Abstract: A nonvolatile semiconductor memory device that have a new structure are provided, in which memory cells are laminated in a three dimensional state so that the chip area may be reduced. The nonvolatile semiconductor memory device of the present invention is a nonvolatile semiconductor memory device that has a plurality of the memory strings, in which a plurality of electrically programmable memory cells is connected in series. The memory strings comprise a pillar shaped semiconductor; a first insulation film formed around the pillar shaped semiconductor; a charge storage layer formed around the first insulation film; the second insulation film formed around the charge storage layer; and first or nth electrodes formed around the second insulation film (n is natural number more than 1). The first or nth electrodes of the memory strings and the other first or nth electrodes of the memory strings are respectively the first or nth conductor layers that are spread in a two dimensional state.

Abstract: To improve the throughput of substrate bonding. A substrate bonding apparatus that bonds first and second substrates so that contact regions in which the first and second substrates contact are formed in parts of the first and second substrates and the contact regions enlarge from the parts, the apparatus including: a detecting unit detecting information about the contact regions; and a determining unit determining that the first and second substrates can be carried out based on the information detected at the detecting unit. In the substrate bonding apparatus, the information may be information, a value of which changes according to progress of enlargement of the contact regions, and the determining unit may determine that the first and second substrates can be carried out if the value becomes constant or if a rate of changes in the value becomes lower than a predetermined value.

Abstract: To improve the throughput of substrate bonding. A substrate bonding apparatus that bonds first and second substrates so that contact regions in which the first and second substrates contact are formed in parts of the first and second substrates and the contact regions enlarge from the parts, the apparatus including: a detecting unit detecting information about the contact regions; and a determining unit determining that the first and second substrates can be carried out based on the information detected at the detecting unit. In the substrate bonding apparatus, the information may be information, a value of which changes according to progress of enlargement of the contact regions, and the determining unit may determine that the first and second substrates can be carried out if the value becomes constant or if a rate of changes in the value becomes lower than a predetermined value.

Abstract: A deposition apparatus that supplies mist to a front surface of an object and deposits a film made of a material substance containing the mist on the front surface of the object, the deposition apparatus comprising a mist supplying section that includes: a mist generating section that generates the mist; an inlet port that introduces the mist generated by the mist generating section into a space; and a supply port that supplies the mist from the space to the front surface of the object, wherein the supply port is provided at a different position than the inlet port in a first direction, in a first prescribed plane that includes the supply port where the first direction and a second direction intersect and that has the mist pass therethrough.

Abstract: A deposition apparatus supplies mist containing fine particles to a substrate and forms a film including the fine particles on a substrate surface, and includes an air guide member that covers at least a portion of the substrate surface, and a mist supplying section that supplies mist to a space between the substrate surface and the air guide member. The mist supplying section includes a charge applying section, which applies a positive or negative charge to the mist, and a mist ejecting section, which ejects the mist charged by the mist applying section into the space. The air guide member has a wall surface facing the substrate surface, and the deposition apparatus includes an electrostatic field generating section that causes a potential having a same sign as the mist charged by the charge applying section to be generated by the wall surface.

Abstract: A flexible sensor includes a substrate having flexibility; and a sensor element provided on the substrate, wherein the sensor element includes a transistor having a gate electrode, a source electrode, and a drain electrode; and a variable resistance portion connected to either of the gate electrode, the source electrode, and the drain electrode, and the variable resistance portion has a resistance value changeable due to a strain, and wherein the variable resistance portion includes an extension portion extending in a direction.

Abstract: An exposure device that draws a pattern on a substrate by shining a beam from a light source device on substrate and scanning the beam in a main scanning direction while varying the intensity of beam according to pattern information, including: a scanning unit having a beam scanning unit that includes a polygonal mirror whereby the beam is oriented to scan the beam, and light detector for photoelectric detection of reflected light generated when beam is shined on substrate; an electro-optical element for controlling the beam's intensity modulation according to pattern information such that at least part of second pattern to be newly drawn is drawn on top of at least part of first pattern formed on substrate; and a measurement unit measuring relative positional relationship between the first and second pattern on the basis of a detection signal output by the detector while second pattern is drawn on substrate.

Abstract: An exposure device that draws a pattern on a substrate by shining a beam from a light source device on substrate and scanning the beam in a main scanning direction while varying the intensity of beam according to pattern information, including: a scanning unit having a beam scanning unit that includes a polygonal mirror whereby the beam is oriented to scan the beam, and light detector for photoelectric detection of reflected light generated when beam is shined on substrate; an electro-optical element for controlling the beam's intensity modulation according to pattern information such that at least part of second pattern to be newly drawn is drawn on top of at least part of first pattern formed on substrate; and a measurement unit measuring relative positional relationship between the first and second pattern on the basis of a detection signal output by the detector while second pattern is drawn on substrate.

