Patents by Inventor Yoon-Jong Ju
Yoon-Jong Ju has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11978654Abstract: The present invention relates to a substrate processing apparatus capable of shortening a process time, and the substrate processing apparatus according to the present invention comprises an index chamber having a transfer robot loading/unloading a substrate; a process chamber having a heating means heating the substrate and processing the substrate; a loadlock chamber disposed between the index chamber and the process chamber; and a conveying chamber having a conveying robot conveying the substrate between the process chamber and the loadlock chamber, wherein a pre-heating means is provided in the conveying robot to pre-heat the substrate in a state before processing.Type: GrantFiled: October 28, 2020Date of Patent: May 7, 2024Assignee: SEMES CO., LTD.Inventors: Min Sung Han, Wan Jae Park, Yoon Jong Ju, Jaehoo Lee
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Publication number: 20240021412Abstract: A substrate processing apparatus includes: a processing chamber including a plasma generating region, a gas mixing region, and a substrate processing region; a first gas supply line supplying a first processing gas to the plasma generating region; a second gas supply line supplying a second processing gas to the gas mixing region; an ion blocker disposed between the plasma generating region and the gas mixing region; and a shower head disposed between the gas mixing region and the substrate processing region, wherein the ion blocker has a first blocker flow path unit connected to the second gas supply line and open to the plasma generating region, so that the second processing gas is supplied to the plasma generating region.Type: ApplicationFiled: March 10, 2023Publication date: January 18, 2024Inventors: Seong Pyo AHN, Yoon Jong JU, Hyun Min LIM, Min Sung HAN, Jae Hoo LEE
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Publication number: 20230352275Abstract: A substrate processing apparatus and method for increasing substrate processing efficiency are provided. The substrate processing apparatus comprises a process chamber, in which a reaction gas is processed to have a first pressure therein, a first pumping module for pumping the process chamber to have a second pressure smaller than the first pressure, a second pumping module for pumping the process chamber to have a third pressure smaller than the second pressure, and a first automatic pressure control module for adjusting a magnitude of the second pressure by adjusting a pumping pressure of the first pumping module.Type: ApplicationFiled: April 29, 2022Publication date: November 2, 2023Inventors: Yoon Jong Ju, Min Sung Han, Jae Hoo Lee, Hyun Soo Kim, Seong Hak Bae, Wan Jae Park
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Publication number: 20230317417Abstract: Provided are a substrate processing apparatus and method for increasing the uniformity of substrate processing.Type: ApplicationFiled: April 1, 2022Publication date: October 5, 2023Inventors: Min Sung HAN, Jae Hoo LEE, Yoon Jong JU, Wan Jae PARK
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Publication number: 20230307266Abstract: The present invention provides a support unit, including: a support plate on which a substrate is placed, and which includes an electrostatic electrode providing electrostatic force to the substrate; a heater provided inside the support plate and configured to heat the substrate; an insulating plate provided under the support plate as an insulating substance; and a bimetal member disposed inside the support plate and configured to compensate for bending of the support plate due to heat, in which the bimetal member includes: a pin provided to be in contactable with a bottom surface of the substrate that is placed on the support plate; a first member configured to support the pin; and a second member provided to surround the first member, and the pin is provided to move up or move down according to a difference in the amount of thermal deformation between the first member and the second member.Type: ApplicationFiled: March 25, 2022Publication date: September 28, 2023Applicant: SEMES CO., LTD.Inventors: Kyung Man KIM, Jeong Woo HAN, Ji-hwan LEE, Wan Jae PARK, Yoon Jong JU, Seong Hak BAE
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Publication number: 20230207275Abstract: The present invention provides a substrate treating method, including: a first treatment operation of treating the substrate by using first plasma generated by exciting first gas; and a second treatment operation of treating the substrate by using second plasma generated by exciting second gas different from the first gas.Type: ApplicationFiled: June 30, 2022Publication date: June 29, 2023Applicant: SEMES CO., LTD.Inventors: Yoon Jong JU, Seong Gil LEE, Jae Hwan KIM, Wan Jae PARK, Hye Joon KHEEL, Ji Hoon PARK, Young Je UM
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Publication number: 20230207248Abstract: An exemplary embodiment of the present invention provides a substrate treating apparatus, including: a chamber having an inner space; a shower head for partitioning the inner space into an upper first zone and a lower second zone, and formed with a plurality of through holes; a support unit for supporting a substrate in the second zone; a gas supply unit for supplying gas to the first zone; a plasma source for forming a plasma in the first zone by exciting the gas; and an adsorption plate coupled to the shower head, in which a surface of the adsorption plate is provided with a material that adsorbs radicals contained in the plasma.Type: ApplicationFiled: October 26, 2022Publication date: June 29, 2023Applicant: SEMES CO., LTD.Inventors: Young Je UM, Min Sung HAN, Seong Gil LEE, Wan Jae PARK, Dong Sub OH, Yoon Jong JU, Myoung Sub NOH
