Abstract: A carbon/epoxy composition includes a bisphenol-based epoxy, an amine-based curing agent, an imidazole-based curing catalyst, and carbon black. A carbon-epoxy dielectric layer is fabricated using a reaction product of the carbon/epoxy composition.

Abstract: A carbon/epoxy resin composition and a method of producing a carbon-epoxy dielectric using the same. The carbon/epoxy resin composition includes about 45 volume percent (volume %) to about 50 volume % of an epoxy composition, the epoxy composition including a bisphenol-based epoxy compound and an alicyclic epoxy compound, based on a total volume of the carbon/epoxy resin composition, about 2.0 volume % to about 3.1 volume % of carbon black, based on a total volume of the carbon/epoxy resin composition, about 80 parts by volume to about 104 parts by volume of an acid anhydride-based curing agent, based on 100 parts by volume of the epoxy composition, and about 1 part by volume to about 3 parts by volume of a tertiary alkylamine-based curing catalyst, based on 100 parts by volume of the epoxy composition.

Abstract: Disclosed herein is a polymer composite having an electrically conducting material dispersed therein. In the composite, a silane coupling agent may be covalently bonded with a metal oxide impregnated on the surface of the electrically conducting material to surround the electrically conducting material, thereby retaining high dielectric properties and realizing a low dielectric loss.

Abstract: A dielectric paste having low dielectric loss is disclosed. The dielectric paste includes (A) a thermosetting resin; (B) an acid anhydride-based curing agent; (C) high dielectric constant particles; (D) an amine-based catalyst; and (E) a material for forming a salt with the amine-based catalyst (D). In the dielectric paste, the material (E) for forming a salt with the amine-based catalyst (D) is used so that the catalyst may be introduced in the form of a salt thus preventing the catalyst from binding with the high dielectric constant particles, thereby prohibiting the poisoning of the catalyst.

Abstract: An embedded capacitor including a dielectric layer disposed between opposing faces of electrodes, in which the dielectric layer includes a high-loss dielectric layer and one or more insulating layers in contact with the high-loss dielectric layer. The dielectric layer may have a two-layer structure or a three-layer structure in which an insulating layer is additionally interposed between the high-loss dielectric layer and the electrode, thereby decreasing the dielectric loss while maintaining a high dielectric constant, compared to capacitors including a single-layer dielectric structure.

Abstract: A composition for producing a printed circuit board is provided. The composition includes a polyamic acid having one or two crosslinkable functional groups introduced at one or both ends thereof, a liquid crystal polymer (LCP) or a liquid crystalline thermoset (LCT) oligomer, and an organic solvent. Therefore, the composition can be used as a material for next-generation boards that are becoming gradually lighter in weight and smaller in thickness and size. Further provided is a printed circuit board produced using the composition.

Abstract: Compositions for producing a board and a printed circuit board produced using the composition are provided. The compositions can be used for the production of a variety of printed circuit boards.