Abstract: A monitor system is formed with a programmable controller for executing a user program, a data collecting unit connected to the programmable controller for collecting variable data of the programmable controller and a monitor device connected to the data collecting unit through a communication line. The functions of the system include that of storing a preliminarily defined virtual variable apart from the user program of the programmable controller and from the variable data of the programmable controller and a calculation formula using one or more real variables for obtaining the virtual variable, that of collecting real variable data in the stored calculation formula and any other real variables from the programmable controller, that of carrying out a calculation according to the stored calculation formula based on the collected real variable data, and that of displaying correspondence of the collected real variables and the result of the calculation as waveforms on a display device.

Abstract: A semiconductor device includes: a connecting body including a connecting electrode; and at least one semiconductor chip stacked on the connecting body, the semiconductor chip including: a substrate; and a trans-substrate conductive plug that penetrates the substrate, the trans-substrate conductive plug having a first terminal that is provided on an active surface side of the substrate; and a second terminal that is provided on a back surface side that is opposite the active surface side, an outer shape of the first terminal being formed larger than an outer shape of the second terminal, wherein the second terminal of the semiconductor chip is electrically connected to a connecting electrode of the connecting body via a brazing material.

Abstract: An apparatus 10A for manufacturing semiconductor devices includes a plurality of receiving portions 12 for receiving an upper semiconductor package 30 on a top surface of the receiving portion 12. The receiving portion has a function of restricting the movement of the upper semiconductor package 30 in a direction parallel to a top surface of the upper semiconductor package 30. The receiving portion 12 is a concave portion in which the upper semiconductor package 30 is adapted to be received. An adhesive material having a function of immovably holding the upper semiconductor package 30 to the receiving portion 12 may be provided within the receiving portion 12, for example.

Abstract: An apparatus for manufacturing semiconductor devices having a roughly rectangular parallelepiped box-shape includes an internal insertion space for semiconductor packages, first guide grooves and arranged along the longitudinal direction in both side surfaces facing the insertion space and second guide grooves and arranged parallel to the first guide grooves and respectively. Edge portions of an upper semiconductor package (a semiconductor component) are loosely fitted into the second guide grooves so that the movement of the upper semiconductor package in the left and right direction is restricted. Further, edge portions of a lower semiconductor package (a substrate for mounting semiconductor components) are loosely fitted into the first guide grooves so that the movement of the lower semiconductor package in the left and right direction is restricted.

Abstract: A press-fit sealed electronic component includes an electronic component, a plug to be equipped with the electronic component, and a tube to be sealed by press-fitting the plug, wherein the plug is brought into close contact with the tube through a tin-free alloy layer. A method for producing a press-fit sealed electronic component includes the steps of forming the plug and the tube with a nickel silver material, forming a tin-copper layer by plating on each surface of the plug and the tube, forming a copper-zinc alloy layer at the interface between the nickel silver material and the tin-copper layer by heat treatment, removing the tin-copper layer remaining on the copper-zinc alloy layer to expose the copper-zinc alloy layer, and bringing the plug into close contact with the tube through the exposed copper-zinc alloy layer to seal the tube by press-fit.

Abstract: A monitor system is formed with a programmable controller for executing a user program, a data collecting unit connected to the programmable controller for collecting variable data of the programmable controller and a monitor device connected to the data collecting unit through a communication line. The functions of the system include that of storing a preliminarily defined virtual variable apart from the user program of the programmable controller and from the variable data of the programmable controller and a calculation formula using one or more real variables for obtaining the virtual variable, that of collecting real variable data in the stored calculation formula and any other real variables from the programmable controller, that of carrying out a calculation according to the stored calculation formula based on the collected real variable data, and that of displaying correspondence of the collected real variables and the result of the calculation as waveforms on a display device.

Abstract: A device package structure includes: a base body having a conductive connection portion and a level difference portion; a device arranged on the base body, having a connection terminal electrically connected to the conductive connection portion via the level difference portion on the base body; and a connector electrically connecting the connection terminal and the conductive connection portion, having substantially the same height as a height of the level difference portion.

Abstract: A semiconductor device includes: a connecting body including a connecting electrode; and at least one semiconductor chip stacked on the connecting body, the semiconductor chip including: a substrate; and a trans-substrate conductive plug that penetrates the substrate, the trans-substrate conductive plug having a first terminal that is provided on an active surface side of the substrate; and a second terminal that is provided on a back surface side that is opposite the active surface side, an outer shape of the first terminal being formed larger than an outer shape of the second terminal, wherein the second terminal of the semiconductor chip is electrically connected to a connecting electrode of the connecting body via a brazing material.

Abstract: A press-fit sealed electronic component includes an electronic component, a plug to be equipped with the electronic component, and a tube to be sealed by press-fitting the plug, wherein the plug is brought into close contact with the tube through a tin-free alloy layer. A method for producing a press-fit sealed electronic component includes the steps of forming the plug and the tube with a nickel silver material, forming a tin-copper layer by plating on each surface of the plug and the tube, forming a copper-zinc alloy layer at the interface between the nickel silver material and the tin-copper layer by heat treatment, removing the tin-copper layer remaining on the copper-zinc alloy layer to expose the copper-zinc alloy layer, and bringing the plug into close contact with the tube through the exposed copper-zinc alloy layer to seal the tube by press-fit.

Abstract: An apparatus 10A for manufacturing semiconductor devices includes a plurality of receiving portions 12 for receiving an upper semiconductor package 30 on a top surface of the receiving portion 12. The receiving portion has a function of restricting the movement of the upper semiconductor package 30 in a direction parallel to a top surface of the upper semiconductor package 30. The receiving portion 12 is a concave portion in which the upper semiconductor package 30 is adapted to be received. An adhesive material having a function of immovably holding the upper semiconductor package 30 to the receiving portion 12 may be provided within the receiving portion 12, for example.

Abstract: An apparatus for manufacturing semiconductor devices having a roughly rectangular parallelepiped box-shape includes an internal insertion space for semiconductor packages, first guide grooves and arranged along the longitudinal direction in both side surfaces facing the insertion space and second guide grooves and arranged parallel to the first guide grooves and respectively. Edge portions of an upper semiconductor package (a semiconductor component) are loosely fitted into the second guide grooves so that the movement of the upper semiconductor package in the left and right direction is restricted. Further, edge portions of a lower semiconductor package (a substrate for mounting semiconductor components) are loosely fitted into the first guide grooves so that the movement of the lower semiconductor package in the left and right direction is restricted.

Abstract: An extremely convenient apparatus for evaluating the inner quality of vegetables and fruits which is small and inexpensive, can be introduced easily even by small-scaled enterprisers, in which an installation place can be changed easily, and safety and promptness of the replacing work of light sources are fully taking into consideration is provided.

Abstract: An extremely convenient apparatus for evaluating the inner quality of vegetables and fruits which is small and inexpensive, can be introduced easily even by small-scaled enterprisers, in which an installation place can be changed easily, and safety and promptness of the replacing work of light sources are fully taking into consideration is provided.