Patents by Inventor Yoshiaki Yanagida
Yoshiaki Yanagida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7189151Abstract: A pad of an embedding tool is received on a faceplate. The pad is supported on a support member. When the embedding tool is urged against the surface of the faceplate, the pad is allowed to change the attitude relative to the support member in response to undulation generated on the surface of the faceplate. The movement of the flat surface follows the undulation of the faceplate. When a relative movement is induced between the embedding tool and the surface of the faceplate, the surface of the faceplate thus reliably receives the uniform or constant contact of the flat surface. When grains are supplied between the flat surface of the pad and the surface of the faceplate, the grains are uniformly pushed into the surface of the faceplate. In this manner, the grains are uniformly and constantly embedded into the surface of the faceplate.Type: GrantFiled: June 28, 2004Date of Patent: March 13, 2007Assignee: Fujitsu LimitedInventors: Mitsuo Takeuchi, Yoshiaki Yanagida, Tomokazu Sugiyama, Tsutomu Sooda
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Publication number: 20060201633Abstract: Disclosed herein is a method including the steps of cutting a wafer to prepare a row block having a plurality of head elements arranged in a matrix, bonding a plate member to one side surface of the row block, bonding a row tool to another side surface of the row block bonded to the plate member opposite to the one side surface, and cutting the row block to prepare a row bar bonded to the row tool and having a row of the head elements. A bonding apparatus for realizing the above bonding steps is also disclosed.Type: ApplicationFiled: May 2, 2006Publication date: September 14, 2006Inventors: Michinao Nomura, Yoshiaki Yanagida, Tomokazu Sugiyama
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Publication number: 20060172575Abstract: A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part 30 that tiltably supports the slider is provided on the set plate. There is also provided a pressing mechanism that elastically presses the slider via the movable support part toward a surface of the medium to dispose the slider floating over the surface of the medium. The pressing mechanism includes an elastic body 56 composed of a plate spring that contacts the movable support part and elastically presses the movable support part.Type: ApplicationFiled: January 6, 2006Publication date: August 3, 2006Applicant: FUJITSU LIMITED,Inventors: Norio Kainuma, Kenji Kobae, Hidehiko Kira, Hiroshi Kobayashi, Shuichi Takeuchi, Takayoshi Matsumura, Hirokazu Yamanishi, Shinji Hiraoka, Yoshiaki Yanagida
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Patent number: 7070671Abstract: Disclosed herein is a method including the steps of cutting a wafer to prepare a row block having a plurality of head elements arranged in a matrix, bonding a plate member to one side surface of the row block, bonding a row tool to another side surface of the row block bonded to the plate member opposite to the one side surface, and cutting the row block to prepare a row bar bonded to the row tool and having a row of the head elements. A bonding apparatus for realizing the above bonding steps is also disclosed.Type: GrantFiled: February 6, 2003Date of Patent: July 4, 2006Assignee: Fujitsu LimitedInventors: Michinao Nomura, Yoshiaki Yanagida, Tomokazu Sugiyama, Koji Sudo
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Patent number: 7014532Abstract: A lapping machine comprises a lapping surface plate (1) rotated by a rotating mechanism, a lapping jig (28) having a plurality of projections to bottom surfaces of which a work (30) to be lapped by a lapping surface on the lapping surface plate (1) is fitted, amount-of-projection adjusting elements (29) for adjusting the variation of the plurality of projections (28c) to the lapping surface plate (1) individually, and a control circuit (36) for outputting variation-of-projection control signals to the variation-of-projection adjusting elements (29).Type: GrantFiled: April 13, 2004Date of Patent: March 21, 2006Assignee: Fujitsu LimitedInventors: Teruaki Nishioka, Kazuo Yokoi, Yoshiaki Yanagida, Shunsuke Sone
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Publication number: 20050186887Abstract: A processing method includes the steps of elastically deforming a jig together with a work, the jig having been mounted on a work, compressing the work against a polishing surface, and moving the work and the polishing surface relative to each other.Type: ApplicationFiled: March 31, 2005Publication date: August 25, 2005Applicant: FUJITSU LIMITEDInventors: Michinao Nomura, Yoshiaki Yanagida, Koji Sudo, Shunsuke Sone
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Patent number: 6913509Abstract: Disclosed herein is a method of polishing a workpiece having a plurality of resistance elements by operating a plurality of bend mechanisms to push/pull the workpiece with respect to a polishing surface. This method includes the steps of measuring a shape of the workpiece, calculating an operational amount of each bend mechanism according to the shape measured, pressing the workpiece on the polishing surface with the bend mechanisms according to the operational amount calculated, and updating the operational amount according to a working amount of the workpiece. According to this method, magnetic heads included in the workpiece can be stably polished.Type: GrantFiled: June 12, 2003Date of Patent: July 5, 2005Assignee: Fujitsu LimitedInventors: Shunsuke Sone, Yoshiaki Yanagida, Teruaki Nishioka, Koji Suto
