Abstract: A wafer feeding apparatus comprises a horizontally movable arm section, an electrostatic chuck mechanism having a vertically movable support member attached to the arm section and moving mechanism for moving the support member, and an electrostatic chuck attached to the support member and having two semi-circular electrodes located in a manner to be electrically isolated from each other and each having a wafer attraction section and an insulating film formed on the wafer attraction section. A direct-current voltage is across the electrodes to electrostatically attract a semiconductor wafer to the wafer attraction sections of the electrodes through the insulating film.