Patents by Inventor Yoshiaki Mori

Yoshiaki Mori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8431813
    Abstract: A percussion instrument may include a plurality of coupling device for operatively connecting a first hoop member, which may be configured to hold down a head arranged across a first end of a shell, with a second hoop member, which may be arranged on a second end of the shell. A sensor adjacent the head configured to detect vibration of the head may be operatively connected to the second hoop member.
    Type: Grant
    Filed: January 25, 2010
    Date of Patent: April 30, 2013
    Assignee: Roland Corporation
    Inventor: Yoshiaki Mori
  • Publication number: 20130018206
    Abstract: Provided are processes for producing high-purity succinic acid from a succinic-acid-containing liquid through crystallization.
    Type: Application
    Filed: September 14, 2012
    Publication date: January 17, 2013
    Applicant: MITSUBISHI CHEMICAL CORPORATION
    Inventors: Yoshiaki MORI, Go Takahashi, Hideki Suda, Shuji Yoshida
  • Publication number: 20120315450
    Abstract: A bonding method of bonding two base members together through a bonding film is provided. The bonding method is a method for forming a bonded body in which a first base member and a second base member are bonded together through the bonding film. The bonding method includes: applying a liquid material containing a silicone material composed of silicone compounds onto a surface of at least one of the first and second base members to form a liquid coating on the surface; drying the liquid coating so that it is transformed into the bonding film on the surface of the at least one of the first and second base members; and applying energy to the bonding film so that a bonding property is developed in the vicinity of a surface thereof, to thereby bond the first and second base members together through the bonding film.
    Type: Application
    Filed: June 26, 2012
    Publication date: December 13, 2012
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Takatoshi Yamamoto, Mitsuru Sato, Shintaro Asuke, Yoshiaki Mori, Kazuhiro Gomi
  • Publication number: 20120266737
    Abstract: A support structure for a percussion instrument has a support member configured to suppress the transfer of vibrations to the floor surface, and provide stability during performance. The entire percussion instrument and a portion or all of the pedal device are elastically supported above the floor, on the support member through the first vibration isolating members. Vibrations from the percussion instrument member and the pedal device are dampened by the first vibration isolating members. The first vibration isolating members are provided between the support member and the percussion instrument member, to suppress the transfer of vibrations to the floor surface, while the support member is stably supported on the floor surface.
    Type: Application
    Filed: December 14, 2011
    Publication date: October 25, 2012
    Inventor: Yoshiaki Mori
  • Patent number: 8258392
    Abstract: A percussion instrument striking detection device is configured to minimize time lag from striking the head until detection of head vibrations and for reliable detection of the vibrations in conformance with the striking force without regard to the head condition. A striking member has a vibration sensor. Therefore, the distance from the striking location on the head to the vibration sensor can be short, to minimize time lag. In addition, the effect of the tension or the material of the head on the vibrations detected by the vibration sensor can be minimized and vibrations in conformance with the striking force can be reliably detected.
    Type: Grant
    Filed: April 20, 2011
    Date of Patent: September 4, 2012
    Assignee: Roland Corporation
    Inventor: Yoshiaki Mori
  • Patent number: 8211259
    Abstract: A separating method of a bonded body, the bonded body including two base members and a bonding film through which the base members are boded together, enabling to easily and efficiently separating the bonded body into the two original base members is provided. Further, the bonding film contains a silicone material composed of silicone compounds. The separating method includes: preparing the bonded body with the bonding film; and applying energy for separation to the bonding film so that cleavage is generated within the bonding film due to breakage of a part of molecular bonds of the silicone compounds, to thereby separate the bonded body into the first and second base members.
    Type: Grant
    Filed: November 26, 2008
    Date of Patent: July 3, 2012
    Assignee: Seiko Epson Corporation
    Inventors: Mitsuru Sato, Takatoshi Yamamoto, Shintaro Asuke, Yoshiaki Mori, Kazuhiro Gomi
  • Patent number: 8140793
    Abstract: To provide a virtual tape device to reduce power consumption by utilizing a disk array device conforming to MAID. Two or more disk devices are divided into an information managing disk group whose power is kept on at all times and to two or more recording disk groups whose power is turned on/off as necessary when managing data. The virtual tape device includes: a volume information managing part which manages positions of virtual tapes allotted to storage areas of the recording disk groups; and a data managing part which rearranges, in the recording disk group whose power is on, the virtual tape for storing the data to the recording disk group whose power is off based on writing/reading information stored in the information managing disk group and positional information of the virtual tapes, and executes a control to write backup data to the recording disk group whose power is on.
