Abstract: Provided is a ground member that can prevent damage to interlayer adhesion between a conductive layer and an adhesive layer of the ground member due to heating in producing a shielded printed wiring board or in mounting an electronic component on a shielded printed wiring board. The ground member of the present invention includes: a conductive layer; and an adhesive layer stacked on the conductive layer, the adhesive layer containing a binder component and hard particles, the adhesive layer having a thickness of 5 to 30 ?m.

Abstract: Provided is a ground member that can prevent damage to interlayer adhesion between a conductive layer and an adhesive layer of the ground member due to heating in producing a shielded printed wiring board or in mounting an electronic component on a shielded printed wiring board. The ground member of the present invention includes: a conductive layer; and an adhesive layer stacked on the conductive layer, the adhesive layer containing a binder component and hard particles, the adhesive layer having a thickness of 5 to 30 ?m.

Abstract: The conductive adhesive includes a thermosetting resin (A) and a conductive filler (B), and has a loss modulus at 200° C. from 5.0×104 Pa to 4.0×105 Pa.

Abstract: A conductive adhesive contains a thermosetting resin (A), a conductive filler (B), and a filling-performance improver (C). The thermosetting resin (A) contains a first resin component (A1) having a first functional group, and a second resin component (A2) having a second functional group that reacts with the first functional group. The filling-performance improver (C) contains an organic salt. The conductive adhesive contains from 40 to 140 parts by mass of the filling-performance improver (C) relative to 100 parts by mass of the thermosetting resin.

Abstract: A conductive adhesive contains a thermosetting resin (A), a conductive filler (B), and a filling-performance improver (C). The thermosetting resin (A) contains a first resin component (A1) having a first functional group, and a second resin component (A2) having a second functional group that reacts with the first functional group. The filling-performance improver (C) contains an organic salt. The conductive adhesive contains from 40 to 140 parts by mass of the filling-performance improver (C) relative to 100 parts by mass of the thermosetting resin.

Abstract: A coaxial cable is configured so that adhesion between an insulating layer and a shield layer can be improved without addition of an adhesive component and roughening of an adhesive surface. The coaxial cable includes a center conductor, the insulating layer covering the outer periphery of the center conductor, the shield layer covering the outer periphery of the insulating layer, and a sheath covering the outer periphery of the shield layer. An anchor layer containing resin whose glass-transition point is equal to or lower than 15° C. is provided between the insulating layer and the shield layer.

Abstract: The conductive adhesive includes a thermosetting resin (A) and a conductive filler (B), and has a loss modulus at 200° C. from 5.0×104 Pa to 4.0×105 Pa.

Abstract: Cost reduction in a multicore cable is realized by reduction in the frequency of damaging a coaxial cable upon removal of a covering layer. A multicore cable 10 includes multiple coaxial cables 11 arranged in parallel, and ground members 15, 16 conductively connected with the coaxial cables 11. Each coaxial cable includes an internal conductor 11a, an internal insulating layer 11b covering an outer peripheral surface of the internal conductor 11a, an external conductor 11c covering an outer peripheral surface of the internal insulating layer 11b, a covering layer 11d covering an outer peripheral surface of the external conductor 11c, a removed portion 11e formed in such a manner that part of the covering layer 11d in a circumferential direction is removed such that the external conductor 11c is exposed, and a conductive member 21 filling the removed portion 11e. The ground member 15 is conductively connected with the conductive member 21 filling the removed portion 11e.

Abstract: Cost reduction in a multicore cable is realized by reduction in the frequency of damaging a coaxial cable upon removal of a covering layer. A multicore cable 10 includes multiple coaxial cables 11 arranged in parallel, and ground members 15, 16 conductively connected with the coaxial cables 11. Each coaxial cable includes an internal conductor 11a, an internal insulating layer 11b covering an outer peripheral surface of the internal conductor 11a, an external conductor 11c covering an outer peripheral surface of the internal insulating layer 11b, a covering layer 11d covering an outer peripheral surface of the external conductor 11c, a removed portion 11e formed in such a manner that part of the covering layer 11d in a circumferential direction is removed such that the external conductor 11c is exposed, and a conductive member 21 filling the removed portion 11e. The ground member 15 is conductively connected with the conductive member 21 filling the removed portion 11e.

Abstract: Provided is a coaxial cable configured so that adhesion between an insulating layer and a shield layer can be improved without addition of an adhesive component and roughening of an adhesive surface. The coaxial cable includes a center conductor, the insulating layer covering the outer periphery of the center conductor, the shield layer covering the outer periphery of the insulating layer, and a sheath covering the outer periphery of the shield layer. An anchor layer containing resin whose glass-transition point is equal to or lower than 15° C. is provided between the insulating layer and the shield layer.

Abstract: Soldering is performed with a high yield ratio even when extremely-thin wires are joined at an extremely-narrow pitch. Moreover, a bridge between conductive joint portions is reduced. A core wire 41 is placed on a preliminarily-soldered conductive joint portion 2. Then, the conductive joint portions 2 and the core wires 41 are covered with an optically-transparent sheet 30. Thus, the state in which the core wire 41 is placed on the conductive joint portion 2 is held. In this state, the optically-transparent sheet 30 is irradiated with light. A preliminary solder 3 is heated and melted to join the core wire 41 and the conductive joint portion 2 together.

Abstract: Soldering is performed with a high yield ratio even when extremely-thin wires are joined at an extremely-narrow pitch. Moreover, a bridge between conductive joint portions is reduced. A core wire 41 is placed on a preliminarily-soldered conductive joint portion 2. Then, the conductive joint portions 2 and the core wires 41 are covered with an optically-transparent sheet 30. Thus, the state in which the core wire 41 is placed on the conductive joint portion 2 is held. In this state, the optically-transparent sheet 30 is irradiated with light. A preliminary solder 3 is heated and melted to join the core wire 41 and the conductive joint portion 2 together.

Abstract: A core wire of a coaxial cable is easily placed and soldered onto a conductive joint portion. Conductive joint portions 2 are formed at a predetermined interval on a substrate 1. A solder resist portion 5 is formed on each side of the conductive joint portion 2. A core wire 41 of a coaxial cable 4 is housed between two of the solder resist portions 5. A core wire 41 is placed on an upper surface 2a of the conductive joint portion 2. In this state, the core wire 41 is, by solder 3, connected to the upper surface 2a of the conductive joint portion 2.

Abstract: A core wire of a coaxial cable is easily placed and soldered onto a conductive joint portion. Conductive joint portions 2 are formed at a predetermined interval on a substrate 1. A solder resist portion 5 is formed on each side of the conductive joint portion 2. A core wire 41 of a coaxial cable 4 is housed between two of the solder resist portions 5. A core wire 41 is placed on an upper surface 2a of the conductive joint portion 2. In this state, the core wire 41 is, by solder 3, connected to the upper surface 2a of the conductive joint portion 2.

Abstract: A document editor for editing and displaying elements of a graphic with a logic structure which have an inclusive, side-by-side, or connective relationship mutually. The document editor comprises an editing unit for editing any element of said logic structure and reflecting the result of editing on other elements, an output unit for externally displaying the result of reflective editing, if necessary, and a control unit for designating display or non-display of the result of reflective editing for each element of said logic structure, and controlling the output unit in terms of display or non-display of the result of reflective editing according to the designation. By the constitution, during document editing and display, stepwise display of details can be controlled according to a logic structure, and any element can be edited in a selected display stage. Eventually, the constitution contributes to a reduction in the quantity of display information and a display time interval.