Abstract: The present application relates to a resin composition, a battery module comprising a cured product of the resin composition, a manufacturing method thereof and a battery pack. According to one example of the present application, injection processability of the resin composition can be improved, overloading of injection equipment can be prevented, and the battery module having excellent insulation properties can be provided.

Abstract: A method for manufacturing a battery module is disclosed herein. In some embodiments, a method for manufacturing a battery module which comprises a module case, in which an internal space is formed by a bottom plate and sidewalls, and an injection port is formed in the bottom plate or the sidewalls; a plurality of battery cells existing in the internal space; and a resin layer in contact with the bottom plate or the sidewalls while being in contact with the battery cells, the method including attaching a tape to cover the injection port of the bottom plate or the sidewalls; mounting an injection device of a resin composition such that the injection device is mounted on the injection port while penetrating the tape, and injecting the resin composition into the mounted injection device. The method provides a simple process and at low cost without occurrence of a reverse discharge phenomenon.

Abstract: The present application relates to a composition, a battery module and a battery pack. According to one example of the present application, it is possible to provide a battery module and a battery pack which have improved heat dissipation properties, adhesive force, adhesion reliability and processability as well as excellent power to volume.

Abstract: The present application relates to an adhesive composition capable of fixing a battery cell in a battery module and a battery pack. According to one example of the present application, there is provided a two-component urethane-based adhesive composition which has excellent storage stability and processability and is capable of providing physical properties required in related uses in a short time.

Abstract: The present application relates to a composition, a battery module and a battery pack. According to one example of the present application, the related manufacturing process can be improved and a battery module having excellent insulation can be provided.

Abstract: The present application relates to a composition, a battery module and a battery pack. According to one example of the present application, there is provided a urethane-based heat dissipation material capable of providing excellent thermal conductivity and storage stability.

Abstract: The present application can provide a battery module, a method for manufacturing method the same and a thermally conductive material applied to the manufacturing method. The present application can provide a battery module having excellent output relative to volume and heat dissipation characteristics, with being manufactured in a simple process and at a low cost, a method for manufacturing the same, and a thermally conductive material applied to the manufacturing method.

Abstract: Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively prevent moisture or oxygen added to an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.

Abstract: The present application can provide a battery module case applicable to an automation process, a battery module comprising the same, a battery pack comprising such a battery module and an automobile comprising such a battery module or pack. The present application can provide a battery module at low cost by applying an automation process.

Abstract: An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.

Abstract: A battery module and a method of manufacturing the same are disclosed herein. In some embodiments, a battery module includes a module case having an internal space formed by a top plate, a bottom plate and sidewalls of the module case, a plurality of battery cells disposed in the internal space, a first filler-containing cured resin layer in contact with both the top plate and the plurality of battery cells, and a second filler-containing cured resin layer in contact with both the bottom plate and the plurality of battery cells. The battery module can have excellent power relative to volume, while being manufactured in a simple process and at a low cost.

Abstract: A method for determining a dispensing apparatus for a heat-dissipating material and according to one aspect of the present invention is provided. The method for determining a dispensing apparatus for a heat-dissipating material includes detecting an internal material of a dispensing apparatus from a heat-dissipating material discharged from the dispensing apparatus; and determining suitability of the dispensing apparatus based on the detected amount of the internal material.

Abstract: A method for mixing a heat-dissipating material, is provided. The method for mixing a heat-dissipating material includes determining a capacity (V) of the static mixer based on an injection amount (Q) per process unit time, a process unit time (td) and a time (t2) during which the viscosity of the heat-dissipating material flowing out of the static mixer becomes twice of the initial mixing viscosity, where when the heat-dissipating material is sequentially injected into first and second external devices using the static mixer, the process unit time is the difference between a first time point on which the heat-dissipating material starts to be injected into the second external device and a second time point on which the heat-dissipating material starts to be injected into the first external device.

Abstract: Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.

Abstract: Provided are a battery module, a method of manufacturing the same, and a resin composition applied to the method of manufacturing the same. A battery module manufactured with a simple process and low cost but having excellent output for the size thereof, a method of manufacturing the same, and a resin composition applied to the method of manufacturing the same are provided in the present invention.

Abstract: The present application relates to an adhesive composition comprising a curable oligomer and a polymer derived from butylene, an adhesive film comprising same, an organic electronic device comprising same, and a lighting apparatus and a display device comprising same. The adhesive film comprising the adhesive composition shows excellent moisture-blocking properties and enables an organic electronic device to have flexibility as well as excellent and reliable durability at high temperature and high humidity.

Abstract: The present application can provide a battery module, a manufacturing method thereof, and a resin composition applied to the manufacturing method. The present application can provide a battery module having excellent power relative to volume, while being manufactured in a simple process and at a low cost, a manufacturing method thereof, and a resin composition applied to the manufacturing method.

Abstract: Provided are an adhesive film, and an organic electronic device (OED) encapsulation product using the same. Dimensional stability, lifespan, and durability may be enhanced even when a panel of an organic electronic device is large-sized and formed as a thin film by controlling dimensional tolerance and edge angular tolerance of the adhesive film, thereby ensuring long-term reliability, and process yields may be enhanced when the adhesive film is applied to an automation process.

Abstract: The present invention relates to an adhesive composition, an adhesive film, a method of manufacturing the adhesive film and an organic electronic device (OED) that are used to encapsulate an organic electronic element. The adhesive composition can form an encapsulant layer having an excellent adhesive property, impact resistance, heat-protecting property and moisture blocking property, so that an OED that includes an element encapsulated with the adhesive composition can exhibit an excellent lifespan property and durability.

Abstract: An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.