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Patent number: 11167326Abstract: An apparatus for processing a substrate comprises a processing vessel having a processing space inside, a substrate support unit that supports and rotates the substrate in the processing vessel, and a nozzle unit that dispenses a processing liquid onto the substrate. The nozzle unit comprises a nozzle that dispenses the processing liquid and an ultraviolet (UV) light supply unit that emits UV light to activate radicals of the processing liquid dispensed onto the substrate.Type: GrantFiled: July 3, 2019Date of Patent: November 9, 2021Assignee: Semes Co., Ltd.Inventors: Min Sung Han, Doyeon Kim, Jinkyu Kim, Yoon Jong Ju
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Publication number: 20210125854Abstract: The present invention relates to a substrate processing apparatus capable of shortening a process time, and the substrate processing apparatus according to the present invention comprises an index chamber having a transfer robot loading/unloading a substrate; a process chamber having a heating means heating the substrate and processing the substrate; a loadlock chamber disposed between the index chamber and the process chamber; and a conveying chamber having a conveying robot conveying the substrate between the process chamber and the loadlock chamber, wherein a pre-heating means is provided in the conveying robot to pre-heat the substrate in a state before processing.Type: ApplicationFiled: October 28, 2020Publication date: April 29, 2021Applicant: SEMES Co. Ltd.Inventors: MIN SUNG HAN, WAN JAE PARK, YOON JONG JU, JAEHOO LEE
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Patent number: 10964557Abstract: The present disclosure relates to a substrate processing apparatus and a substrate processing method. The substrate processing apparatus according to the exemplary embodiment of the present disclosure may include: a processing liquid supply tube; a nozzle unit which is supplied with a processing liquid from the processing liquid supply tube and discharges the processing liquid to the substrate; and a light source unit which is provided to irradiate the processing liquid discharged from the nozzle unit with ultraviolet rays. According to the present disclosure, the processing liquid, which is electrified while passing the processing liquid supply tube, is irradiated with ultraviolet rays, such that electricity is eliminated from the electrified processing liquid, and as a result, it is possible to minimize a problem that the substrate is contaminated by peripheral particles or arcing occurs on the substrate.Type: GrantFiled: July 31, 2018Date of Patent: March 30, 2021Assignee: SEMES CO., LTD.Inventors: Do Yeon Kim, Jin Kyu Kim, Yoon Jong Ju, Min Sung Han, Joon Ho Won, Yong Tak Hyun
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Publication number: 20200009621Abstract: An apparatus for processing a substrate compries a processing vessel having a processing space inside, a substrate support unit that supports and rotates the substrate in the processing vessel, and a nozzle unit that dispenses a processing liquid onto the substrate. The nozzle unit compries a nozzle that dispenses the processing liquid and an ultraviolet (UV) light supply unit that emits UV light to activate radicals of the processing liquid dispensed onto the substrate.Type: ApplicationFiled: July 3, 2019Publication date: January 9, 2020Applicant: SEMES CO., LTD.Inventors: Min Sung Han, Doyeon KIM, Jinkyu KIM, Yoon Jong JU
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Patent number: 10471457Abstract: A substrate treating apparatus includes a treatment unit including a container, and a support member in the interior of the container to support a substrate, the treatment unit being configured to treat the substrate a nozzle unit having a treatment liquid nozzle for supplying a treatment liquid to the substrate provided in the treatment unit and an inspection unit that inspects whether the treatment liquid is normally discharged from the treatment liquid nozzle. The nozzle further includes a nozzle driver that moves the treatment liquid nozzle from a process position at which the substrate is treated by the treatment unit and an inspection position at which the treatment liquid nozzle is inspected by the inspection unit.Type: GrantFiled: January 29, 2016Date of Patent: November 12, 2019Assignee: Semes Co., Ltd.Inventors: Keunhwa Yang, Yoon Jong Ju, Kihoon Choi, Kwangsup Kim
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Patent number: 10357806Abstract: The inventive concepts provide an apparatus for treating a substrate. The apparatus includes a housing proving an inner space in which a substrate is treated, a spin head supporting and rotating the substrate in the housing, an injection unit comprising a first nozzle member spraying a first treatment solution to the substrate put on the spin head, and a controller controlling the first nozzle member. The first nozzle member includes a body, a vibrator, a pump, and a power source.Type: GrantFiled: June 23, 2015Date of Patent: July 23, 2019Assignee: SEMES CO., LTD.Inventors: Jong Han Kim, Yoon-Jong Ju, Yu Hwan Kim, Edwin Lee, Seong Soo Lee
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Patent number: 10211074Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a housing having a space for treating a substrate in the interior thereof, a spin head which supports and rotates the substrate inside the housing, and an ejection unit having a first nozzle member for ejecting a first treatment liquid onto the substrate positioned on the spin head. The first nozzle member includes a body having an ejection passage, through which the first treatment liquid flows, therein and a first discharge hole communicated with the ejection passage to eject the first treatment liquid onto the substrate, and a vibrator installed in the body to provide vibration for the first treatment liquid flowing through the ejection passage. The vibrator has an interference preventing recess for preventing an interference by reflective waves therein.Type: GrantFiled: January 26, 2016Date of Patent: February 19, 2019Assignee: Semes Co., Ltd.Inventors: Yoon Jong Ju, Kihoon Choi, Hyeon Jun Lee