    Type: Grant
    Filed: June 24, 2009
    Date of Patent: March 20, 2012
    Assignee: NEC Corporation
    Inventors: Hajime Nonaka, Yoshiaki Mori, Makoto Nakajima, Muneyuki Yoshikawa
  • Publication number: 20120000345
    Abstract: A percussion instrument striking detection device is configured to minimize time lag from striking the head until detection of head vibrations and for reliable detection of the vibrations in conformance with the striking force without regard to the head condition. A striking member has a vibration sensor. Therefore, the distance from the striking location on the head to the vibration sensor can be short, to minimize time lag. In addition, the effect of the tension or the material of the head on the vibrations detected by the vibration sensor can be minimized and vibrations in conformance with the striking force can be reliably detected.
    Type: Application
    Filed: April 20, 2011
    Publication date: January 5, 2012
    Inventor: Yoshiaki Mori
  • Publication number: 20110049868
    Abstract: A clamp for a musical instrument stand is equipped with a pipe retaining section having a metal base section formed with an abutting surface having a cylindrical inner peripheral surface, and a metal fastening section formed with a fastening surface having a cylindrical inner peripheral surface that is opposite to the abutting surface of the base section, wherein the abutting surface and the fastening surface hold an outer peripheral surface of a pipe from one side and another side to retain the pipe, and the clamp comprises a pipe sleeve in a semi-cylindrical shape that is made of a resin material, and has an outer peripheral surface to be abutted to the abutting surface or the fastening surface so as to be mounted on the abutting surface or the fastening surface; and a recessed section that is provided in a concave shape in a portion of at least one surface among an outer peripheral surface of the pipe sleeve, the abutting surface and the fastening surface, wherein a predetermined space surrounded by the re
    Type: Application
    Filed: July 1, 2010
    Publication date: March 3, 2011
    Applicant: ROLAND CORPORATION
    Inventor: Yoshiaki Mori
  • Publication number: 20110049867
    Abstract: Pipe holders retain a first pipe and a second pipe having a connector cable extending through the second pipe. The pipe holder has a first retaining section that detachably holds and fixes the first pipe and a second retaining section that detachably holds and fixes the second pipe. A second retaining chamber is surrounded by an internal surface of the second retaining section. A guide section communicatively connects the second retaining chamber to outside of the pipe holder, wherein the first retaining section, the second retaining section and the guide section are made of metal, and the connector cable that extends through second pipe and has at least one end to be connected to an electronic musical instrument is guided through the guide section to the outside. A coupling section couples the first retaining section and the second retaining section, wherein the guide section is formed in the coupling section.
    Type: Application
    Filed: July 1, 2010
    Publication date: March 3, 2011
    Applicant: ROLAND CORPORATION
    Inventor: Yoshiaki Mori
  • Publication number: 20100307323
    Abstract: A percussion instrument may include a plurality of coupling device for operatively connecting a first hoop member, which may be configured to hold down a head arranged across a first end of a shell, with a second hoop member, which may be arranged on a second end of the shell. A sensor adjacent the head configured to detect vibration of the head may be operatively connected to the second hoop member.
    Type: Application
    Filed: January 25, 2010
    Publication date: December 9, 2010
    Inventor: Yoshiaki Mori
  • Publication number: 20100201735
    Abstract: A bonding method of silicon base members is provided. The bonding method of silicon base members comprises: applying an energy to a surface of a first silicon base member having Si—H bonds on the surface to selectively cut the Si—H bonds so that dangling bonds of the silicon (Si) is exposed on the surface of the first silicon base member; and bonding the surface of the first silicon base member, on which the dangling bonds of the silicon has been exposed, and a surface of a second silicon base member on which dangling bonds of silicon are exposed so that the surface of the first silicon base member and the surface of the second silicon base member are bonded together through their dangling bonds.
    Type: Application
    Filed: June 16, 2008
    Publication date: August 12, 2010
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Mitsuru Sato, Yoshiaki Mori
  • Publication number: 20100183885
    Abstract: A bonding method of silicon base members is provided. The bonding method of silicon base members comprises: applying an energy to a first silicon base member including Si—H bonds to selectively cut the Si—H bonds so that the first silicon base member is cleaved and divided to one silicon base member and the other silicon base member, and the one silicon base member having a cleavage surface and dangling bonds of silicon obtained by cutting the Si—H bonds; and bonding the cleavage surface of the one silicon base member and a surface of a second silicon base member on which dangling bonds of silicon are exposed to thereby bond the cleavage surface and the surface together through their dangling bonds.
