Abstract: Thermal connection between a plurality of communication modules and a heatsink placed on these communication modules is securely achieved and maintained. In a signal transmission device in which a common heatsink is arranged on a plurality of communication modules equipped on a board, the signal transmission device has a coil spring provided between the board and the communication modules, and the communication modules are biased toward the heatsink by the coil spring so that an upper surface of the communication module is pressed against a bottom surface of the heatsink.

Abstract: There is provided a photoelectric conversion module that can be mounted two-dimensionally over a device board in a high-density, low-height manner and cooled efficiently with an easy-to-install collective-type radiator. In the photoelectric conversion module mounted over the device board, an optical connector is attached to that surface of an optical subassembly facing the device board. An electric connector has at least two sides thereof opened so that the optical transmission medium is threaded therethrough and extended through at least two facing sides of the optical subassembly. The optical transmission medium is thus extended between the optical subassembly and the device board in a vertically stacked manner.

Abstract: A phase-shift circuit being smaller in size than a conventional phase-shift circuit and being capable of causing a phase difference equivalent to or larger than that in the conventional phase-shift circuit between an input signal and an output signal is achieved. A phase-shift circuit includes: a signal line; and a dielectric member overlapping the signal line and being capable of reciprocating in a direction intersecting the signal line, and changes a phase of a signal propagating through the signal line. The dielectric member is configured of a frame body and a dielectric plate provided inside the frame body and having an overlapping area with the signal line increased or decreased by the reciprocation, and the frame body has a permittivity lower than a permittivity of the dielectric plate.

Abstract: A height of a signal transmission device is decreased as low as possible as maintaining or improving a cooling performance for the communication module. Ina signal transmission device provided with a communication module provided on a substrate and a cooling mechanism for cooling the communication module, the cooling mechanism includes: a heat-transfer plate including a first region which overlaps with bottom surfaces of a plurality of the communication modules and is thermally connected to the bottom surfaces and a second region which does not overlap with the bottom surfaces of the communication modules; and a heat-release fin provided in the second region of the heat-transfer plate.

Abstract: To suppress degradation of signals exchanged between the semiconductor chip and each of the communication modules while a large number of communication modules are mounted near a semiconductor chip at a high density. A connector includes a plug connector provided in a communication module and a receptacle connector provided in a motherboard to which the connection module is connected. The plug connector has an inserting convex portion that is connected to a module substrate included in the communication module. The receptacle connector has an inserting concave portion into which the inserting convex portion is inserted. A plurality of first connection terminals are arranged in two outer side surfaces in parallel with each other, of the inserting convex portion. A plurality of second connection terminals in contact with the first connection terminals are arranged in two inner side surfaces in parallel with each other, of the inserting concave portion.

Abstract: A ferrule fixing member for fixing a ferrule to a holding member with a holding hole into which the ferrule is inserted. The ferrule fixing member includes a first plate part and a second plate part configured to face each other while sandwiching an resilient member arranged on an outer periphery of the ferrule in a radial direction thereof, a pressing part configured to press the resilient member such that the ferrule is pressed against a bottom side of the holding hole by a resilient force of the resilient member, a locked part configured to be engaged with a locking part formed in the holding member, and an extending part configured to extend from the second plate part to the locked part. The locking of the locked part and the locking part is released by moving the first plate part and the second plate part close to each other.

Abstract: A connector is configured of a plug connector and a receptacle connector. The plug connector has an insertion convex portion including: a first sidewall portion and a second sidewall portion that are in parallel with each other and a plurality of first connection terminals provided on the sidewall portions. The receptacle connector has an insertion concave portion to which the insertion convex portion is inserted and in which a plurality of second connection terminals that are contacted with the first connection terminals are provided. The respective inner side surfaces of the first sidewall portion and the second sidewall portion face each other across a space, and the plurality of first connection terminals are arranged on the respective outer side surfaces of the first sidewall portion and the second sidewall portion.

Abstract: To efficiently cool an IC chip and a transmission module disposed on the same substrate, amounting structure of transmission module of the present invention includes a motherboard, a package substrate mounted on the motherboard, an IC chip and a plurality of connectors disposed on amounting surface of the package substrate, a plurality of transmission modules connected to the plurality of connectors, and module cooling members having a plurality of slits provided along an connector array direction. The connectors are disposed inside the slits of module cooling members, and the transmission modules can be connected to and disconnected from the connectors disposed through the slits. The transmission modules connected to the connectors are in contact with inside surfaces of the slits and thermally connected to the cooling members.

Abstract: A connector includes a plug connector and a receptacle connector. The plug connector has an insertion convex portion including: an end surface; outer side surfaces facing in parallel to each other across the end surface; and a first tapered surface connecting each outer side surface and the end surface. The receptacle connector has an insertion concave portion including: an insertion port; inner side surfaces facing in parallel to each other across the insertion port; and a second tapered surface connecting each inner side surface and an edge of the insertion port. The outer side surfaces of the insertion convex portion have first connection terminals arranged, the inner side surfaces of the insertion concave portion have second connection terminals arranged in contact with the first contact terminals, and the first tapered surface has a width twice as large as a width of the second tapered surface or larger.

Abstract: An optical module includes a photoelectric conversion element optically connected to an optical fiber, a plate-shaped substrate mounting the photoelectric conversion element, coupling members fixed to both end portions of the substrate so as to sandwich the photoelectric conversion element, and a cover member coupled to the substrate by the coupling members so as to cover at least a portion of the substrate.

