Patents by Inventor Yoshiharu Sanagawa
Yoshiharu Sanagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20220178034Abstract: An electrically conductive substrate contains at least titanium. An intermediate layer is provided on a primary surface of the electrically conductive substrate. A composite layer is provided on the intermediate layer. The composite layer includes tantalum layers and catalyst layers. Each of the catalyst layers contains platinum and iridium. Each of the tantalum layers is made from tantalum oxide, tantalum, or a mixture of tantalum oxide and tantalum. The tantalum layers and the catalyst layers are alternately stacked one layer by one layer in a thickness direction of the electrically conductive substrate. A bottom layer of the composite layer closest to the primary surface of the electrically conductive substrate is constituted by one tantalum layer of the tantalum layers. A top layer of the composite layer furthest from the electrically conductive substrate is constituted by one catalyst layer of the catalyst layers.Type: ApplicationFiled: March 24, 2020Publication date: June 9, 2022Inventors: Mohd ERMAN, Fumitoshi SHINNO, Hiroshi ADACHI, Yoshiharu SANAGAWA
-
Patent number: 10078007Abstract: An infrared sensor includes an infrared detecting device, a lens, a member, a gap and a spacer. The lens is disposed above the infrared detecting device. The member forms an external surface and includes a first opening having a maximum internal diameter. The gap is disposed between the member and the lens. The spacer is disposed between the member and the lens so as to form the gap, and that is directly contact with lens. The spacer has a circular inner periphery, in planar view, which has a larger internal diameter than the maximum internal diameter of the first opening of the member.Type: GrantFiled: January 11, 2017Date of Patent: September 18, 2018Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Takafumi Okudo, Takahiro Miyatake, Yoshiharu Sanagawa, Masao Kirihara, Yoichi Nishijima, Takanori Aketa, Ryo Tomoida
-
Patent number: 9818923Abstract: The light emitting device includes the cap including the ultraviolet light transmitting part made of glass for transmitting ultraviolet light. In the light emitting device, the first electrode of the ultraviolet light emitting element and the first conductor of the mounting substrate are bonded with the first bond made of AuSn, the second electrode of the ultraviolet light emitting element and the second conductor of the mounting substrate are bonded with the second bond made of AuSn, and the first bonding metal layer of the mounting substrate and the second bonding metal layer of the cap are bonded with the third bond made of AuSn.Type: GrantFiled: October 27, 2015Date of Patent: November 14, 2017Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Mitsuhiko Ueda, Yoshiharu Sanagawa, Takanori Aketa
-
Publication number: 20170279019Abstract: The light emitting device includes the cap including the ultraviolet light transmitting part made of glass for transmitting ultraviolet light. In the light emitting device, the first electrode of the ultraviolet light emitting element and the first conductor of the mounting substrate are bonded with the first bond made of AuSn, the second electrode of the ultraviolet light emitting element and the second conductor of the mounting substrate are bonded with the second bond made of AuSn, and the first bonding metal layer of the mounting substrate and the second bonding metal layer of the cap are bonded with the third bond made of AuSn.Type: ApplicationFiled: October 27, 2015Publication date: September 28, 2017Inventors: Mitsuhiko UEDA, Yoshiharu SANAGAWA, Takanori AKETA
-
Publication number: 20170122799Abstract: An infrared sensor includes an infrared detecting device, a lens, a member, a gap and a spacer. The lens is disposed above the infrared detecting device. The member forms an external surface and includes a first opening having a maximum internal diameter. The gap is disposed between the member and the lens. The spacer is disposed between the member and the lens so as to form the gap, and that is directly contact with lens. The spacer has a circular inner periphery, in planar view, which has a larger internal diameter than the maximum internal diameter of the first opening of the member.Type: ApplicationFiled: January 11, 2017Publication date: May 4, 2017Inventors: Takafumi OKUDO, Takahiro MIYATAKE, Yoshiharu SANAGAWA, Masao KIRIHARA, Yoichi NISHIJIMA, Takanori AKETA, Ryo TOMOIDA
-