    Type: Application
    Filed: June 16, 2008
    Publication date: July 22, 2010
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Mitsuru Sato, Yoshiaki Mori
  • Patent number: 7741551
    Abstract: An electronic percussion instrument stand system includes a hollow pipe structure having a groove and ridge system that allows for wires to be routed along the pipe structure. The exit side of the groove is slightly smaller in diameter than the diameter of the cable which extends through it. The hollow pipe can be constricted or be expanded at the each end of the pipe to allow for a secure hold on the instrument. The hollow pipe connects to a cover that contains reciprocal ridges and grooves that create a strong hold and ease of assembly of the electronic percussion instrument stand system.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: June 22, 2010
    Assignee: Roland Corporation
    Inventor: Yoshiaki Mori
  • Patent number: 7732692
    Abstract: An electronic percussion instrument stand includes a center pipe structure. The center pipe structure has at least one center pipe having a longitudinal axis. A center pipe structure with at least two center pipes provides increased stability. A crescent-shaped base structure supports the center pipe structure in an upright orientation. At least one first arm supports at least one electronic percussion instrument. At least one first joint connects first arm to the center pipe structure. Each joint is adjustable in a direction of the longitudinal axis of the center pipe and in a direction around the longitudinal axis of the center pipe, for adjusting the position of the first arm. Each joint is adjustable between a position for playing electronic percussion instruments supported on the at least one arm, to a retracted position for transportation.
    Type: Grant
    Filed: January 17, 2008
    Date of Patent: June 8, 2010
    Assignee: Roland Corporation
    Inventors: Yoshiaki Mori, Koichi Nakao
  • Patent number: 7695570
    Abstract: The invention reduces the amounts of cleaning liquids and rinse liquid used, as well as the energy consumption. A cleaning head has a plurality of cleaning units and a drying unit. An organic substance cleaning portion of each cleaning unit blows a first cleaning agent selectively over a portion to be cleaned of a substrate, and sucks reaction products etc. through a first suction mouth. An inorganic substance cleaning portion blows a second cleaning agent over the portion to be cleaned of the substrate from which organic substance have been removed, and sucks reaction products etc. through a second suction mouth. A rinse portion blows pure water the portion of the substrate from which inorganic substance have been removed, and sucks its vapor through a third suction mouth. The drying unit dries the substrate by blowing out a heated gas from a hot wind blowing-out mouth.
    Type: Grant
    Filed: March 7, 2006
    Date of Patent: April 13, 2010
    Assignee: Seiko Epson Corporation
    Inventor: Yoshiaki Mori
  • Publication number: 20090327599
    Abstract: To provide a virtual tape device to reduce power consumption by utilizing a disk array device conforming to MAID. Two or more disk devices are divided into an information managing disk group whose power is kept on at all times and to two or more recording disk groups whose power is turned on/off as necessary when managing data. The virtual tape device includes: a volume information managing part which manages positions of virtual tapes allotted to storage areas of the recording disk groups; and a data managing part which rearranges, in the recording disk group whose power is on, the virtual tape for storing the data to the recording disk group whose power is off based on writing/reading information stored in the information managing disk group and positional information of the virtual tapes, and executes a control to write backup data to the recording disk group whose power is on.
    Type: Application
    Filed: June 24, 2009
    Publication date: December 31, 2009
    Inventors: Hajime Nonaka, Yoshiaki Mori, Makoto Nakajima, Muneyuki Yoshikawa
  • Patent number: 7557284
    Abstract: An apparatus for supporting musical instruments including at least one center pipe, at least one base to support the center pipe, at least one tubular arm pipe, wherein one end of the arm pipe is coupled to the center pipe, at least one clamp structure that can be coupled to the other end of arm pipe, capable of locking into the arm pipe while grasping at least one rod. The rod can support at least one musical instrument. The rod can be surrounded by a flexible bushing and clamps to hold the rod in place.
    Type: Grant
    Filed: January 17, 2008
    Date of Patent: July 7, 2009
    Assignee: Roland Corporation
    Inventors: Yoshiaki Mori, Kiyoshi Yoshino
  • Publication number: 20090136767
    Abstract: A bonding method of bonding two base members together through a bonding film having a fine pattern at low cost, and a bonded body with the bonding film which is formed using the bonding method are provided. The bonding method is a method for forming a bonded body in which a first base member and a second base member are bonded together through a bonding film having a predetermined pattern.
    Type: Application
    Filed: November 26, 2008
    Publication date: May 28, 2009
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Takatoshi YAMAMOTO, Mitsuru SATO, Shintaro ASUKE, Yoshiaki MORI, Kazuhiro GOMI
  • Patent number: D670108
    Type: Grant
    Filed: October 30, 2009
    Date of Patent: November 6, 2012
    Assignee: Roland Corporation
    Inventors: Koichi Nakao, Yoshiaki Mori