Abstract: A capillary has a face surface 13 formed at the tip end thereof so that the face surface 13 inclines toward the center thereof so as to have a tapered shape, and has a through hole 11 formed therethrough so as to permit wire to be placed therethrough so that the through hole 11 has an opening 12 at the center of the face surface 13. The inclination angle ? of the face surface 13 relative to the plane perpendicular to the axis of the capillary and including the opening 12 of the through hole 11 is in the range from 4° to 15°, and the height h of the face surface 13 along the axis of the capillary is equal to or greater than the thickness of the wire 2.

Abstract: A capillary has a face surface 13 formed at the tip end thereof so that the face surface 13 inclines toward the center thereof so as to have a tapered shape, and has a through hole 11 formed therethrough so as to permit wire to be placed therethrough so that the through hole 11 has an opening 12 at the center of the face surface 13. The inclination angle &thgr; of the face surface 13 relative to the plane perpendicular to the axis of the capillary and including the opening 12 of the through hole 11 is in the range from 4° to 15°, and the height h of the face surface 13 along the axis of the capillary is equal to or greater than the thickness of the wire 2.

Abstract: Wire-bonding between first and second bonding parts of an electronic component is done by first using a capillary tool to press downward to thereby bond a first end of a metallic wire to the first bonding part and to bend the metallic wire towards the second bonding part and then by using a bonding tool having a sloped lower surface to bond the other end downward towards and onto the second bonding part. The sloped lower surface of the bonding tool is wide enough and extends at least to a center part of the metallic wire and is sloping diagonally upwards towards the first bonding part. The sloped surface may have two sections having different slope angles.