Patents by Inventor Yoong-koo Hong

Yoong-koo Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composition for microetching copper or copper alloy
    Patent number: 5885476
    Abstract: A microetching composition for copper or copper alloys comprising, (a) nitric acid or sulfuric acid, or both, (b) ferric nitrate or ferric sulfate, or both, (c) at least one component selected from a group consisting of unsaturated carboxylic acids, salts of unsaturated carboxylic acid, and anhydrides of unsaturated carboxylic acid, and (d) water. The composition can produce a copper or copper alloy surface exhibiting excellent adhesion to resins such as prepregs and resists and superior solderability. The composition is suitable for the manufacture of printed wiring boards with highly integrated fine line patterns.
    Type: Grant
    Filed: March 4, 1997
    Date of Patent: March 23, 1999
    Assignee: MEC Co., Ltd.
    Inventors: Yoong-koo Hong, Toshiko Nakagawa