Abstract: A method for manufacturing a package stacking system includes: providing a package substrate; mounting an integrated circuit over the package substrate; forming a step-down interposer over the integrated circuit; and molding a stack package body, having a step profile, on the package substrate and the step-down interposer.

Abstract: A method for manufacturing a package stacking system includes: providing a package substrate; mounting an integrated circuit over the package substrate; forming a step-down interposer over the integrated circuit; and molding a stack package body, having a step profile, on the package substrate and the step-down interposer.

Abstract: A package stacking system includes: providing a package substrate; mounting an integrated circuit over the package substrate; forming a step-down interposer over the integrated circuit; and molding a stack package body, having a step profile, on the package substrate and the step-down interposer.

Abstract: A semiconductor device is made by disposing a film layer over a substrate having first conductive layer. An opening is formed in the film layer to expose the first conductive layer. A second conductive layer is formed over the first conductive layer. A first bump is formed over the second conductive layer which promotes reflow of the first bump at a eutectic temperature. A standoff bump is formed on the film layer around a perimeter of the substrate. The film layer prevents reflow of the standoff bump at the eutectic temperature. A second bump is disposed between a semiconductor die and the first bump. The second bump is reflowed to electrically connect the semiconductor die to the first bump. After reflow of the second bump, the standoff bump has a height at least 70% of the second bump prior to reflow to maintain separation between the semiconductor die and substrate.

Abstract: An integrated circuit package system includes: providing a package carrier; forming a first channel in the package carrier; mounting a first integrated circuit device over the package carrier and adjacent to the first channel; mounting a second integrated circuit device over the package carrier and adjacent to the first channel; and forming a contiguous underfill fillet with the first channel and under both the first integrated circuit device and the second integrated circuit device.

Abstract: A semiconductor device is made by disposing a film layer over a substrate having first conductive layer. An opening is formed in the film layer to expose the first conductive layer. A second conductive layer is formed over the first conductive layer. A first bump is formed over the second conductive layer which promotes reflow of the first bump at a eutectic temperature. A standoff bump is formed on the film layer around a perimeter of the substrate. The film layer prevents reflow of the standoff bump at the eutectic temperature. A second bump is disposed between a semiconductor die and the first bump. The second bump is reflowed to electrically connect the semiconductor die to the first bump. After reflow of the second bump, the standoff bump has a height at least 70% of the second bump prior to reflow to maintain separation between the semiconductor die and substrate.

Abstract: A package stacking system includes: providing a package substrate; mounting an integrated circuit over the package substrate; forming a step-down interposer over the integrated circuit; and molding a stack package body, having a step profile, on the package substrate and the step-down interposer.

Abstract: A system to support a die includes a substrate. A solder resist is disposed over the substrate. A first solder bump is disposed in the solder resist to provide electrical connectivity through the solder resist to the substrate. A second solder bump is formed over the solder resist to correspond with a peripheral edge or a corner of the die. The second solder bump provides standoff height physical support to the die.

Abstract: A system to support a die includes a substrate. A solder resist is disposed over the substrate. A first solder bump is disposed in the solder resist to provide electrical connectivity through the solder resist to the substrate. A second solder bump is formed over the solder resist to correspond with a peripheral edge or a corner of the die. The second solder bump provides standoff height physical support to the die.

Abstract: An integrated circuit package system includes: providing a package carrier; forming a first channel in the package carrier; mounting a first integrated circuit device over the package carrier and adjacent to the first channel; mounting a second integrated circuit device over the package carrier and adjacent to the first channel; and forming a contiguous underfill fillet with the first channel and under both the first integrated circuit device and the second integrated circuit device.