Patents by Inventor Yoshifumi Urakawa
Yoshifumi Urakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9109072Abstract: A curable composition includes (A) silica fine particles surface-modified with at least one silane compound including at least (A1) a polymerizable silane compound of the general formula (1), (B) a (meth)acrylate compound, and (C) a polymerization initiator, SiR1aR2bR3c(OR4)4-a-b-c??(1) wherein R1 is a C11-20 hydrocarbon group having an ethylenic unsaturated group, or a substituted C11-20 hydrocarbon group having an ethylenic unsaturated group and having an ether bond and/or an ester bond; R2 is a hydrogen atom or a C1-4 hydrocarbon group; R3 is a halogen atom; R4 is a hydrogen atom or a C1-10 hydrocarbon group; a is an integer of 1 to 3; b is an integer of 0 to 2; c is an integer of 0 to 3; the sum of a and b is 1 to 3; the sum of a, b and c is 1 to 4.Type: GrantFiled: February 5, 2013Date of Patent: August 18, 2015Assignee: SHOWA DENKO K.K.Inventors: Nobuyuki Takahashi, Yoshifumi Urakawa, Hideo Miyata, Shigeru Yamaki
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Publication number: 20140378571Abstract: A curable composition includes (A) silica fine particles surface-modified with at least one silane compound including at least (A1) a polymerizable silane compound of the general formula (1), (B) a (meth)acrylate compound, and (C) a polymerization initiator, SiR1aR2bR3c(OR4)4-a-b-c??(1) wherein R1 is a C11-20 hydrocarbon group having an ethylenic unsaturated group, or a substituted C11-20 hydrocarbon group having an ethylenic unsaturated group and having an ether bond and/or an ester bond; R2 is a hydrogen atom or a C1-4 hydrocarbon group; R3 is a halogen atom; R4 is a hydrogen atom or a C1-10 hydrocarbon group; a is an integer of 1 to 3; b is an integer of 0 to 2; c is an integer of 0 to 3; the sum of a and b is 1 to 3; the sum of a, b and c is 1 to 4.Type: ApplicationFiled: February 5, 2013Publication date: December 25, 2014Applicant: SHOWA DENKO K.K.Inventors: Nobuyuki Takahashi, Yoshifumi Urakawa, Hideo Miyata, Shigeru Yamaki
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Publication number: 20130310516Abstract: The present invention provides a curable composition, wherein a cured material obtainable by curing the curable composition has excellent transparency, thermal durability and surface hardness and has a small Abbe number. In particular, the present invention provides a curable composition containing (a) silica fine particles; (b) a (meth)acrylate compound having two or more ethylenically unsaturated groups; (c) a (meth)allyl compound having two or more ethylenically unsaturated groups and having an aromatic ring structure; and (d) a polymerization initiator; wherein the surface of the silica fine particles (a) has been treated with a specified silane compound (e) and a specified silane compound (f).Type: ApplicationFiled: February 17, 2012Publication date: November 21, 2013Applicant: SHOWA DENKO K.K.Inventors: Yoshifumi Urakawa, Shigeru Yamaki, Nobuaki Ishii
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Patent number: 8399569Abstract: An object of the present invention is to provide a reactive urethane compound having superior curability, adhesion to substrates, transparency, molecular flexibility, and mechanical properties, a curable composition containing the compound, and a cured material formed from the composition. An ethylenically-unsaturated-group containing reactive urethane compound of the present invention is represented by formula (I): wherein R1 and R2 are each independently a hydrogen atom or an alkylene group; R3 is a hydrogen atom, a alkyl group, or an aryl group; R4 is a single bond or an alkylene group; R5 is a hydrogen atom or a methyl group; R6 is an oxygen atom, a sulfur atom, or an imino group; n is 2 to 12; m is 1 to 300; and X is an aliphatic, aromatic or heterocyclic compound residue.Type: GrantFiled: May 21, 2008Date of Patent: March 19, 2013Assignee: Showa Denko K.K.Inventors: Katsumi Murofushi, Nobuaki Ishii, Miyuki Tomita, Yotaro Hattori, Yoshifumi Urakawa
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Patent number: 8242217Abstract: It is an object of the present invention to provide an epoxy resin curing agent which has a favorable pot life and good storage stability as a curing agent for epoxy resins and from which an epoxy resin cured product having good water resistance and hardness is obtained through curing. The present invention is an epoxy resin curing agent containing a secondary or tertiary branched thiol compound having a substituent on a carbon atom at the ?-position to a thiol group, and is also an epoxy resin composition comprising a polyvalent epoxy compound and the epoxy resin curing agent.Type: GrantFiled: December 8, 2008Date of Patent: August 14, 2012Assignee: Showa Denko K.K.Inventors: Yoshifumi Urakawa, Hideo Miyata, Isao Yamagami, Katsumi Murofushi
