielectric layers interposed therebetween; a first external electrode including a first connection portion, and first and second band portions extending from the first connection portion; a second external electrode including a second connection portion, and second and fourth band portions extending from the second connection portion; an insulating layer disposed to extend to a portion on the first and second connection portions; a first plating layer disposed on the first band portion and disposed to extend to be in contact with the insulating layer; and a second plating layer disposed on the second band portion and disposed to extend to be in contact with the insulating layer. An average thickness of the first or second plating layer is smaller than an average thickness of the insulating layer.Type: ApplicationFiled: September 27, 2022Publication date: July 6, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yoo Jeong Lee, Chung Yeol Lee, Hyung Jong Choi, Kwang Yeun Won, So Jung An, Kang Ha Lee, Woo Kyung Sung, Myung Jun Park, Jong Ho Lee
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Publication number: 20230215643Abstract: An electronic component includes a body including a dielectric layer and internal electrodes, and including first to sixth surfaces; a first external electrode including a first connection portion on the third surface and a first band portion on the first surface; a second external electrode including a second connection portion on the fourth surface and a second band portion on the first surface; an insulating layer on the second surface and the first and second connection portions; and a plating layer on the first and second band portions. The plating layer extends onto the first and second connection portions and is in contact with the insulating layer. A thickness of an end of the insulating layer decreases toward the plating layer. An end of the plating layer includes a first region between the insulating layer and the first or second connection portion and a second region covering the insulating layer.Type: ApplicationFiled: October 25, 2022Publication date: July 6, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chung Yeol Lee, Yoo Jeong Lee, Hyung Jong Choi, Kwang Yeun Won, So Jung An, Woo Kyung Sung, Kang Ha Lee, Myung Jun Park, Jong Ho Lee, Jun Hyeong Kim
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Publication number: 20230215646Abstract: A multilayer electronic component includes: a body including dielectric layers and first and second internal electrodes and having first to sixth surfaces; a first external electrode including a first connection portion, disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface; a second external electrode including a second connection portion, disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer disposed on the second surface and disposed to extend to the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion. The insulating layer includes a fluorine-based organic material.Type: ApplicationFiled: September 20, 2022Publication date: July 6, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kwang Yeun WON, Jong Ho LEE, Yoo Jeong LEE, Hyung Jong CHOI, Chung Yeol LEE, So Jung AN, Woo Kyung SUNG, Myung Jun PARK
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Patent number: 11657978Abstract: A capacitor component includes a body including a dielectric layer, a first electrode and a second internal electrode, laminated in a first direction, opposing each other, and a first cover portion and a second cover portion, disposed on outermost surfaces of the first and second internal electrodes, each having a thickness of 25 ?m or less, a first electrode layer and a second electrode layer, respectively disposed on both external surfaces of the body in a second direction perpendicular to the first direction and respectively, and plating layers, respectively disposed on the first and second electrode layers. A metal oxide is disposed on a boundary between the first electrode layer and the plating layer and a boundary between the second electrode layer and the plating layer.Type: GrantFiled: November 18, 2021Date of Patent: May 23, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jang Yeol Lee, Ji Hong Jo, Yoo Jeong Lee, Myung Jun Park, Jong Ho Lee, Hye Young Choi, Jae Hyun Lee, Hyun Hee Gu
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Patent number: 11651899Abstract: A capacitor component includes a body including dielectric layers, first and second internal electrodes, laminated in a first direction, facing each other, and first and second cover portions, disposed on outermost portions of the first and second internal electrodes, and first and second external electrodes, respectively disposed on both external surfaces of the body in a second direction, perpendicular to the first direction, and respectively connected to the first and second internal electrodes. An indentation including a glass is disposed at at least one of boundaries between the first internal electrodes and the first external electrode or one of boundaries between the second internal electrodes and the second external electrode.Type: GrantFiled: January 20, 2022Date of Patent: May 16, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jang Yeol Lee, Ji Hong Jo, Yoo Jeong Lee, Myung Jun Park, Jong Ho Lee, Hye Young Choi, Jae Hyun Lee, Hyun Hee Gu
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Patent number: 11646161Abstract: A capacitor component includes a body including dielectric layers, first and second internal electrodes, laminated in a first direction, facing each other, and first and second cover portions, disposed on outermost portions of the first and second internal electrodes, and first and second external electrodes, respectively disposed on both external surfaces of the body in a second direction, perpendicular to the first direction, and respectively connected to the first and second internal electrodes. An indentation is disposed at at least one of boundaries between the first internal electrodes and the first external electrode or one of boundaries between the second internal electrodes and the second external electrode.Type: GrantFiled: December 16, 2021Date of Patent: May 9, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jang Yeol Lee, Ji Hong Jo, Yoo Jeong Lee, Myung Jun Park, Jong Ho Lee, Hye Young Choi, Jae Hyun Lee, Hyun Hee Gu
