Patents by Inventor Yoshihiko Watanabe

Yoshihiko Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080256781
    Abstract: The present invention provides a joining method of metal plates, which can connect two metal plates without a projection in a surface of the metal plates and a gap, and a joined unit having metal plates which are connected without a projection in a surface of the metal plates and a gap between the metal plates. The joined unit has a pair of metal plates. One of the metal plates has a hole, and another metal plate has a projection having a height less than a thickness of the one of the metal plates. The projection passes through the hole, the one of the metal plates is placed on the other of the metal plates each other, and a central part of an end surface of the projection is crushed in the hole. Thereby, the metal plates are joined to each other, and the joined unit can be provided.
    Type: Application
    Filed: April 16, 2008
    Publication date: October 23, 2008
    Applicant: Yazaki Corporation
    Inventors: Kazuhiro Murakami, Yoshihiko Watanabe, Kazuhide Takahashi, Kimitoshi Makino
  • Publication number: 20070062643
    Abstract: A method of separating an adhesive-bonded body is provided, by which a pair of pieces bonded together by using an adhesive can be easily securely separated from each other, wherein the adhesive has excellent adhesive force without being influenced by environmental temperature, excellent storage stability and wide scope of selection of the piece to be bonded. An adhesive-bonded body 1 includes a pair of pieces 2 bonded together and an adhesive layer 4. The adhesive layer 4 bonds the pair of pieces 2 to each other. Ultrasonic vibration is applied to the adhesive-bonded body 1 which is put between a tool horn 6 and an anvil 7 of an ultrasonic vibration applying device 3. The ultrasonic vibration is generated by applying a voltage to a piezoelectric vibrator 5 and vibrates the tool horn 6. The tool horn 6 vibrates ultrasonically together with one piece 2. The pair of the pieces 2 bonded together shifts relatively each other due to the ultrasonic vibration.
    Type: Application
    Filed: September 9, 2004
    Publication date: March 22, 2007
    Inventors: Yoshihiko Watanabe, Takashi Uematsu, Yuichiro Yamamura, Mikotoshi Suematsu, Shinishi Yamaguchi, Masanori Matsuda
  • Patent number: 7154616
    Abstract: In case a file is prepared by executing an application, the fee for the use of the application is charged according to whether such file is subjected to an output process. Thus the user of the application need not pay the fee for the use of the application for the mere preparation of the file by using the application.
    Type: Grant
    Filed: April 24, 2001
    Date of Patent: December 26, 2006
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yoshihiko Watanabe, Jiro Kojima, Masayuki Yoshida, Tsuneaki Kurumida, Tsutomu Negishi, Yuichiro Yamasawa, Yoshio Kimura, Yoshiji Kanamoto
  • Patent number: 6996293
    Abstract: In an electric filing apparatus, a document is read, and the read document is divided into blocks by a predetermined dividing number. Further, the divided block is divided into a partial image or partial character train, and a partial image or partial character train is extracted from a predetermined position every block. The extracted partial images or partial character trains are combined, thereby forming a reduced image smaller than an original image or character train. When selecting a document registered by the user, a list of the reduced images is displayed.
    Type: Grant
    Filed: June 14, 2000
    Date of Patent: February 7, 2006
    Assignee: Canon Kabushiki Kaisha
    Inventor: Yoshihiko Watanabe
  • Patent number: 6897415
    Abstract: A workpiece stage of a resist curing device is devised in which a workpiece on which a resist has been applied is held on a workpiece stage by vacuum suction, in which the workpiece is irradiated with UV radiation with a simultaneous temperature increase, in which it is cooled after UV radiation and by which the resist is cured, the workpiece stage having heating and cooling arrangements, major warping of the carrier is avoided and reliable holding of the workpiece on the carrier surface by vacuum suction obtained by the carrier being made of an aluminum alloy or a copper alloy which meets the following condition: ?/?y3.1 ? labeling the thermal stress which is determined using the following formula: where E is Young's modulus (N/mm2) at 200° C., ? is the coefficient of linear expansion (1/° C.) at 200° C. and ?T is a temperature difference (° C.) of 120° C., and ?y is the fracture point at 200° C.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: May 24, 2005
    Assignee: Ushiodenki Kabushiki Kaisha
    Inventors: Yoshinori Fujiwara, Yasuhiko Kenjo, Yoshihiko Watanabe
  • Patent number: 6858804
    Abstract: The cable-enrolling conductive thin-film sheet 1 consists of a conductive thin film 2 and an insulated cable 3. The conductive thin film 2 has a conductor layer 4 and first and second insulating layers 5, 6. The first insulating layer 5 is laminated on one face of the conductor layer 4, while the second insulating layer 6 is laminated on the other face of the conductor layer 4. The insulated cable 3 has an electrically conductive core wire 10 and an insulating sheath 11 covering the core wire 10. The insulated cable 3 laid on the first insulating layer 5 is partially welded to the sheet 2 by ultrasonic welding to obtain the cable-enrolling conductive thin-film sheet 1. The first insulating layer 5 is welded to be secured to the sheath 11, and the conductor layer 4 is mechanically connected to the core wire 10 by the ultrasonic welding.
