Abstract: A machine tool system includes a machine tool main body for machining a workpiece supported on a table by using a tool detachably attached to a spindle, and an information processing apparatus. The machine tool main body includes a rotary tool magazine in which multiple grips each capable of holding the tool to be attached to the spindle are provided along the circumferential direction, and an image pickup device that is arranged in the tool magazine and configured to take an image of multiple members in a machining area of the machine tool main body. The information processing apparatus includes a geometric feature calculating unit configured to calculate the shapes and the arrangement state of the multiple members in the machining area, based on image data of the image taken by the image pickup device.

Abstract: A machine tool system includes a machine tool main body for machining a workpiece supported on a table by using a tool detachably attached to a spindle, and an information processing apparatus. The machine tool main body includes a rotary tool magazine in which multiple grips each capable of holding the tool to be attached to the spindle are provided along the circumferential direction, and an image pickup device that is arranged in the tool magazine and configured to take an image of multiple members in a machining area of the machine tool main body. The information processing apparatus includes a geometric feature calculating unit configured to calculate the shapes and the arrangement state of the multiple members in the machining area, based on image data of the image taken by the image pickup device.

Abstract: Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whiskers while keeping good wettability of the solder. In the bonded structure, a lead-free Sn—Ag—Bi alloy solder is applied to an electrode through an Sn—Bi alloy layer. The Sn—Bi alloy, preferably, comprises 1 to 20 wt % Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn—Bi alloy layer thereby obtaining an enough bonding strength.

Abstract: Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whiskers while keeping good wettability of the solder. In the bonded structure, a lead-free Sn—Ag—Bi alloy solder is applied to an electrode through an Sn—Bi alloy layer. The Sn—Bi alloy, preferably, comprises 1 to 20 wt % Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn—Bi alloy layer thereby obtaining an enough bonding strength.

Abstract: Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whiskers while keeping good wettability of the solder. In the bonded structure, a lead-free Sn—Ag—Bi alloy solder is applied to an electrode through an Sn—Bi alloy layer. The Sn—Bi alloy, preferably, comprises 1 to 20 wt % Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn—Bi alloy layer thereby obtaining an enough bonding strength.

Abstract: Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whiskers while keeping good wettability of the solder. In the bonded structure, a lead-free Sn—Ag—Bi alloy solder is applied to an electrode through an Sn—Bi alloy layer. The Sn—Bi alloy, preferably, comprises 1 to 20 wt % Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn—Bi alloy layer thereby obtaining an enough bonding strength.

Abstract: Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whiskers while keeping good wettability of the solder. In the bonded structure, a lead-free Sn—Ag—Bi alloy solder is applied to an electrode through an Sn—Bi alloy layer. The Sn—Bi alloy, preferably, comprises 1 to 20 wt % Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn—Bi alloy layer thereby obtaining an enough bonding strength.

Abstract: Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whiskers while keeping good wettability of the solder. In the bonded structure, a lead-free Sn—Ag—Bi alloy solder is applied to an electrode through an Sn—Bi alloy layer. The Sn—Bi alloy, preferably, comprises 1 to 20 wt % Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn—Bi alloy layer thereby obtaining an enough bonding strength.

Abstract: A method of producing an electronic device by connecting a lead of a semiconductor device with an electrode of a circuit board to form a bonded structure. In the bonded structure, a lead-free Sn—Ag—Bi alloy solder is applied to an electrode through an Sn—Bi alloy layer. The Sn—Bi alloy, preferably, comprises 1 to 20 wt % Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn—Bi alloy layer thereby obtaining an enough bonding strength.

Abstract: Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whiskers while keeping good wettability of the solder. In the bonded structure, a lead-free Sn—Ag—Bi alloy solder is applied to an electrode through an Sn—Bi alloy layer. The Sn—Bi alloy, preferably, comprises 1 to 20 wt % Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn—Bi alloy layer thereby obtaining an enough bonding strength.

Abstract: A wire electric discharge machining apparatus having a structure for supplying power to a wire electrode which prolongs the life of a power supply element and reduces manufacturing and running costs. A guide roller is driven by a small motor through a lead screw and guides the wire electrode above and/or below the power supply element, formed as a flat plate and driven in an oscillating direction perpendicular to a running direction of the wire electrode and parallel to a flat surface of the power supply element. A contact position of the wire electrode on the power supply element is varied over an area of a wide range, avoiding creation of a groove or the like, attributable to friction, in the power supply element and extending the life thereof.

Abstract: A wire electric discharge machining apparatus having a structure for supplying power to a wire electrode, the structure being capable of prolonging the life of a power supply element and reducing a manufacturing cost and a running cost with a simple structure. There is provided a guide roller for guiding the wire electrode above and/or below the power supply element formed into a flat plate. The guide roller is driven by a small motor through a lead screw. An oscillating direction is perpendicular to a running direction of the wire electrode and parallel to a flat surface of the power supply element. A contact position of the wire electrode on the power supply element is varied in an area of a wide range, so that the contact position is not focused, thereby creating no groove or the like, that is attributable to friction, in the power supply element and extending the life thereof. The power supply element is formed into a simple flat plate, reducing the manufacturing cost thereof.

