Patents by Inventor Yoshifusa Ogawa

Yoshifusa Ogawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Preparation of boiling heat transfer surface
    Patent number: 4291758
    Abstract: A boiling heat transfer surface for heat transfer between a heat source and a coolant is provided. On the heat transfer surface contacting with a liquid coolant such as fluorinated hydrocarbon type liquid coolants, metallic particles having grain size of 60 mesh pass and 250 mesh nonpass (Japanese Industrial Standard sieve) are piled up and fixed by a metallic film on the heat transfer surface.
    Type: Grant
    Filed: October 3, 1979
    Date of Patent: September 29, 1981
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Masao Fujii, Yoshifusa Ogawa, Yoshiyuki Morihiro