Patent number: 9587978Abstract: An infrared sensor includes: an infrared detecting device; a lens disposed above the infrared detecting device; an member that is disposed at a side of an upper surface of the lens and includes an opening; and a gap that intervenes between the member and the lens and has a wider range than the opening.Type: GrantFiled: June 10, 2014Date of Patent: March 7, 2017Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Takafumi Okudo, Takahiro Miyatake, Yoshiharu Sanagawa, Masao Kirihara, Yoichi Nishijima, Takanori Aketa, Ryo Tomoida
-
Patent number: 9508679Abstract: A mounting method of mounting chips on a substrate includes a temporarily-bonding process, and a main-bonding process. Temporarily-bonding process is to perform a first basic process, repeatedly depending on the number of the chips. First basic process includes a first step and a second step. First step is to align, on a first metal layer of the substrate, a second metal layer of each chip. Second step is to temporarily bond each chip by subjecting the first and second metal layers to solid phase diffusion bonding. Main-bonding process is to perform a second basic process, repeatedly depending on the number of the chips. Second basic process includes a third step and a fourth step. Third step is to recognize a position of each chip temporarily mounted on the substrate. Fourth step is to firmly bond each chip by subjecting the first and second metal layers to liquid phase diffusion bonding.Type: GrantFiled: March 11, 2013Date of Patent: November 29, 2016Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Mitsuhiko Ueda, Yoshiharu Sanagawa, Takanori Aketa, Shintaro Hayashi
-
Patent number: 9478682Abstract: The infrared sensor includes: an infrared sensor chip in which a plurality of pixel portions each including a temperature-sensitive portion formed of a thermopile is disposed in an array on one surface side of a semiconductor substrate; and an IC chip that processes an output signal of the infrared sensor chip. A package includes a package main body on which the infrared sensor chip and the IC chip are mounted to be arranged side-by-side, and a package cover that has a lens transmitting infrared rays and is hermetically bonded to the package main body. The package is provided therein with a cover member that includes a window hole through which infrared rays pass into the infrared sensor chip and equalizes amounts of temperature change of hot junctions and cold junctions among the pixel portions, the temperature change resulting from heating of the IC chip.Type: GrantFiled: June 23, 2011Date of Patent: October 25, 2016Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Masao Kirihara, Hiroshi Yamanaka, Yoshiharu Sanagawa, Takanori Aketa, Yushi Nakamura, Mitsuhiko Ueda
-
Patent number: 9425373Abstract: A light emitting module includes: a first substrate including a resin having insulation properties, and a copper component embedded in the resin; a second substrate placed above the copper component of the first substrate, and soldered to the copper component; a mounting electrode formed above the second substrate; and an LED placed above the second substrate, and gold-tin soldered to the mounting electrode.Type: GrantFiled: March 11, 2014Date of Patent: August 23, 2016Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Takanori Aketa, Yoshiharu Sanagawa, Mitsuhiko Ueda, Takaaki Yoshihara, Shintaro Hayashi, Toshihiko Sato
-
Publication number: 20160020374Abstract: A light emitting module includes: a first substrate including a resin having insulation properties, and a copper component embedded in the resin; a second substrate placed above the copper component of the first substrate, and soldered to the copper component; a mounting electrode formed above the second substrate; and an LED placed above the second substrate, and gold-tin soldered to the mounting electrode.Type: ApplicationFiled: March 11, 2014Publication date: January 21, 2016Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Takanori AKETA, Yoshiharu SANAGAWA, Mitsuhiko UEDA, Takaaki YOSHIHARA, Shintaro HAYASHI, Toshihiko SATO
-
Patent number: 9203047Abstract: The organic electroluminescent element has a transparent substrate, a transparent first electrode, an organic layer, a second electrode, and a light-outcoupling layer. The light-outcoupling layer is formed between the transparent substrate and the first electrode. The first electrode, the organic layer and the second electrode constitute an electroluminescent laminate. A covering substrate facing the transparent substrate is adhered to the surface of the transparent substrate via an adhesive sealing portion surrounding the periphery of the electroluminescent laminate. A connection electrode extending outward from inside a surrounded region where the electroluminescent laminate is covered with the covering substrate is formed at least on the surface of the light-outcoupling layer. The average thickness of the light-outcoupling layer in an adhesion region where the adhesive sealing portion is formed is smaller than the thickness in the central region where the electroluminescent laminate is formed.Type: GrantFiled: March 12, 2013Date of Patent: December 1, 2015Assignee: PANASONIC CORPORATIONInventors: Tsutomu Ichihara, Yoshiharu Sanagawa, Nobuhiro Ide, Hirofumi Kubota
