Patents by Inventor Yoshiaki YUKIMORI
Yoshiaki YUKIMORI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240009747Abstract: According to a head assembly for mounting conductive balls of the disclosure, a gas flow for moving the conductive balls in a downward direction is formed in a chamber, and thus, small and light-weight conductive balls may be effectively mounted in mounting recesses of a mask. Also, because the head assembly for mounting the conductive balls is operated in the manner of inducing the conductive balls to move in a direction in which the mounting recesses are formed, the conductive balls may be rapidly and thoroughly mounted in the plurality of mounting recesses formed in the mask.Type: ApplicationFiled: July 4, 2023Publication date: January 11, 2024Applicant: PROTEC CO., LTD.Inventors: Youn Sung Ko, YOSHIAKI YUKIMORI, GEUNSIK AHN
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Publication number: 20230093905Abstract: Provided is a conductive ball mounting method using an electrostatic chuck. According to the conductive ball mounting method using an electrostatic chuck, when the process of mounting conductive balls onto a substrate through mounting grooves formed in the mask is performed, the occurrence of process defects can be prevented and conductive balls having very small sizes can be effectively mounted on the substrate. According to the conductive ball mounting method using the electrostatic chuck of the disclosure, the process of mounting conductive balls can be performed with high quality by preventing deformation of the mask without missing of some of the conductive balls. According to the conductive ball mounting method using the electrostatic chuck of the disclosure, the process of mounting small sizes of conductive balls on the substrate can be effectively performed.Type: ApplicationFiled: December 1, 2022Publication date: March 30, 2023Applicant: PROTEC CO., LTD.Inventors: Youn Sung KO, Yoshiaki YUKIMORI
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Patent number: 10804240Abstract: Provided is a method of mounting a conductive ball, and more particularly, a method of mounting a conductive ball, whereby defects during a process of mounting a conductive ball on a substrate by using a mounting hole formed in a mask may be prevented, and a conductive ball having a small size may also be effectively mounted on the substrate. According to the method of mounting a conductive ball, a process of mounting a conductive ball may be performed by preventing deformation of a mask, thus achieving a high quality of the process without omitting any conductive balls.Type: GrantFiled: March 27, 2019Date of Patent: October 13, 2020Assignee: PROTEC CO., LTD.Inventors: Youn Sung Ko, Yoshiaki Yukimori
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Patent number: 10804239Abstract: Provided is an apparatus for mounting a conductive ball, and more particularly, an apparatus for mounting a conductive ball, whereby defects during a process of mounting a conductive ball on a substrate by using a mounting hole formed in a mask may be prevented, and a conductive ball having a small size may also be effectively mounted on the substrate. According to the apparatus for mounting a conductive ball, a process of mounting a conductive ball may be performed by preventing deformation of a mask, thus achieving a high quality of the process without missing any conductive balls.Type: GrantFiled: March 22, 2019Date of Patent: October 13, 2020Assignee: PROTEC CO., LTD.Inventors: Youn Sung Ko, Yoshiaki Yukimori
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Publication number: 20200144219Abstract: Provided is an apparatus for mounting a conductive ball, and more particularly, an apparatus for mounting a conductive ball, whereby defects during a process of mounting a conductive ball on a substrate by using a mounting hole formed in a mask may be prevented, and a conductive ball having a small size may also be effectively mounted on the substrate. According to the apparatus for mounting a conductive ball, a process of mounting a conductive ball may be performed by preventing deformation of a mask, thus achieving a high quality of the process without missing any conductive balls.Type: ApplicationFiled: March 22, 2019Publication date: May 7, 2020Applicant: PROTEC CO., LTD.Inventors: Youn Sung Ko, YOSHIAKI YUKIMORI
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Publication number: 20200144220Abstract: Provided is a method of mounting a conductive ball, and more particularly, a method of mounting a conductive ball, whereby defects during a process of mounting a conductive ball on a substrate by using a mounting hole formed in a mask may be prevented, and a conductive ball having a small size may also be effectively mounted on the substrate. According to the method of mounting a conductive ball, a process of mounting a conductive ball may be performed by preventing deformation of a mask, thus achieving a high quality of the process without omitting any conductive balls.Type: ApplicationFiled: March 27, 2019Publication date: May 7, 2020Applicant: PROTEC CO., LTD.Inventors: Youn Sung Ko, YOSHIAKI YUKIMORI
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Patent number: 9726204Abstract: A fluid pressure actuator including a fluid pressure cylinder having a first position detector and a second position detector, a piston body having a piston head and a rod, the piston head mounted on the rod and slidably accommodated in the fluid pressure cylinder, the rod including a first scale and a second scale, the first scale facing the first position detector and the first position detector configured to detect a position in a sliding direction of the piston body, the second scale facing the second position detector and the second position detector configured to detect a position of the rod in a rotation direction of the piston body, and a controller configured to perform a first positioning control of a position of the rod in the sliding direction and a second positioning control of the rod in the rotation direction may be provided.Type: GrantFiled: December 5, 2014Date of Patent: August 8, 2017Assignee: Samsung Electronics Co., Ltd.Inventors: Masato Kajinami, Fumitaka Moroishi, Keiji Murata, Shinji Ueyama, Tatsuya Ishimoto, Yoshiaki Yukimori