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Publication number: 20190043741Abstract: The present disclosure relates to a substrate processing apparatus and a substrate processing method. The substrate processing apparatus according to the exemplary embodiment of the present disclosure may include: a processing liquid supply tube; a nozzle unit which is supplied with a processing liquid from the processing liquid supply tube and discharges the processing liquid to the substrate; and a light source unit which is provided to irradiate the processing liquid discharged from the nozzle unit with ultraviolet rays. According to the present disclosure, the processing liquid, which is electrified while passing the processing liquid supply tube, is irradiated with ultraviolet rays, such that electricity is eliminated from the electrified processing liquid, and as a result, it is possible to minimize a problem that the substrate is contaminated by peripheral particles or arcing occurs on the substrate.Type: ApplicationFiled: July 31, 2018Publication date: February 7, 2019Inventors: Do Yeon KIM, Jin Kyu KIM, Yoon Jong JU, Min Sung HAN, Joon Ho WON, Yong Tak HYUN
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Patent number: 10186419Abstract: Disclosed is an apparatus and method for treating a substrate. The method includes supplying cleaning particles to the substrate to clean the substrate. The cleaning particles are solid particles. The solid particles provide a shock wave to the substrate.Type: GrantFiled: November 3, 2015Date of Patent: January 22, 2019Assignee: Semes Co., Ltd.Inventors: Kihoon Choi, In-Il Jung, Seong-Soo Kim, Yoon-Jong Ju
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Publication number: 20170345686Abstract: Disclosed are a liquid treating apparatus and a liquid treating method. The liquid treating apparatus includes a chamber that provides a space for processing a substrate, a support unit that is provided in the chamber to support the substrate, an ejection unit that has a nozzle for supplying a cleaning medium to the substrate supported by the support unit, and an auxiliary ejection unit that has an auxiliary nozzle for supplying a contamination prevention liquid to the substrate supported by the support unit.Type: ApplicationFiled: May 23, 2017Publication date: November 30, 2017Inventors: KIHOON CHOI, JINKYU KIM, YOON JONG JU, MIN SUNG HAN, BYUNG MAN KANG
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Publication number: 20160346795Abstract: Disclosed is a nozzle for supplying a treatment liquid to a substrate, the nozzle including a body having a passage, through which the treatment liquid flows, in the interior thereof, and having a discharge hole communicated with the passage and through which the treatment liquid is discharged, and a piezoelectric element that pressurize the treatment liquid flowing through the body to discharge the treatment liquid through the discharge hole in a state of droplets, wherein an average diameter of the droplets discharged through the discharge hole is equal to or greater than 5 micrometers and is less than 15 micrometers.Type: ApplicationFiled: May 20, 2016Publication date: December 1, 2016Applicant: Semes Co., Ltd.Inventors: Kihoon CHOI, Yoon Jong Ju, Byung Man Kang
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Publication number: 20160221021Abstract: Disclosed are an inspection unit, an inspection method, and a substrate treating apparatus including the same. A substrate treating apparatus includes a treatment unit including a container, and a support member situated in the interior of the container to support a substrate, the treatment unit being configured to treat the substrate a nozzle unit having a treatment liquid nozzle for supplying a treatment liquid to the substrate provided in the treatment unit and an inspection unit that inspects whether the treatment liquid is normally discharged from the treatment liquid nozzle. The nozzle further includes a nozzle driver that moves the treatment liquid nozzle from a process position at which the substrate is treated by the treatment unit and an inspection position at which the treatment liquid nozzle is inspected by the inspection unit.Type: ApplicationFiled: January 29, 2016Publication date: August 4, 2016Inventors: Keunhwa Yang, Yoon Jong Ju, Kihoon Choi, Kwangsup Kim
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Publication number: 20160218022Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a housing having a space for treating a substrate in the interior thereof, a spin head which supports and rotates the substrate inside the housing, and an ejection unit having a first nozzle member for ejecting a first treatment liquid onto the substrate positioned on the spin head. The first nozzle member includes a body having an ejection passage, through which the first treatment liquid flows, therein and a first discharge hole communicated with the ejection passage to eject the first treatment liquid onto the substrate, and a vibrator installed in the body to provide vibration for the first treatment liquid flowing through the ejection passage. The vibrator has an interference preventing recess for preventing an interference by reflective waves therein.Type: ApplicationFiled: January 26, 2016Publication date: July 28, 2016Inventors: Yoon Jong JU, Kihoon CHOI, Hyeon Jun LEE