-
Publication number: 20150287696Abstract: A mounting method of mounting chips on a substrate includes a temporarily-bonding process, and a main-bonding process. Temporarily-bonding process is to perform a first basic process, repeatedly depending on the number of the chips. First basic process includes a first step and a second step. First step is to align, on a first metal layer of the substrate, a second metal layer of each chip. Second step is to temporarily bond each chip by subjecting the first and second metal layers to solid phase diffusion bonding. Main-bonding process is to perform a second basic process, repeatedly depending on the number of the chips. Second basic process includes a third step and a fourth step. Third step is to recognize a position of each chip temporarily mounted on the substrate. Fourth step is to firmly bond each chip by subjecting the first and second metal layers to liquid phase diffusion bonding.Type: ApplicationFiled: March 11, 2013Publication date: October 8, 2015Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Mitsuhiko Ueda, Yoshiharu Sanagawa, Takanori Aketa, Shintaro Hayashi
-
Publication number: 20150236292Abstract: An organic electroluminescent element includes: a substrate; an organic light emitter including a first electrode, an organic light-emitting layer, and a second electrode; and a sealing member covering the organic light emitter. The first electrode, the organic light-emitting layer and the second electrode are located in this order. An electrode lead-out part is provided on a surface of an end of the substrate. The electrode lead-out part is externally led out from the sealing member. A wiring board is provided on an opposite side of the sealing member from the substrate. The wiring board has a surface which a wiring connecting electrode is in. The wiring board includes an external electrode pad electrically connected to the wiring connecting electrode. The wiring connecting electrode and the electrode lead-out part are electrically connected to each other by a coating-type conductive material.Type: ApplicationFiled: October 10, 2013Publication date: August 20, 2015Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Toshihiko Sato, Yoshiharu Sanagawa
-
Patent number: 9112181Abstract: A composite substrate includes a moisture-proof substrate, and a resin substrate pasted on a surface of the moisture-proof substrate. The resin substrate is formed to be smaller than the moisture-proof substrate in planar view. An end side of the resin substrate is an inclined face that is inclined inward. In an organic electroluminescence device, an organic light-emitting multilayer provided on a surface of the resin substrate is sealed with a sealing member. A moisture-proof film coats at least part of the surface of the resin substrate in which no lead-out electrode is formed.Type: GrantFiled: February 7, 2013Date of Patent: August 18, 2015Assignee: PANASONIC CORPORATIONInventors: Kazuyuki Yamae, Shintaro Hayashi, Yuko Suzuka, Yoshiharu Sanagawa, Masuyuki Ota, Hitomichi Takano, Nobuhiro Ide, Yoshikazu Kuzuoka
-
Publication number: 20150171362Abstract: The organic electroluminescence element includes: a substrate; an organic light emitter formed on a surface of the substrate and including a first electrode, an organic light emitting layer, and a second electrode in this order; and an enclosing member bonded to the substrate to enclose the organic light emitter by covering it. The element further includes: an extended electrode part electrically connected to the first electrode and/or the second electrode and extending outward across the enclosing member to be on a surface of an end part of the substrate; and an electrode piece serving as an interconnection electrode and provided on an opposite side of the enclosing member from the substrate. The electrode piece includes an extension part fixed to the extended electrode part to make electric connection between the electrode piece and the extended electrode part.Type: ApplicationFiled: June 12, 2013Publication date: June 18, 2015Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Toshihiko Sato, Yoshiharu Sanagawa, Shingo Houzumi, Keiko Kawahito, Koji Tsuji, Masao Kirihara
-