    Type: Grant
    Filed: November 29, 2001
    Date of Patent: February 22, 2005
    Assignee: Yazaki Corporation
    Inventors: Kazuhiro Murakami, Yoshihiko Watanabe, Akira Baba
  • Patent number: 6806417
    Abstract: A conductor-equipped conductive thin film sheet 1 includes a conductive thin film sheet 2 and a metallic piece 8. The conductive thin film sheet 2 is composed of a conductive layer 4 and an insulating layer 7. The metallic piece 8 is superposed on the insulating layer 7 and is partially bonded to the conductive layer 4 by ultrasonic welding. In this configuration, when the sheet is wound around an electric wire, noise can be surely dissipated. A shield harness using the conductive thin film is also disclosed.
    Type: Grant
    Filed: May 16, 2002
    Date of Patent: October 19, 2004
    Assignee: Yazaki Corporation
    Inventors: Kazuhiro Murakami, Yoshihiko Watanabe, Akira Baba, Tomohiro Ikeda, Satoshi Saito
  • Patent number: 6655530
    Abstract: The household waste treatment requires neither incineration nor disposal in landfills. Two processing sub-systems, first one for combustibles and the other or second one for incombustibles, cooperate with each other as a single system for recycling the waste. The first sub-system deals with combustible waste to yields products for fertilizing and/or conditioning soil. In the process, what are inappropriate to the production of the soil fertilizing and/or conditioning products are sent to the second sub-system, which deals with incombustible waste. This sub-system sorts the incombustible waste materials into various kinds of recyclable products. Combustibles among the incombustible waste materials are sent to the first sub-system.
    Type: Grant
    Filed: June 27, 2001
    Date of Patent: December 2, 2003
    Assignee: NEC Corporation
    Inventors: Koichi Nakamura, Yoshihiko Watanabe, Kazufumi Watabe
  • Patent number: 6527161
    Abstract: The object is to provide a method of connecting covered wires mutually which can solve increasing cost. Each of the covered wires 2, 3 is comprised of a conductor 4, 10 and a cover 5, 11. The covered wires 2, 3 are connected to each other by ultrasonic welding. An ultrasonic welding machine includes a chip and an anvil. The covered wires 2, 3 are placed between the chip and the anvil. The chip is located with the length of its cross section disposed along the length of the other covered wire 3. The chip and the anvil are pushed toward each other and the chip is vibrated. Friction heat is generated between the covered wires 2, 3. The covers 5, 11 are adhered together and the conductors 4, 10 are bonded to each other by ultrasonic welding.