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Publication number: 20120010361Abstract: The present invention provides a curable composition having a proper viscosity and excellent handling properties, and a cured product that is obtainable by curing the curable composition and has excellent transparency, heat resistance and resistance to environment and a low Abbe's number, and further can effectively decrease chromatic aberration by the combined use with a material having a high Abbe's number. The curable composition is characterized by comprising (a) silica fine particles, (b) a (meth)acrylate compound having at least two ethylenic unsaturated groups and having no ring structure, (c) a (meth)acrylate compound having at least two ethylenic unsaturated groups and having an aromatic ring structure and (d) a polymerization initiator, wherein the silica particles (a) are surface treated by a specific silane compound (e) and a specific silane compound (f).Type: ApplicationFiled: March 10, 2010Publication date: January 12, 2012Applicant: SHOWA DENKO K.K.Inventors: Yoshifumi Urakawa, Shigeru Yamaki, Hideo Miyata, Nobuyuki Mitarai, Saori Yamaki, Nobuaki Ishii
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Publication number: 20110294948Abstract: Disclosed is a (meth)acrylate compound which can provide a cured article having a high refractive index and excellent transparency and heat resistance, and which has superior handling characteristics; further disclosed are a curable composition containing the (meth)acrylate compound, and a cured article thereof. The (meth)acrylate compound contains an aromatic group represented by the following general formula (1), the curable composition comprising the aromatic-group containing (meth)acrylate compound, and the cured article thereof. (In the formula, R1, R2, R3 and R4 are each independently a hydrogen atom or a methyl group; X is an organic group having an aromatic group and 6 to 30 carbon atoms; and a and b are each independently an integer of 0 to 3.Type: ApplicationFiled: February 9, 2010Publication date: December 1, 2011Applicant: SHOWA DENKO K.K.Inventors: Yoshifumi Urakawa, Shigeru Yamaki, Nobuaki Ishii, Yoshihiko Maeda
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Publication number: 20100273940Abstract: It is an object of the present invention to provide an epoxy resin curing agent which has a favorable pot life and good storage stability as a curing agent for epoxy resins and from which an epoxy resin cured product having good water resistance and hardness is obtained through curing. The present invention is an epoxy resin curing agent containing a secondary or tertiary branched thiol compound having a substituent on a carbon atom at the ?-position to a thiol group, and is also an epoxy resin composition comprising a polyvalent epoxy compound and the epoxy resin curing agent.Type: ApplicationFiled: December 8, 2008Publication date: October 28, 2010Applicant: SHOWA DENKO K.K.Inventors: Yoshifumi Urakawa, Hideo Miyata, Isao Yamagami, Katsumi Murofushi
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Publication number: 20100210812Abstract: It is an object of the present invention to provide a curable composition having excellent curability and capable of forming a cured film which is excellent in surface hardness, scratch resistance, flexibility, bending property, transparency and curling property, and a cured product thereof. The curable composition of the present invention is characterized by comprising (A) a urethane compound represented by the following general formula (1), (B) a thiol compound and (C) a polymerization initiator.Type: ApplicationFiled: June 26, 2008Publication date: August 19, 2010Applicant: SHOWA DENKO K.K.Inventors: Yoshifumi Urakawa, Nobuaki Ishii, Miyuki Tomita, Yotaro Hattori, Haruhiko Ikeda, Katsumi Murofushi
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Publication number: 20100160557Abstract: An object of the present invention is to provide a reactive urethane compound having superior curability, adhesion to substrates, transparency, molecular flexibility, and mechanical properties, a curable composition containing the compound, and a cured material formed from the composition. An ethylenically-unsaturated-group containing reactive urethane compound of the present invention is represented by formula (I): wherein R1 and R2 are each independently a hydrogen atom or an alkylene group; R3 is a hydrogen atom, a alkyl group, or an aryl group; R4 is a single bond or an alkylene group; R5 is a hydrogen atom or a methyl group; R6 is an oxygen atom, a sulfur atom, or an imino group; n is 2 to 12; m is 1 to 300; and X is an aliphatic, aromatic or heterocyclic compound residue.Type: ApplicationFiled: May 21, 2008Publication date: June 24, 2010Applicant: SHOWA DENKO K.K.Inventors: Katsumi Murofushi, Nobuaki Ishii, Miyuki Tomita, Yotaro Hattori, Yoshifumi Urakawa
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Publication number: 20100087611Abstract: It is an object of the present invention to provide a urethane compound capable of providing a cured product which is excellent in surface hardness, scratch resistance, flexibility and bending property, has reduced curling property and also has good transparency, a curable composition containing the same and a cured product thereof. The curable composition of the present invention is characterized by containing a specific urethane compound having an isocyanurate ring skeleton and a polymerization initiator.Type: ApplicationFiled: April 24, 2008Publication date: April 8, 2010Applicant: SHOWA DENKO K.K.Inventors: Yoshifumi Urakawa, Nobuaki Ishii, Nobuyuki Mitarai, Yotaro Hattori, Hiroko Oi, Katsumi Murofushi