Abstract: A shunt-resistance type current detector includes a flat-plate shaped shunt resistor joined between a flat-plate shaped first bus bar and a flat-plate shaped second bus bar. Each of the bus bars includes respective detection conductors connected to a current detector. The shunt resistor and each of the bus bars are joined via weld parts. A gap for mounting the shunt resistor is formed between the first bus bar and the second bus bar, and projected parts are formed each being projected toward the gap from opposing faces opposing to each other in the gap. The shunt resistor comes an contact with each of the projected parts in a top-and-bottom direction.

Abstract: A shunt-resistance type current detector includes a flat-plate shaped shunt resistor joined between a flat-plate shaped first bus bar and a flat-plate shaped second bus bar. Each of the bus bars includes respective detection conductors connected to a current detector. The shunt resistor and each of the bus bars are joined via weld parts. A gap for mounting the shunt resistor is formed between the first bus bar and the second bus bar, and projected parts are formed each being projected toward the gap from opposing faces opposing to each other in the gap. The shunt resistor comes an contact with each of the projected parts in a top-and-bottom direction.

Abstract: A semiconductor testing device of the prevent invention includes a current detecting circuit, an electric current drawing circuit, and a determining device. The electric current drawing circuit is connected to a semiconductor device under test, and draws a branched electric current branched from a measured electric current output from a second terminal based on predetermined electric voltage. The current detecting circuit is connected to the semiconductor device, and detects a detection current obtained by subtracting the branched electric current from the measured electric current. The determining device determines a quality of the semiconductor device based on the detection current.

Abstract: A method of heat-treating a rail for obtaining a variety of strength levels from medium value to high value. The method has the steps of: preparing a steel rail maintained at a high temperature region not lower than the austenite field, and disposing a nozzle means around the head of the rail such that the nozzle means can direct a gaseous cooling medium toward the head of the rail; determining the distance between the nozzle means and the head of the rail in accordance with both the hardness level to be attained in the head of the rail and the carbon equivalent of the steel constituting the rail; moving the nozzle means such that the distance is attained between the nozzle means and the head of the rail; and directing the gaseous cooling medium towards the head at a predetermined flow rate and for a predetermined time so as to cool the head of the rail thereby attaining the desired hardness level in the head of the rail.

Abstract: A magnetic medium for magnetic embossment comprises a main magnetic layer and a high permeability magnetic-metal layer, a nonmagnetic white metal layer and a coloring layer laminated on the main magnetic layer.A magnetic card comprises a card substrate which is nonmagnetic, and a magnetic medium for magnetic embossment disposed on at least a part of the card substrate, which magnetic medium comprises a main magnetic layer and a high permeability magnetic-metal layer, a nonmagnetic white metal layer and a coloring layer laminated on the main magnetic layer.

Abstract: A magnetic recording medium which has a protective layer on a magnetic recording layer coated on a substrate and said protective layer comprises polyurethane and nitrocellulose in which isopropyl alcohol originally present has been replaced by a resin selected from the group consisting of polyurethane resins, polybutadiene resins, butadiene-acrylonitrile copolymers, vinyl chloride-vinyl acetate-vinyl alcohol copolymers, vinyl chloride-vinyl acetate copolymers, vinyl chloride-vinylidene chloride copolymers, vinylidene chloride-acrylonitrile-copolymers, vinyl acetate resins, epoxy resins, phenoxy resins, polyvinylbutyral resins, polyvinyl formal resins and polyester resins.