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Patent number: 11537014Abstract: A display device includes a display panel including a pixel layer displaying an image, and a pad part electrically connected to the pixel layer. The display device includes a flexible circuit film combined with the pad part of the display panel. The flexible circuit film includes a base film, a first conductive line disposed on a first surface of the base film, a first conductive pad extending from the first conductive line and electrically connected to the pad part of the display panel, a cover layer covering the first conductive line and exposing the first conductive pad, and a protrusion pattern disposed on the cover layer, adjacent to the first conductive pad, and facing a side surface of the display panel.Type: GrantFiled: April 26, 2021Date of Patent: December 27, 2022Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Yoo Jeong Lee, Hyunseop Song, Jihyun Kim
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Publication number: 20220199328Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes: an electronic component body including a body having a dielectric layer and an internal electrode, and an external electrode disposed on the body; and a coating layer disposed on an external surface of the electronic component body, including one or more of silicon (Si) and fluorine (F), and having an average thickness of 5 nm or more and 15 nm or less.Type: ApplicationFiled: September 9, 2021Publication date: June 23, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyung Jong Choi, Yoo Jeong Lee, Kwan Young Son, Woo Kyung Sung, Kyu Sik Park, Myung Jun Park, Kwang Yeun Won
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Patent number: 11348732Abstract: A capacitor component includes a body including a dielectric layer, a first electrode and a second internal electrode, laminated in a first direction, opposing each other, and a first cover portion and a second cover portion, disposed on outermost surfaces of the first and second internal electrodes, each having a thickness of 25 ?m or less, a first electrode layer and a second electrode layer, respectively disposed on both external surfaces of the body in a second direction perpendicular to the first direction and respectively, and plating layers, respectively disposed on the first and second electrode layers. A metal oxide is disposed on a boundary between the first electrode layer and the plating layer and a boundary between the second electrode layer and the plating layer.Type: GrantFiled: May 21, 2020Date of Patent: May 31, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jang Yeol Lee, Ji Hong Jo, Yoo Jeong Lee, Myung Jun Park, Jong Ho Lee, Hye Young Choi, Jae Hyun Lee, Hyun Hee Gu
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Publication number: 20220139628Abstract: A capacitor component includes a body including dielectric layers, first and second internal electrodes, laminated in a first direction, facing each other, and first and second cover portions, disposed on outermost portions of the first and second internal electrodes, and first and second external electrodes, respectively disposed on both external surfaces of the body in a second direction, perpendicular to the first direction, and respectively connected to the first and second internal electrodes. An indentation including a glass is disposed at at least one of boundaries between the first internal electrodes and the first external electrode or one of boundaries between the second internal electrodes and the second external electrode.Type: ApplicationFiled: January 20, 2022Publication date: May 5, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jang Yeol Lee, Ji Hong Jo, Yoo Jeong Lee, Myung Jun Park, Jong Ho Lee, Hye Young Choi, Jae Hyun Lee, Hyun Hee Gu
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Patent number: 11320704Abstract: A display device includes: a first substrate that includes a plurality of first pads arranged in a first direction and a plurality of second pads arranged in parallel with the plurality of first pads; a second substrate that overlaps the first substrate and includes a second substrate including one edge exposing the plurality of first pads and the plurality of second pads; a first flexible printed circuit board that is electrically connected with the plurality of first pads; a second flexible printed circuit board that overlaps the first flexible printed circuit board and is electrically connected with the plurality of second pads; a protective layer that covers the first flexible printed circuit board and the second flexible printed circuit board from one edge of the second substrate to a width including the plurality of first pads and the plurality of second pads; and a blocking portion disposed on the first substrate at a distance from one edge of the second substrate by a width of the protective layer andType: GrantFiled: February 4, 2020Date of Patent: May 3, 2022Inventors: Yoo Jeong Lee, Seung Jae Kang, Po-Yun Park, Hak Bum Choi
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Patent number: 11304293Abstract: A display apparatus includes a display panel which have first display pads arranged in a first direction, a main circuit board, a first flexible circuit board which includes first substrate pads connected to the main circuit board and the first display pads and a first driving chip connected to the first substrate pads, and is bent in a direction toward a back surface of the display panel, and a protective member disposed on the first flexible circuit board. The protective member covers the first driving chip.Type: GrantFiled: June 4, 2020Date of Patent: April 12, 2022Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Yoo jeong Lee, Hyunseop Song, Minsoo Kang, Yeong Won Kim