Patents by Inventor Yoshiaki Kuwada

Yoshiaki Kuwada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7057875
    Abstract: A sheet capacitor of the invention has a contact portion formed in a through-hole requiring electrical connection with an IC connection pin among the through-holes in which the IC connection pins are inserted, and a capacitor element connected to the contact portion. Another sheet capacitor of the invention includes an insulating board and a capacitor element mounted on the insulating board. The insulating board has a connection land with an IC at the upper side, and a connection land with a printed wiring board at the lower side. The capacitor element and connection lands at the upper and lower side of the insulating board are connected with each other electrically. In any one of these configurations, a capacitor element of large capacity and low ESL is connected closely to the IC, and the mounting area of the peripheral circuits of the IC can be increased.
    Type: Grant
    Filed: September 16, 2005
    Date of Patent: June 6, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Terumi Fujiyama, Kazuo Fukunaga, Morihiro Fukuda, Yoshiaki Kuwada, Hiromasa Mori, Yoshio Hashimoto
  • Patent number: 7023685
    Abstract: A sheet capacitor of the invention has a contact portion formed in a through-hole requiring electrical connection with an IC connection pin among the through-holes in which the IC connection pins are inserted, and a capacitor element connected to the contact portion. Another sheet capacitor of the invention includes an insulating board and a capacitor element mounted on the insulating board. The insulating board has a connection land with an IC at the upper side, and a connection land with a printed wiring board at the lower side. The capacitor element and connection lands at the upper and lower side of the insulating board are connected with each other electrically. In any one of these configurations, a capacitor element of large capacity and low ESL is connected closely to the IC, and the mounting area of the peripheral circuits of the IC can be increased.
    Type: Grant
    Filed: October 29, 2003
    Date of Patent: April 4, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Terumi Fujiyama, Kazuo Fukunaga, Morihiro Fukuda, Yoshiaki Kuwada, Hiromasa Mori, Yoshio Hashimoto
  • Publication number: 20060007638
    Abstract: A sheet capacitor of the invention has a contact portion formed in a through-hole requiring electrical connection with an IC connection pin among the through-holes in which the IC connection pins are inserted, and a capacitor element connected to the contact portion. Another sheet capacitor of the invention includes an insulating board and a capacitor element mounted on the insulating board. The insulating board has a connection land with an IC at the upper side, and a connection land with a printed wiring board at the lower side. The capacitor element and connection lands at the upper and lower side of the insulating board are connected with each other electrically. In any one of these configurations, a capacitor element of large capacity and low ESL is connected closely to the IC, and the mounting area of the peripheral circuits of the IC can be increased.
    Type: Application
    Filed: September 16, 2005
    Publication date: January 12, 2006
    Inventors: Terumi Fujiyama, Kazuo Fukunaga, Morihiro Fukuda, Yoshiaki Kuwada, Hiromasa Mori, Yoshio Hashimoto
  • Publication number: 20040145877
    Abstract: A sheet capacitor of the invention has a contact portion formed in a through-hole requiring electrical connection with IC connection pin among the through-holes in which the IC connection pins are inserted, and a capacitor element connected to the contact portion. Another sheet capacitor of the invention includes an insulating board and a capacitor element mounted on the insulating board. The insulating board has a connection land with an IC at the upper side, and a connection land with a printed wiring board at the lower side. The capacitor element and connection lands at the upper and lower side of the insulating board are connected with each other electrically. In any one of these configurations, the capacitor element of large capacity and low ESL is connected closely to the IC, and the mounting area of the peripheral circuits of the IC can be increased.
    Type: Application
    Filed: October 29, 2003
    Publication date: July 29, 2004
    Inventors: Terumi Fujiyama, Kazuo Fukunaga, Morihiro Fukuda, Yoshiaki Kuwada, Hiromasa Mori, Yoshio Hashimoto