Abstract: To efficiently cool an IC chip and a transmission module disposed on the same substrate, amounting structure of transmission module of the present invention includes a motherboard, a package substrate mounted on the motherboard, an IC chip and a plurality of connectors disposed on amounting surface of the package substrate, a plurality of transmission modules connected to the plurality of connectors, and module cooling members having a plurality of slits provided along an connector array direction. The connectors are disposed inside the slits of module cooling members, and the transmission modules can be connected to and disconnected from the connectors disposed through the slits. The transmission modules connected to the connectors are in contact with inside surfaces of the slits and thermally connected to the cooling members.

Abstract: There is provided a photoelectric conversion module that can be mounted two-dimensionally over a device board in a high-density, low-height manner and cooled efficiently with an easy-to-install collective-type radiator. In the photoelectric conversion module mounted over the device board, an optical connector is attached to that surface of an optical subassembly facing the device board. An electric connector has at least two sides thereof opened so that the optical transmission medium is threaded therethrough and extended through at least two facing sides of the optical subassembly. The optical transmission medium is thus extended between the optical subassembly and the device board in a vertically stacked manner.

Abstract: An antenna device includes a first triplate line and one or more second triplate lines that are connected to the first triplate line so as to cross the first triplate line. Two ground plates of each second triplate line include respective flange portions that are in contact with and fixed to a surface of one of two ground plates of the first triplate line. At least one of a surface of each flange portion that contacts the one of the ground plates of the first triplate line and the surface of the one of the ground plates of the first triplate line that contacts each flange portion is provided with an irregular portion for reducing a contact area between each flange portion and the one of the ground plates.

Abstract: An antenna device has a feed line including a triplate line. Each triplate line has a central conductor and two ground plates sandwiching the central conductor via an air layer. At least a part of the triplate line is configured such that the two ground plates sandwich a center substrate including a wiring pattern as the central conductor provided on a dielectric substrate via the air layer.

Abstract: An antenna device includes an antenna element including a dielectric substrate including a first principal surface and a second principal surface, a built-in feed line provided on the first principal surface of the dielectric substrate, and a radiating element provided on the second principal surface of the dielectric substrate and along the built-in feed line so that the radiating element is fed from the built-in feed line, a triplate line including a first outer conductor and a second outer conductor parallel to each other, and a central conductor arranged therebetween to feed excitation power to the antenna element, a connecting member which electrically connects the central conductor and the built-in feed line, a projecting piece from one end of the dielectric substrate toward the second outer conductor, and a first hole and a second hole provided in the first outer conductor and in communication with each other.

Abstract: An antenna device includes an antenna element including a dielectric substrate including a first surface and a second surface surfaces, a built-in feed line formed on the first surface, and a radiating element formed on the second surface and along the built-in feed line, a triplate line including a first outer conductor and a second outer conductor parallel to each other, and a central conductor arranged therebetween, a connecting portion at one end of the dielectric substrate to electrically connect the built-in feed line to the central conductor, a first hole and a second hole formed in the first outer conductor and in communication with each other. The first hole includes an opposite surface to the built-in feed line on the connecting portion with a specified space therebetween. The connecting portion is inserted in the second hole. The second hole includes an opposite regulating surface to the first surface of the connecting portion of the dielectric substrate.

Abstract: An antenna device (1) includes a plurality of triplate lines (31, 32) each of which includes a central conductor (401/122A) arranged between one pair of outer conductors (30, 50/121A, 123A) parallel to each other, and a plurality of antenna elements (14a) to transmit high frequency signals distributed by the plurality of triplate lines (31, 32). The plurality of triplate lines (31, 32) include a first triplate line (31) and a second triplate line (32) arranged non-parallel to each other and at a predetermined angle therebetween so that respective central conductors (401/122A) of the first triplate line (31) and the second triplate line (32) are intersected and connected together.

Abstract: A latch structure according to an embodiment includes a cage having an engagement hole, a connector attachably and detachably held in the cage, the connector comprising a connector body having an almost rectangular parallelepiped shape and an insertion part to be inserted into the cage formed on an end surface of the connector body, a latch cover rockably installed in an upper surface of the connector body, being formed of a single plate material and having a cover body for covering the upper surface of the connector body, an engagement claw to engage with the engagement hole of the cage formed at an end portion of the latch cover, a spring member for always energizing the latch cover so that the engagement claw engages with the engagement hole, a rocking member formed in both sides of the cover body of the latch cover and formed by bending the plate material downward and a rocking groove formed in both side surfaces of the connector body for rockably engaging with the rocking member, wherein the rocking memb

Abstract: A ferrule fixing member for fixing a ferrule to a holding member with a holding hole into which the ferrule is inserted. The ferrule fixing member includes a first plate part and a second plate part configured to face each other while sandwiching an resilient member arranged on an outer periphery of the ferrule in a radial direction thereof, a pressing part configured to press the resilient member such that the ferrule is pressed against a bottom side of the holding hole by a resilient force of the resilient member, a locked part configured to be engaged with a locking part formed in the holding member, and an extending part configured to extend from the second plate part to the locked part. The locking of the locked part and the locking part is released by moving the first plate part and the second plate part close to each other.

Abstract: An optical communication module includes an optical element array, a supporting member on which the optical element array is placed, an optical member for optically coupling the optical element array and a plurality of optical fibers together, a plurality of grooves provided in the supporting member or the optical member, and a plurality of protrusions provided on the optical member or the supporting member in correspondence with the grooves respectively. The grooves and the protrusions are mated together. The grooves are provided as being widened toward their openings. The grooves and the protrusions are each provided so that a location in a width direction at which no relative locational misalignment occurs therebetween lies on a line through the center of the optical element array. The grooves and the protrusions are each provided on at least two or more different lines through the center of the optical element array.