Abstract: A processing system and a device manufacturing method that can perform manufacturing of an electronic device without stopping the entire manufacturing system, even when the processing state actually implemented on a sheet substrate by a processing device differs from the target processing state.

Abstract: A processing system and a device manufacturing method that can perform manufacturing of an electronic device without stopping the entire manufacturing system, even when the processing state actually implemented on a sheet substrate by a processing device differs from the target processing state.

Abstract: A processing system and a device manufacturing method that can perform manufacturing of an electronic device without stopping the entire manufacturing system, even when the processing state actually implemented on a sheet substrate by a processing device differs from the target processing state.

Abstract: An exposure device that draws a pattern on a substrate by shining a beam from a light source device on substrate and scanning the beam in a main scanning direction while varying the intensity of beam according to pattern information, including: a scanning unit having a beam scanning unit that includes a polygonal mirror whereby the beam is oriented to scan the beam, and light detector for photoelectric detection of reflected light generated when beam is shined on substrate; an electro-optical element for controlling the beam's intensity modulation according to pattern information such that at least part of second pattern to be newly drawn is drawn on top of at least part of first pattern formed on substrate; and a measurement unit measuring relative positional relationship between the first and second pattern on the basis of a detection signal output by the detector while second pattern is drawn on substrate.

Abstract: A processing system and a device manufacturing method that can perform manufacturing of an electronic device without stopping the entire manufacturing system, even when the processing state actually implemented on a sheet substrate by a processing device differs from the target processing state.

Abstract: To improve the throughput of substrate bonding. A substrate bonding apparatus that bonds first and second substrates so that contact regions in which the first and second substrates contact are formed in parts of the first and second substrates and the contact regions enlarge from the parts, the apparatus including: a detecting unit detecting information about the contact regions; and a determining unit determining that the first and second substrates can be carried out based on the information detected at the detecting unit. In the substrate bonding apparatus, the information may be information, a value of which changes according to progress of enlargement of the contact regions, and the determining unit may determine that the first and second substrates can be carried out if the value becomes constant or if a rate of changes in the value becomes lower than a predetermined value.

Abstract: A processing system and a device manufacturing method that can perform manufacturing of an electronic device without stopping the entire manufacturing system, even when the processing state actually implemented on a sheet substrate by a processing device differs from the target processing state.

Abstract: Substrates are aligned and then bonded to each other. A substrate bonding apparatus includes a deformer that deforms at least a first one of two substrates that are to be bonded to each other in order to correct misalignment between the two substrates, a holder that holds the deformed first substrate in the deformed state achieved by the deformer, a transporter that transports the holder from a position at which the deformed first substrate is held by the holder while the first substrate remains deformed, and a bonder that bonds the first substrate that has been transported by the transporter to the second substrate.

Abstract: A detection method of detecting a position of an uppermost substrate of a plurality of substrates stacked on each other includes applying illumination to a region covering a portion of an edge of the uppermost substrate and a portion of a lower substrate stacked with the uppermost substrate, identifying a position of the edge of the uppermost substrate based on a position of a step-like portion present in the region due to a step formed between the uppermost substrate and the lower substrate, and identifying a position of the uppermost substrate based on the position of the edge of the uppermost substrate.

Abstract: Substrates are aligned and then bonded to each other. A substrate bonding apparatus includes a deformer that deforms at least a first one of two substrates that are to be bonded to each other in order to correct misalignment between the two substrates, a holder that holds the deformed first substrate in the deformed state achieved by the deformer, a transporter that transports the holder from a position at which the deformed first substrate is held by the holder while the first substrate remains deformed, and a bonder that bonds the first substrate that has been transported by the transporter to the second substrate.

Abstract: A detection method of detecting a position of an uppermost substrate of a plurality of substrates stacked on each other includes applying illumination to a region covering a portion of an edge of the uppermost substrate and a portion of a lower substrate stacked with the uppermost substrate, identifying a position of the edge of the uppermost substrate based on a position of a step-like portion present in the region due to a step formed between the uppermost substrate and the lower substrate, and identifying a position of the uppermost substrate based on the position of the edge of the uppermost substrate.

Abstract: A detection method of detecting a position of an uppermost substrate of a plurality of substrates stacked on each other includes applying illumination to a region covering a portion of an edge of the uppermost substrate and a portion of a lower substrate stacked with the uppermost substrate, identifying a position of the edge of the uppermost substrate based on a position of a step-like portion present in the region due to a step formed between the uppermost substrate and the lower substrate, and identifying a position of the uppermost substrate based on the position of the edge of the uppermost substrate.