    Type: Grant
    Filed: August 6, 2001
    Date of Patent: March 4, 2003
    Assignee: Yazaki Corporation
    Inventors: Kazuhiro Murakami, Kenichi Hanazaki, Yoshihiko Watanabe, Hiroyuki Murakoshi
  • Publication number: 20030017713
    Abstract: A workpiece stage of a resist curing device is devised in which a workpiece on which a resist has been applied is held on a workpiece stage by vacuum suction, in which the workpiece is irradiated with UV radiation with a simultaneous temperature increase, in which it is cooled after UV radiation and by which the resist is cured, the workpiece stage having heating and cooling arrangements, major warping of the carrier is avoided and reliable holding of the workpiece on the carrier surface by vacuum suction obtained by the carrier being made of an aluminum alloy or a copper alloy which meets the following condition:
    Type: Application
    Filed: June 27, 2002
    Publication date: January 23, 2003
    Applicant: Ushiodenki Kabushiki Kaisha
    Inventors: Yoshinori Fujiwara, Yasuhiko Kenjo, Yoshihiko Watanabe
  • Publication number: 20020170729
    Abstract: A conductor-equipped conductive thin film sheet 1 includes a conductive thin film sheet 2 and a metallic piece 8. The conductive thin film sheet 2 is composed of a conductive layer 4 and an insulating layer 7. The metallic piece 8 is superposed on the insulating layer 7 and is partially bonded to the conductive layer 4 by ultrasonic welding. In this configuration, when the sheet is wound around an electric wire, noise can be surely dissipated. A shield harness using the conductive thin film is also disclosed.
    Type: Application
    Filed: May 16, 2002
    Publication date: November 21, 2002
    Applicant: Yazaki Corporation
    Inventors: Kazuhiro Murakami, Yoshihiko Watanabe, Akira Baba, Tomohiro Ikeda, Satoshi Saito
  • Patent number: 6438449
    Abstract: To provide a substrate transport device and a transport teaching system which can automatically perform a teaching processing in order to reduce the burden of an operator and to eliminate a positional shift accurately and efficiently in a short time. Optical connectors 251, 252, 253 and 254 of a jig 200 and optical connectors 256, 257, 258 and 259 fixedly provided on a substrate transport device are opposed to each other and optical axes are coincident with each other. A lens having a high condensation ratio is provided in each optical connector. A light signal is output from optical sensor heads 231 and 241 through an optical fiber F2, each optical connector and an optical fiber F1, and a light signal input to optical sensor heads 232 and 242 is guided into the substrate transport device. Then, an arm 31b is automatically moved in a three-axis direction. Thus, an edge position of a detected portion 122 is detected to acquire positional information so that teaching information is obtained.
    Type: Grant
    Filed: November 29, 2000
    Date of Patent: August 20, 2002
    Assignees: Dainippon Screen Mfg. Co., Ltd., Kawasaki Jukogyo Kabushiki Kaisha
    Inventors: Yasuo Kawamatsu, Yoshihiko Watanabe, Yasuhiko Hashimoto
  • Publication number: 20020096358
    Abstract: The cable-enrolling conductive thin-film sheet 1 consists of a conductive thin film 2 and an insulated cable 3. The conductive thin film 2 has a conductor layer 4 and first and second insulating layers 5, 6. The first insulating layer 5 is laminated on one face of the conductor layer 4, while the second insulating layer 6 is laminated on the other face of the conductor layer 4. The insulated cable 3 has an electrically conductive core wire 10 and an insulating sheath 11 covering the core wire 10. The insulated cable 3 laid on the first insulating layer 5 is partially welded to the sheet 2 by ultrasonic welding to obtain the cable-enrolling conductive thin-film sheet 1. The first insulating layer 5 is welded to be secured to the sheath 11, and the conductor layer 4 is mechanically connected to the core wire 10 by the ultrasonic welding.
    Type: Application
    Filed: November 29, 2001
    Publication date: July 25, 2002
    Applicant: Yazaki Corporation, Tokyo, Japan
    Inventors: Kazuhiro Murakami, Yoshihiko Watanabe, Akira Baba
  • Publication number: 20020051164
    Abstract: In case a file is prepared by executing an application, the fee for the use of the application is charged according to whether such file is subjected to an output process. Thus the user of the application need not pay the fee for the use of the application for the mere preparation of the file by using the application.
    Type: Application
    Filed: April 24, 2001
    Publication date: May 2, 2002
    Inventors: Yoshihiko Watanabe, Jiro Kojima, Masayuki Yoshida, Tsuneaki Kurumida, Tsutomu Negishi, Yuichiro Yamasawa, Yoshio Kimura, Yoshiji Kanamoto
  • Publication number: 20020017550
    Abstract: The object is to provide a method of connecting covered wires mutually which can solve cost increasing.