Abstract: Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whiskers while keeping good wettability of the solder. In the bonded structure, a lead-free Sn—Ag—Bi alloy solder is applied to an electrode through an Sn—Bi alloy layer. The Sn—Bi alloy, preferably, comprises 1 to 20 wt % Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn—Bi alloy layer thereby obtaining an enough bonding strength.

Abstract: Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whiskers while keeping good wettability of the solder. In the bonded structure, a lead-free Sn—Ag—Bi alloy solder is applied to an electrode through an Sn—Bi alloy layer. The Sn—Bi alloy, preferably, comprises 1 to 20 wt % Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn—Bi alloy layer thereby obtaining an enough bonding strength.

Abstract: Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whiskers while keeping good wettability of the solder. In the bonded structure, a lead-free Sn—Ag—Bi alloy solder is applied to an electrode through an Sn—Bi alloy layer. The Sn—Bi alloy, preferably, comprises 1 to 20 wt % Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn—Bi alloy layer thereby obtaining an enough bonding strength.

Abstract: A two-platen mold-clamping apparatus is provided, which requires neither tie bars nor rear platen, and is thus comprised of a reduced number of components, is easy to maintain, and is low-priced. A plurality of ball nuts are mounted on a movable platen so as to be rotatable but axially immovable relative to the movable platen. The movable platen mounted for reciprocal motion relative to a stationary platen. A respective ball screw is threadedly engaged with each of the ball nuts and each balls screw has an end portion that is fixed to the stationary platen. A motor rotates the ball nuts by means of sprockets and a chain so that the ball nuts and the movable platen are moved toward the stationary platen. The ball screws are moved longitudinally relative to the movable platen so as to generate a mold-clamping force after a mold-touch state has been reached.

Abstract: An insert molding method and apparatus not requiring a multiple movable molds and permitting stable insert molding to be performed by means of light, small-sized equipment. A robot for removing a molded product and a robot for placing an insert member are arranged around a mold clamping mechanism, and making them perform removal of a molded product and placement of the insert member, respectively, during a mold opening process of a molding cycle. The molding apparatus does not requirs a plurality of lower molds (stationary molds) and accordingly permits to eliminate a turntable or a sliding table, whereby the molding apparatus can be reduced in size and weight. Further, since only one lower mold suffices to obtain one type of molded products, the manufacturing cost of molds can be reduced and the mold temperature control can be made easier, so that not only the molding conditions are stabilized but also the life of the mold can be prolonged by eliminating the poor positioning.

Abstract: A driving apparatus for an electrically-operated injection molding machine not requiring any bearing nor any connector. An electric motor having a rotor shaft on which a ball screw is integrally formed is mounted on one of a cross-head and a rear platen of a clamping mechanism, while a ball nut threadedly engaged with the rotor shaft is fixed to the other of the cross-head and the rear platen to constitute the driving apparatus for linearly moving the cross-head. As the ball screw is integrally formed on rotor shaft, any connector for connecting these two members is unnecessary. As the ball screw is directly rotated by the motor positioned coaxially with the ball screw, any bearing for bearing a redial force acting on the ball screw and rotor shaft. The apparatus may also be applied to an ejection mechanism, an injection mechanism and a nozzle touch mechanism of the electrically-operated injection molding machine.

Abstract: A powder molding machine capable of providing a uniform density of molding powders filled in a molding cavity of a die for improving the strength of molded products includes a die, upper and lower punches and a feeder, and is further provided with a feeder driving unit, which reciprocates a feed shoe between an advanced position at which molding powder is supplied to the die and a retracted position at which no interference occurs during a pressing operation by the punches. The feed driving unit includes a mechanism for enabling the feeder shoe to pass over the die and also to be swung in left and right directions while retracting and while still over the die.

Abstract: A product acceptance/rejection judgment method which always ensures accurate judgment whether a product is acceptable or not even when an injection molding machine is operated in different operating environments is implemented by a processor (22) of a numerically controlled device (20). When the processor determines that it should perform, in addition to a normal product acceptance/rejection judgment based on molding process parameters, an auxiliary product acceptance/rejection judgment based on at least one operating parameter which directly indicates an injection molding machine operating environment characteristic involved in the acceptance/rejection judgment of the product, the processor reads output data from an A-D converter (11, 12 or 13) which data corresponds to the actual value of at least one operating parameter detected by an appropriate die temperature sensor (8), open air temperature sensor (9) or a wind velocity sensor (10).