Patent number: 8952331Abstract: An infrared sensor module includes: an infrared sensor device disposed on a substrate and configured to receive infrared signals; a signal processing circuit device configured to process an output from the infrared sensor device; a metal case which is provided at a predetermined distance from the infrared sensor device, which includes a light incident window provided with an optical system for coupling an image on the infrared sensor device from external infrared signals, and which accommodates the infrared sensor device and the signal processing circuit device; and a sensor cover which is disposed between the infrared sensor device and the case and the signal processing circuit device, and which includes a light-transmitting portion configured to guide the infrared signals entering via the optical system to the infrared sensor device.Type: GrantFiled: December 17, 2010Date of Patent: February 10, 2015Assignee: Panasonic CorporationInventors: Mitsuhiko Ueda, Takami Okubayashi, Takanori Sugiyama, Yoshiharu Sanagawa, Takanori Aketa, Yushi Nakamura, Masao Kirihara
-
Publication number: 20150028317Abstract: The organic electroluminescent element has a transparent substrate, a transparent first electrode, an organic layer, a second electrode, and a light-outcoupling layer. The light-outcoupling layer is formed between the transparent substrate and the first electrode. The first electrode, the organic layer and the second electrode constitute an electroluminescent laminate. A covering substrate facing the transparent substrate is adhered to the surface of the transparent substrate via an adhesive sealing portion surrounding the periphery of the electroluminescent laminate. A connection electrode extending outward from inside a surrounded region where the electroluminescent laminate is covered with the covering substrate is formed at least on the surface of the light-outcoupling layer. The average thickness of the light-outcoupling layer in an adhesion region where the adhesive sealing portion is formed is smaller than the thickness in the central region where the electroluminescent laminate is formed.Type: ApplicationFiled: March 12, 2013Publication date: January 29, 2015Applicant: PANASONIC CORPORATIONInventors: Tsutomu Ichihara, Yoshiharu Sanagawa, Nobuhiro Ide, Hirofumi Kubota
-
Publication number: 20150014672Abstract: A composite substrate includes a moisture-proof substrate, and a resin substrate pasted on a surface of the moisture-proof substrate. The resin substrate is formed to be smaller than the moisture-proof substrate in planar view. An end side of the resin substrate is an inclined face that is inclined inward. In an organic electroluminescence device, an organic light-emitting multilayer provided on a surface of the resin substrate is sealed with a sealing member. A moisture-proof film coats at least part of the surface of the resin substrate in which no lead-out electrode is formed.Type: ApplicationFiled: February 7, 2013Publication date: January 15, 2015Inventors: Kazuyuki Yamae, Shintaro Hayashi, Yuko Suzuka, Yoshiharu Sanagawa, Masuyuki Ota, Hitomichi Takano, Nobuhiro Ie, Yoshikazu Kuzuoka
-
Publication number: 20140291527Abstract: An infrared sensor includes: an infrared detecting device; a lens disposed above the infrared detecting device; an member that is disposed at a side of an upper surface of the lens and includes an opening; and a gap that intervenes between the member and the lens and has a wider range than the opening.Type: ApplicationFiled: June 10, 2014Publication date: October 2, 2014Inventors: Takafumi OKUDO, Takahiro MIYATAKE, Yoshiharu SANAGAWA, Masao KIRIHARA, Yoichi NISHIJIMA, Takanori AKETA, Ryo TOMOIDA
-
Publication number: 20130093037Abstract: The infrared sensor includes: an infrared sensor chip in which a plurality of pixel portions each including a temperature-sensitive portion formed of a thermopile is disposed in an array on one surface side of a semiconductor substrate; and an IC chip that processes an output signal of the infrared sensor chip. A package includes a package main body on which the infrared sensor chip and the IC chip are mounted to be arranged side-by-side, and a package cover that has a lens transmitting infrared rays and is hermetically bonded to the package main body. The package is provided therein with a cover member that includes a window hole through which infrared rays pass into the infrared sensor chip and equalizes amounts of temperature change of hot junctions and cold junctions among the pixel portions, the temperature change resulting from heating of the IC chip.Type: ApplicationFiled: June 23, 2011Publication date: April 18, 2013Applicant: Panasonic CorporationInventors: Masao Kirihara, Hiroshi Yamanaka, Yoshiharu Sanagawa, Takanori Aketa, Yushi Nakamura, Mitsuhiko Ueda