    Type: Application
    Filed: August 6, 2001
    Publication date: February 14, 2002
    Applicant: Yazaki Corporation
    Inventors: Kazuhiro Murakami, Kenichi Hanazaki, Yoshihiko Watanabe, Hiroyuki Murakoshi
  • Patent number: 6344864
    Abstract: A plurality of windows are displayed on a display screen, and a file within one of the plurality of windows is specified by an input section. The one window having the specified file is displayed on the display screen in such a way that the size of the one window is reduced. When a window of a transfer destination is specified by the input section, the window of a transfer source is displayed as a window having the original size.
    Type: Grant
    Filed: July 20, 1998
    Date of Patent: February 5, 2002
    Assignee: Canon Kabushiki Kaisha
    Inventor: Yoshihiko Watanabe
  • Publication number: 20010049951
    Abstract: The household waste treatment requires neither incineration nor disposal in landfills. Two processing sub-systems, first one for combustibles and the other or second one for incombustibles, cooperate with each other as a single system for recycling the waste. The first sub-system deals with combustible waste to yields products for fertilizing and/or conditioning soil. In the process, what are inappropriate to the production of the soil fertilizing and/or conditioning products are sent to the second sub-system, which deals with incombustible waste. This sub-system sorts the incombustible waste materials into various kinds of recyclable products. Combustibles among the incombustible waste materials are sent to the first sub-system.
    Type: Application
    Filed: June 27, 2001
    Publication date: December 13, 2001
    Inventors: Koichi Nakamura, Yoshihiko Watanabe, Kazufumi Watabe
  • Patent number: 6279748
    Abstract: The household waste treatment requires neither incineration nor disposal in landfills. Two processing sub-systems, first one for combustibles and the other or second one for incombustibles, cooperate with each other as a single system for recycling the waste. The first sub-system deals with combustible waste to yield products for fertilizing and/or conditioning soil. In the process, what are inappropriate to the production of the soil fertilizing and/or conditioning products are sent to the second sub-system, which deals with incombustible waste. This sub-system sorts the incombustible waste materials into various kinds of recyclable products. Combustibles among the incombustible waste materials are sent to the first sub-system.
    Type: Grant
    Filed: February 17, 1999
    Date of Patent: August 28, 2001
    Assignee: NEC Corporation
    Inventors: Koichi Nakamura, Yoshihiko Watanabe, Kazufumi Watabe
  • Publication number: 20010002447
    Abstract: To provide a substrate transport device and a transport teaching system which can automatically perform a teaching processing in order to reduce the burden of an operator and to eliminate a positional shift accurately and efficiently in a short time. Optical connectors 251, 252, 253 and 254 of a jig 200 and optical connectors 256, 257, 258 and 259 fixedly provided on a substrate transport device are opposed to each other and optical axes are coincident with each other. A lens having a high condensation ratio is provided in each optical connector. A light signal is output from optical sensor heads 231 and 241 through an optical fiber F2, each optical connector and an optical fiber F1, and a light signal input to optical sensor heads 232 and 242 is guided into the substrate transport device. Then, an arm 31b is automatically moved in a three-axis direction. Thus, an edge position of a detected portion 122 is detected to acquire positional information so that teaching information is obtained.
    Type: Application
    Filed: November 29, 2000
    Publication date: May 31, 2001
    Applicant: Dainippon Screen Mfg. Co., Ltd.
    Inventors: Yasuo Kawamatsu, Yoshihiko Watanabe, Yasuhiko Hashimoto
  • Patent number: 5883158
    Abstract: A process for producing an improved super absorbent polymer is disclosed. The process comprises adding to a water-retained super absorbent polymer retaining 10 to 100 parts by weight of water per 100 parts by weight of the super absorbent polymer, (a) a polyfunctional compound having two or more reactive groups and selected from a hydrophilic polymer or a metallic compound in an amount of 0.005 to 5 parts by weight per 100 parts by weight of the super absorbent polymer, and (b) a crosslinking agent having two or more functional groups capable of reacting with the polyfunctional compound at a weight ratio of the polyfunctional compound to the crosslinking agent of 0.1 to 30; mixing; and allowing the mixture to react by heating.
    Type: Grant
    Filed: October 30, 1996
    Date of Patent: March 16, 1999
    Assignee: Kao Corporation
    Inventors: Hiromi Nambu, Akira Umada, Yoshihiko Watanabe, Tadashi Igarashi, Takayuki Amiya