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Patent number: 9508577Abstract: A semiconductor manufacturing apparatus may include: a pickup unit configured to pick up a chip in a first region of the semiconductor manufacturing apparatus; a bonding head configured to receive the picked-up chip and configured to move from the first region to a top of a circuit board in a second region of the semiconductor manufacturing apparatus; and/or an optical unit configured to detect a bonding position on the circuit board while moving from the first region to the second region. A semiconductor manufacturing apparatus may include: a bonding head including a heater for heating a chip and bonding the chip onto a circuit board; and/or a cooling block, adjacent to the heater, through which cooling liquid flows. The cooling liquid may be removed from the cooling block while the heater generates heat. The cooling liquid may be supplied to the cooling block while the heater is cooled.Type: GrantFiled: July 22, 2014Date of Patent: November 29, 2016Assignee: Samsung Electronics Co., Ltd.Inventors: Byung Joon Lee, Masato Kajinami, Yoshiaki Yukimori, Sang-Yoon Kim, Hui-Jae Kim, Byeong-Kuk Park, Seung Dae Seok, Jae Bong Shin, Byeong Kap Choi
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Patent number: 9082885Abstract: A method of manufacturing a semiconductor device includes: providing a first substrate that includes internal wiring, the first substrate including an array of chip mounting regions that includes a first chip mounting region; placing the first substrate on a first carrier line; providing a first semiconductor chip; placing the first semiconductor chip on a first moveable tray; vertically aligning the first chip mounting region of the first substrate with the first semiconductor chip, and performing initial bonding of the first semiconductor chip to the first chip mounting region of the first substrate; and performing subsequent bonding on the initially-bonded first semiconductor chip and first mounting region of the first substrate, thereby more strongly bonding the first semiconductor chip to the first substrate at the first mounting region. The initial bonding occurs after performing a subsequent bonding of at least one other semiconductor chip on the first substrate.Type: GrantFiled: May 21, 2014Date of Patent: July 14, 2015Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yoshiaki Yukimori, Shinji Ueyama, Masato Kajinami
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Publication number: 20150159681Abstract: A fluid pressure actuator including a fluid pressure cylinder having a first position detector and a second position detector, a piston body having a piston head and a rod, the piston head mounted on the rod and slidably accommodated in the fluid pressure cylinder, the rod including a first scale and a second scale, the first scale facing the first position detector and the first position detector configured to detect a position in a sliding direction of the piston body, the second scale facing the second position detector and the second position detector configured to detect a position of the rod in a rotation direction of the piston body, and a controller configured to perform a first positioning control of a position of the rod in the sliding direction and a second positioning control of the rod in the rotation direction may be provided.Type: ApplicationFiled: December 5, 2014Publication date: June 11, 2015Inventors: Masato KAJINAMI, Fumitaka MOROISHI, Keiji MURATA, Shinji UEYAMA, Tatsuya ISHIMOTO, Yoshiaki YUKIMORI
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Publication number: 20150155210Abstract: A semiconductor manufacturing apparatus may include: a pickup unit configured to pick up a chip in a first region of the semiconductor manufacturing apparatus; a bonding head configured to receive the picked-up chip and configured to move from the first region to a top of a circuit board in a second region of the semiconductor manufacturing apparatus; and/or an optical unit configured to detect a bonding position on the circuit board while moving from the first region to the second region. A semiconductor manufacturing apparatus may include: a bonding head including a heater for heating a chip and bonding the chip onto a circuit board; and/or a cooling block, adjacent to the heater, through which cooling liquid flows. The cooling liquid may be removed from the cooling block while the heater generates heat. The cooling liquid may be supplied to the cooling block while the heater is cooled.Type: ApplicationFiled: July 22, 2014Publication date: June 4, 2015Inventors: Byung Joon LEE, Masato KAJINAMI, Yoshiaki YUKIMORI, Sang-Yoon KIM, Hui-Jae KIM, Byeong-Kuk PARK, Seung Dae SEOK, Jae Bong SHIN, Byeong Kap CHOI
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Publication number: 20150024551Abstract: A method of manufacturing a semiconductor device includes: providing a first substrate that includes internal wiring, the first substrate including an array of chip mounting regions that includes a first chip mounting region; placing the first substrate on a first carrier line; providing a first semiconductor chip; placing the first semiconductor chip on a first moveable tray; vertically aligning the first chip mounting region of the first substrate with the first semiconductor chip, and performing initial bonding of the first semiconductor chip to the first chip mounting region of the first substrate; and performing subsequent bonding on the initially-bonded first semiconductor chip and first mounting region of the first substrate, thereby more strongly bonding the first semiconductor chip to the first substrate at the first mounting region. The initial bonding occurs after performing a subsequent bonding of at least one other semiconductor chip on the first substrate.Type: ApplicationFiled: May 21, 2014Publication date: January 22, 2015Inventors: Yoshiaki YUKIMORI, Shinji UEYAMA, Masato KAJINAMI