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Patent number: 6905394Abstract: An apparatus and a method for polishing a row bar including magnetic head sliders. A lapping surface plate is rotatable, and a housing is movable above the lapping surface plate. A jig is secured to the housing for holding the row bar. The jig is formed by an elongated rigid member having a plurality of holes and an elongated elastic member fixed to the rigid member. An air cylinder presses the whole row bar, and a pressing devices individually presses portions of the elastic member corresponding to magnetic head sliders of the row bar through the holes of the rigid member. A portion of the elastic member is deformed to press a portion of the row bar in response to a change in the measured resistance of ELG resistance elements in the row bar.Type: GrantFiled: February 23, 2004Date of Patent: June 14, 2005Assignee: Fujitsu LimitedInventors: Koji Sudo, Yoshiaki Yanagida
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Publication number: 20050064793Abstract: An apparatus and a method for polishing a row bar including magnetic head sliders. A lapping surface plate is rotatable, and a housing is movable above the lapping surface plate. A jig is secured to the housing for holding the row bar. The jig is formed by an elongated rigid member having a plurality of holes and an elongated elastic member fixed to the rigid member. An air cylinder presses the whole row bar, and a pressing devices individually presses portions of the elastic member corresponding to magnetic head sliders of the row bar through the holes of the rigid member. A portion of the elastic member is deformed to press a portion of the row bar in response to a change in the measured resistance of ELG resistance elements in the row bar.Type: ApplicationFiled: February 23, 2004Publication date: March 24, 2005Applicant: FUJITSU LIMITEDInventors: Koji Sudo, Yoshiaki Yanagida
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Publication number: 20040235404Abstract: A pad of an embedding tool is received on a faceplate. The pad is supported on a support member. When the embedding tool is urged against the surface of the faceplate, the pad is allowed to change the attitude relative to the support member in response to undulation generated on the surface of the faceplate. The movement of the flat surface follows the undulation of the faceplate. When a relative movement is induced between the embedding tool and the surface of the faceplate, the surface of the faceplate thus reliably receives the uniform or constant contact of the flat surface. When grains are supplied between the flat surface of the pad and the surface of the faceplate, the grains are uniformly pushed into the surface of the faceplate. In this manner, the grains are uniformly and constantly embedded into the surface of the faceplate.Type: ApplicationFiled: June 28, 2004Publication date: November 25, 2004Applicant: FUJITSU LIMITEDInventors: Mitsuo Takeuchi, Yoshiaki Yanagida, Tomokazu Sugiyama, Tsutomu Sooda
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Publication number: 20040226653Abstract: A table receives an object, subjected to the adhesion process, in an adhesive setting apparatus. An adhesive have been applied on the object on the table. An exposure mechanism is designed to expose the adhesive to a gaseous accelerator. The adhesive setting apparatus utilizes the gaseous accelerator to promote the setting or hardening of the adhesive. The gaseous accelerator uniformly contacts the adhesive as compared with the mist of the accelerator. Since the adhesive is uniformly exposed to the gaseous accelerator, an uneven progression can reliably be avoided in the setting of the adhesive. It is possible to reliably avoid heterogeneity or localization of the set adhesive.Type: ApplicationFiled: June 22, 2004Publication date: November 18, 2004Applicant: FUJITSU LIMITEDInventors: Hirokazu Yamanishi, Tomokazu Sugiyama, Tsutomu Sooda, Yoshiaki Yanagida
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Publication number: 20040209546Abstract: A lapping machine comprises a lapping surface plate (1) rotated by a rotating mechanism, a lapping jig (28) having a plurality of projections to bottom surfaces of which a work (30) to be lapped by a lapping surface on the lapping surface plate (1) is fitted, amount-of-projection adjusting elements (29) for adjusting the variation of the plurality of projections (28c) to the lapping surface plate (1) individually, and a control circuit (36) for outputting variation-of-projection control signals to the variation-of-projection adjusting elements (29).Type: ApplicationFiled: April 13, 2004Publication date: October 21, 2004Applicant: Fujitsu LimitedInventors: Teruaki Nishioka, Kazuo Yokoi, Yoshiaki Yanagida, Shunsuke Sone
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Patent number: 6758725Abstract: A lapping method includes a step of moving a substantially bar-shaped workpiece in a radial direction of a surface of a rotary lapping plate while simultaneously oscillating the workpiece pivotally about a central point in a longitudinal direction of the workpiece in a plane parallel to the surface of the rotary lapping plate.Type: GrantFiled: September 27, 2000Date of Patent: July 6, 2004Assignee: Fujitsu LimitedInventors: Koji Sudo, Yoshiaki Yanagida, Tomokazu Sugiyama
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Patent number: 6722947Abstract: A lapping machine comprises a lapping surface plate (1) rotated by a rotating mechanism, a lapping jig (28) having a plurality of projections to bottom surfaces of which a work (30) to be lapped by a lapping surface on the lapping surface plate (1) is fitted, amount-of-projection adjusting elements (29) for adjusting the variation of the plurality of projections (28c) to the lapping surface plate (1) individually, and a control circuit (36) for outputting variation-of-projection control signals to the variation-of-projection adjusting elements (29).Type: GrantFiled: September 10, 2001Date of Patent: April 20, 2004Assignee: Fujitsu LimitedInventors: Teruaki Nishioka, Kazuo Yokoi, Yoshiaki Yanagida, Shunsuke Sone, Koji Sudo, Tomokazu Sugiyama
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Patent number: 6687556Abstract: A blade as an edged member having separated two forward ends is inserted into an opening of a holder as a U-shaped member, and a gap between the two forward ends of the inserted blade is widened so that a width of the opening is expanded, and a light guide body as a thin plate is inserted into the opening with expanded width, and after that the two forward ends of the blade are drawn from the opening.Type: GrantFiled: September 21, 2001Date of Patent: February 3, 2004Assignee: Fujitsu LimitedInventors: Michinao Nomura, Yoshiaki Yanagida
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Publication number: 20030216106Abstract: Disclosed herein is a method of polishing a workpiece having a plurality of resistance elements by operating a plurality of bend mechanisms to push/pull the workpiece with respect to a polishing surface. This method includes the steps of measuring a shape of the workpiece, calculating an operational amount of each bend mechanism according to the shape measured, pressing the workpiece on the polishing surface with the bend mechanisms according to the operational amount calculated, and updating the operational amount according to a working amount of the workpiece. According to this method, magnetic heads included in the workpiece can be stably polished.Type: ApplicationFiled: June 12, 2003Publication date: November 20, 2003Applicant: Fujitsu LimitedInventors: Shunsuke Sone, Yoshiaki Yanagida, Teruaki Nishioka, Koji Suto
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Patent number: 6604989Abstract: Disclosed herein is a method including the steps of cutting a wafer to prepare a row block having a plurality of head elements arranged in a matrix, bonding a plate member to one side surface of the row block, bonding a row tool to another side surface of the row block bonded to the plate member opposite to the one side surface, and cutting the row block to prepare a row bar bonded to the row tool and having a row of the head elements. A bonding apparatus for realizing the above bonding steps is also disclosed.Type: GrantFiled: January 24, 2001Date of Patent: August 12, 2003Assignee: Fujitsu LimitedInventors: Yoshiaki Yanagida, Koji Sudo
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Patent number: 6599170Abstract: Disclosed herein is a method of polishing a workpiece having a plurality of resistance elements by operating a plurality of bend mechanisms to push/pull the workpiece with respect to a polishing surface. This method includes the steps of measuring a shape of the workpiece, calculating an operational amount of each bend mechanism according to the shape measured, pressing the workpiece on the polishing surface with the bend mechanisms according to the operational amount calculated, and updating the operational amount according to a working amount of the workpiece. According to this method, magnetic heads included in the workpiece can be stably polished.Type: GrantFiled: December 13, 2000Date of Patent: July 29, 2003Assignee: Fujitsu LimitedInventors: Shunsuke Sone, Yoshiaki Yanagida, Teruaki Nishioka, Koji Suto, Tomokazu Sugiyama
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Publication number: 20030119421Abstract: Disclosed herein is a method including the steps of cutting a wafer to prepare a row block having a plurality of head elements arranged in a matrix, bonding a plate member to one side surface of the row block, bonding a row tool to another side surface of the row block bonded to the plate member opposite to the one side surface, and cutting the row block to prepare a row bar bonded to the row tool and having a row of the head elements. A bonding apparatus for realizing the above bonding steps is also disclosed.Type: ApplicationFiled: February 6, 2003Publication date: June 26, 2003Applicant: Fujitsu LimitedInventors: Michinao Nomura, Yoshiaki Yanagida, Tomokazu Sugiyama, Koji Sudo
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Publication number: 20020198620Abstract: A blade as an edged member having separated two forward ends is inserted into an opening of a holder as a U-shaped member, and a gap between the two forward ends of the inserted blade is widened so that a width of the opening is expanded, and a light guide body as a thin plate is inserted into the opening with expanded width, and after that the two forward ends of the blade are drawn from the opening.Type: ApplicationFiled: September 21, 2001Publication date: December 26, 2002Applicant: Fujitsu LimitedInventors: Michinao Nomura, Yoshiaki Yanagida